Patents by Inventor Ronny Soetarman
Ronny Soetarman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20180005364Abstract: A dual mode inspector includes an optical inspector configured to detect a defect located at a first location on a sample, a microscope configured to capture an image of the defect at the first location on the sample, and a platform that is configured to support the sample. The sample is not removed from the platform between the detecting of the defect located at the first location on the sample and the capturing of the image of the defect at the first location on the sample. The dual mode optical inspector also includes a controller that causes the optical inspector to detect the defect located at the first location on the sample and causes the microscope to capture the image of the defect at the first location on the sample. The dual mode inspector also performs scanning lens distortion correction to improve the capturing of defect images.Type: ApplicationFiled: July 1, 2016Publication date: January 4, 2018Inventors: Steven W. Meeks, Rusmin Kudinar, Ronny Soetarman, Hung P. Nguyen, James Jianguo Xu
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Publication number: 20170336331Abstract: An optical inspector includes a time varying beam reflector, a radiating source that irradiates the time varying beam reflector, a telecentric scan lens configured to direct the radiation reflected by the time varying beam reflector onto a first surface of a transparent sample, a first detector that receives at least a portion of top surface specular reflection, a second detector that receives at least a portion of the bottom surface specular reflection. A turning mirror may also be included. The turning mirror is a switchable mirror that can be adjusted to a first position where the turning mirror reflects the top and bottom surface specular reflection, and can be adjusted to a second position where the turning mirror does not reflect the top or the bottom surface specular reflection. A first and second polarizing element may also be included to detect additional types of defects on either surface.Type: ApplicationFiled: May 19, 2016Publication date: November 23, 2017Inventors: Steven W. Meeks, Rusmin Kudinar, Ronny Soetarman, Hung P. Nguyen
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Publication number: 20170336330Abstract: A method for detecting defects includes directing a scanning beam to a location on a surface of a transparent sample, measuring top and bottom surface specular reflection intensity, and storing coordinate values of the first location and the top and bottom surface specular reflection intensity in a memory. The method may further include comparing the top surface specular reflection intensity measured at each location with a first threshold value, comparing the bottom surface specular reflection intensity measured at each location with a second threshold value, and determining if a defect is present at each location and on which surface the defect is present. The method may further include comparing the top surface specular reflection intensity measured at each location with a first intensity range, comparing the bottom surface specular reflection intensity measured at each location with a second intensity range, and determining on which surface the defect is present.Type: ApplicationFiled: May 19, 2016Publication date: November 23, 2017Inventors: Steven W. Meeks, Rusmin Kudinar, Ronny Soetarman, Hung P. Nguyen
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Patent number: 9784691Abstract: A method and apparatus to measure specular reflection intensity, specular reflection angle, near specular scattered radiation, and large angle scattered radiation and determine the location and type of defect present in a first and a second transparent solid that have abutting surfaces. The types of defects include a top surface particle, an interface particle, a bottom surface particle, an interface bubble, a top surface pit, and a stain. The four measurements are conducted at multiple locations along the surface of the transparent solid and the measured information is stored in a memory device. The difference between an event peak and a local average of measurements for each type of measurement is used to detect changes in the measurements. Information stored in the memory device is processed to generate a work piece defect mapping indicating the type of defect and the defect location of each defect found.Type: GrantFiled: July 31, 2014Date of Patent: October 10, 2017Assignee: ZETA INSTRUMENTS, INC.Inventors: Steven W. Meeks, Ronny Soetarman
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Publication number: 20170261440Abstract: A method and apparatus to measure specular reflection intensity, specular reflection angle, near specular scattered radiation, and large angle scattered radiation and determine the location and type of defect present in a first and a second transparent solid that have abutting surfaces. The types of defects include a top surface particle, an interface particle, a bottom surface particle, an interface bubble, a top surface pit, and a stain. The four measurements are conducted at multiple locations along the surface of the transparent solid and the measured information is stored in a memory device. The difference between an event peak and a local average of measurements for each type of measurement is used to detect changes in the measurements. Information stored in the memory device is processed to generate a work piece defect mapping indicating the type of defect and the defect location of each defect found.Type: ApplicationFiled: May 29, 2017Publication date: September 14, 2017Inventors: Steven W. Meeks, Ronny Soetarman
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Publication number: 20160252714Abstract: A three-dimensional (3D) microscope for patterned substrate measurement can include an objective lens, a reflected illuminator, a transmitted illuminator, a focusing adjustment device, an optical sensor, and a processor. The focusing adjustment device can automatically adjust the objective lens focus at a plurality of Z steps. The optical sensor can be capable of acquiring images at each of these Z steps. The processor can control the reflected illuminator, the transmitted illuminator, the focusing adjustment device, and the optical sensor. The processor can be configured to capture first and second images at multiple Z steps, the first image with the pattern using the reflected illuminator and the second image without the pattern using one of the reflected illuminator and the transmitted illuminator.Type: ApplicationFiled: May 9, 2016Publication date: September 1, 2016Inventors: Zhen Hou, James Jianguo Xu, Ken Kinsun Lee, James Nelson Stainton, Hung Phi Nguyen, Rusmin Kudinar, Ronny Soetarman
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Publication number: 20160253813Abstract: A three-dimensional (3D) microscope for patterned substrate measurement can include an objective lens, a reflected illuminator, a transmitted illuminator, a focusing adjustment device, an optical sensor, and a processor. The focusing adjustment device can automatically adjust the objective lens focus at a plurality of Z steps. The optical sensor can be capable of acquiring images at each of these Z steps. The processor can control the reflected illuminator, the transmitted illuminator, the focusing adjustment device, and the optical sensor. The processor can be configured to capture first and second images at multiple Z steps, the first image with the pattern using the reflected illuminator and the second image without the pattern using one of the reflected illuminator and the transmitted illuminator.Type: ApplicationFiled: May 9, 2016Publication date: September 1, 2016Inventors: Zhen Hou, James Jianguo Xu, Ken Kinsun Lee, James Nelson Stainton, Hung Phi Nguyen, Rusmin Kudinar, Ronny Soetarman
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Patent number: 9389408Abstract: A three-dimensional (3D) microscope for patterned substrate measurement can include an objective lens, a reflected illuminator, a transmitted illuminator, a focusing adjustment device, an optical sensor, and a processor. The focusing adjustment device can automatically adjust the objective lens focus at a plurality of Z steps. The optical sensor can be capable of acquiring images at each of these Z steps. The processor can control the reflected illuminator, the transmitted illuminator, the focusing adjustment device, and the optical sensor. The processor can be configured to capture first and second images at multiple Z steps, the first image with the pattern using the reflected illuminator and the second image without the pattern using one of the reflected illuminator and the transmitted illuminator.Type: GrantFiled: June 29, 2011Date of Patent: July 12, 2016Assignee: Zeta Instruments, Inc.Inventors: Zhen Hou, James Jianguo Xu, Ken Kinsun Lee, James Nelson Stainton, Hung Phi Nguyen, Rusmin Kudinar, Ronny Soetarman
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Publication number: 20160033421Abstract: A method and apparatus to measure specular reflection intensity, specular reflection angle, near specular scattered radiation, and large angle scattered radiation and determine the location and type of defect present in a first and a second transparent solid that have abutting surfaces. The types of defects include a top surface particle, an interface particle, a bottom surface particle, an interface bubble, a top surface pit, and a stain. The four measurements are conducted at multiple locations along the surface of the transparent solid and the measured information is stored in a memory device. The difference between an event peak and a local average of measurements for each type of measurement is used to detect changes in the measurements. Information stored in the memory device is processed to generate a work piece defect mapping indicating the type of defect and the defect location of each defect found.Type: ApplicationFiled: July 31, 2014Publication date: February 4, 2016Applicant: Zeta Instruments, Inc.Inventors: Steven W. Meeks, Ronny Soetarman
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Patent number: 9036869Abstract: A method of detecting multi-surfaces of an object includes providing an imaging system capable of detecting surfaces of the object. After system parameters are set up, two-dimensional images of the object at multiple Z steps can be acquired. Each surface of the object can then be extracted using two steps. In a first step, the surface can be constructed based on a confidence threshold. In a second step, the surface can be enhanced using an interpolation filter.Type: GrantFiled: August 29, 2011Date of Patent: May 19, 2015Assignee: Zeta Instruments, Inc.Inventors: Ken Kinsun Lee, Ronny Soetarman, Zhen Hou, James Jianguo Xu, Rusmin Kudinar, Vamsi Mohan Velidandla, Ben Garland
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Patent number: 8976366Abstract: A measurement system for monitoring an LED chip surface roughening process is described. A reflective illuminator can run reflectance measurements. A vertical positioning means can adjust a distance between an objective lens and an industrial sample. A horizontal positioning means can move objects in XY plane, and is specifically configured to hold the industrial sample and a reference sample. An optical sensor can acquire images of the industrial sample. A spectrometer can acquire reflectance spectrums of the industrial sample and the reference sample. A processor can control these components. The processor can perform deskew, and calculate an average reflectance and an oscillation amplitude from the reflectance spectrums of the industrial sample.Type: GrantFiled: June 12, 2012Date of Patent: March 10, 2015Assignee: Zeta Instruments, Inc.Inventors: James Jianguo Xu, Ken Kinsun Lee, Rusmin Kudinar, Ronny Soetarman, Hung Phi Nguyen, Zhen Hou
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Publication number: 20120327414Abstract: A measurement system for monitoring an LED chip surface roughening process is described. A reflective illuminator can run reflectance measurements. A vertical positioning means can adjust a distance between an objective lens and an industrial sample. A horizontal positioning means can move objects in XY plane, and is specifically configured to hold the industrial sample and a reference sample. An optical sensor can acquire images of the industrial sample. A spectrometer can acquire reflectance spectrums of the industrial sample and the reference sample. A processor can control these components. The processor can perform deskew, and calculate an average reflectance and an oscillation amplitude from the reflectance spectrums of the industrial sample.Type: ApplicationFiled: June 12, 2012Publication date: December 27, 2012Applicant: Zeta Instruments, Inc.Inventors: James Jianguo Xu, Ken Kinsun Lee, Rusmin Kudinar, Ronny Soetarman, Hung Phi Nguyen, Zhen Hou
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Publication number: 20120176475Abstract: A three-dimensional (3D) microscope includes various insertable components that facilitate multiple imaging and measurement capabilities. These capabilities include Nomarski imaging, polarized light imaging, quantitative differential interference contrast (q-DIC) imaging, motorized polarized light imaging, phase-shifting interferometry (PSI), and vertical-scanning interferometry (VSI).Type: ApplicationFiled: December 21, 2011Publication date: July 12, 2012Applicant: Zeta Instruments, Inc.Inventors: James Jianguo Xu, Ken Kinsun Lee, Rusmin Kudinar, Ronny Soetarman, Hung Phi Nguyen, Zhen Hou
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Publication number: 20120051660Abstract: A method of detecting multi-surfaces of an object includes providing an imaging system capable of detecting surfaces of the object. After system parameters are set up, two-dimensional images of the object at multiple Z steps can be acquired. Each surface of the object can then be extracted using two steps. In a first step, the surface can be constructed based on a confidence threshold. In a second step, the surface can be enhanced using an interpolation filter.Type: ApplicationFiled: August 29, 2011Publication date: March 1, 2012Applicant: Zeta Instruments, Inc.Inventors: Ken Kinsun Lee, Ronny Soetarman, Zhen Hou, James Jianguo Xu, Rusmin Kudinar, Vamsi Mohan Velidandia, Ben Garland
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Publication number: 20120019626Abstract: A three-dimensional (3D) microscope for patterned substrate measurement can include an objective lens, a reflected illuminator, a transmitted illuminator, a focusing adjustment device, an optical sensor, and a processor. The focusing adjustment device can automatically adjust the objective lens focus at a plurality of Z steps. The optical sensor can be capable of acquiring images at each of these Z steps. The processor can control the reflected illuminator, the transmitted illuminator, the focusing adjustment device, and the optical sensor. The processor can be configured to capture first and second images at multiple Z steps, the first image with the pattern using the reflected illuminator and the second image without the pattern using one of the reflected illuminator and the transmitted illuminator.Type: ApplicationFiled: June 29, 2011Publication date: January 26, 2012Applicant: Zeta Instruments, Inc.Inventors: Zhen Hou, James Jianguo Xu, Ken Kinsun Lee, James Nelson Stainton, Hung Phi Nguyen, Rusmin Kudinar, Ronny Soetarman
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Patent number: 7630086Abstract: A method comprises generating a data set comprising first surface roughness data from a first orientation and second surface roughness data from a second orientation and determining a roughness bias parameter from the first surface roughness data and the second surface roughness data.Type: GrantFiled: January 16, 2007Date of Patent: December 8, 2009Assignee: KLA-Tencor CorporationInventors: Dave S. Oak, Tri Do, Ronny Soetarman, Steven W. Meeks, Vamsi Velidandla
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Patent number: 7532318Abstract: In one embodiment, a system to measure defects on a surface of a wafer and an edge of the wafer using a single tool comprises a radial motor to move an optical head in a radial direction to detect defects at locations displaced from the edge of the wafer, and a rotational motor to rotate the optical head around the edge of the wafer to detect defects on the edge of the wafer.Type: GrantFiled: November 16, 2006Date of Patent: May 12, 2009Assignee: KLA-Tencor CorporationInventors: Steven W. Meeks, Rusmin Kudinar, William R. Wheeler, Hung Phi Nguyen, Vamsi Velidandla, Anoop Somanchi, Ronny Soetarman
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Patent number: 7397621Abstract: In one embodiment, a surface analyzer system comprises a radiation targeting assembly to target radiation onto a surface, a reflected radiation collecting assembly that collects radiation reflected from the surface, and a signal processing module. The signal processing module generates an image of magnetic characteristics of the magnetic disk, wherein the image comprises a plurality of servo sector arcs, locates a sample of points on a plurality of the servo sector arcs, fits a circle to the sample of points on each of the plurality of servo sector arcs, and determines at least one pivot-to-gap measurement from the radius of the circles.Type: GrantFiled: May 11, 2006Date of Patent: July 8, 2008Assignee: KLA-Tencor Technologies CorporationInventors: Zhen Hou, Ronny Soetarman, Vamsi Velidandla, Steven W. Meeks
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Publication number: 20070127016Abstract: In one embodiment, a system to measure defects on a surface of a wafer and an edge of the wafer using a single tool comprises a radial motor to move an optical head in a radial direction to detect defects at locations displaced from the edge of the wafer, and a rotational motor to rotate the optical head around the edge of the wafer to detect defects on the edge of the wafer.Type: ApplicationFiled: November 16, 2006Publication date: June 7, 2007Inventors: Steven Meeks, Rusmin Kudinar, William Wheeler, Hung Nguyen, Vamsi Velidandla, Anoop Somanchi, Ronny Soetarman
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Publication number: 20070115483Abstract: A method comprises generating a data set comprising first surface roughness data from a first orientation and second surface roughness data from a second orientation and determining a roughness bias parameter from the first surface roughness data and the second surface roughness data.Type: ApplicationFiled: January 16, 2007Publication date: May 24, 2007Inventors: Dave Oak, Tri Do, Ronny Soetarman, Steven Meeks, Vamsi Velidandla