Patents by Inventor Ronny Van't Oever
Ronny Van't Oever has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10493454Abstract: The invention relates to a device (20), comprising: a liquid container (21) for containing a liquid; a capillary-stop valve (22) that is in medium through flow connection with said liquid container (21) for stopping said liquid in said container from flowing out of said container via said capillary-stop valve (22); a first electrode (7) being arranged such that in use said first electrode is in contact with said liquid in said liquid container; a second electrode (2) that is spaced apart from said capillary-stop valve by an electrically insulating medium gap (24), and a voltage source (V) connected to said first and second electrode which is activatable for applying an electric potential difference at the first and second electrode such that the liquid in the liquid container is attracted in the direction of said second electrode so as to allow the liquid to overcome the stopping effect of the capillary-stop valve for discharging liquid from said liquid container via said capillary-stop valve.Type: GrantFiled: September 25, 2013Date of Patent: December 3, 2019Assignee: Micronit Microtechnologies B.V.Inventors: Elwin Xander Vrouwe, Manjeet Dhindsa, Marinus Bernardus Olde Riekerink, Ronny Van't Oever, Marko Theodoor Blom
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Patent number: 9748136Abstract: A method for forming an electrically conductive via in a substrate that includes the steps of: forming a through hole in a first substrate; bringing a first surface of a second substrate into contact with the first surface of the first substrate, such that the through hole in the first substrate is covered by the first surface of the second substrate; filling the through hole in the first substrate with an electrically conductive material by electroplating to form the electrically conductive via, and removing the second substrate, wherein the first surface of the first and the second substrate each have a surface roughness Ra of less than 2 nm, preferably less than 1 nm, more preferably less than 0.5 nm, and the first surface of the first and the second substrate are brought in direct contact with each other, such that a direct bond is formed there between.Type: GrantFiled: November 5, 2013Date of Patent: August 29, 2017Assignee: Micronit Microfluidics B.V.Inventors: Ronny Van 'T Oever, Marko Theodoor Blom, Jeroen Haneveld, Johannes Oonk, Peter Tijssen
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Publication number: 20170183223Abstract: The invention relates to method for bonding at least two substrates, for example made from glass, silicon, ceramic, aluminum, or boron, by using an intermediate thin film metal layer for providing the bonding, said method comprising the following steps of: a) providing said two substrates; b) depositing said thin film metal layer on at least a part of a surface of a first substrate of the two substrates; c) bringing a surface of the second substrate into contact with said thin film metal layer on said surface of the first substrate such that a bonding between the second substrate and the thin film metal layer on the first substrate is provided; and d) at least locally strengthening the bonding between the second substrate and the thin film metal layer on the first substrate. The invention also relates to a device comprising two substrates, for example made from glass, silicon, ceramic, aluminum, or boron, and an intermediate thin film metal layer.Type: ApplicationFiled: January 10, 2017Publication date: June 29, 2017Inventors: Ronny VAN 'T OEVER, Marko Theodoor BLOM, Jeroen HANEVELD, Johannes OONK, Marinus Bernardus OLDE RIEKERINK, Peter TIJSSEN, Hendrik Jan Hildebrand TIGELAAR, Jean-Noël FEHR, Jean-Christophe ROULET, Amitava GUPTA
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Patent number: 9636673Abstract: The invention relates to a method for manufacturing microfluidic chips having at least one capillary for through-flow of a fluid, comprising the steps of: (a) providing a starting material; (b) forming at least one shared capillary in the starting material, said shared capillary comprising an fluidic inlet and an fluidic outlet; (c) functionalizing the chips by supplying a functionalization fluid to the shared capillary; and (d) dividing the starting material into separate chips. The invention further relates to a device for functionalizing microfluidic chips having at least one capillary for through-flow of a fluid, said device comprising a material holder for holding a starting material in a fixed position during functionalization, said material holder comprising at least one inlet connector for connecting at least one shared capillary formed in the starting material to a functionalization fluid supply. The invention further relates to a microfluidic chip and a device for holding a microfluidic chip.Type: GrantFiled: March 1, 2013Date of Patent: May 2, 2017Assignee: Micronit Microfluidics B.V.Inventors: Marinus Bernardus Olde Riekerink, Wilfred Buesink, Arenda Hendrika Jacoba Koelewijn-Hubers, Marko Theodoor Blom, Ronny van 't Oever
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Patent number: 9573804Abstract: The invention relates to method for bonding at least two substrates, for example made from glass, silicon, ceramic, aluminum, or boron, by using an intermediate thin film metal layer for providing the bonding, said method comprising the following steps of: a) providing said two substrates; b) depositing said thin film metal layer on at least a part of a surface of a first substrate of the two substrates; c) bringing a surface of the second substrate into contact with said thin film metal layer on said surface of the first substrate such that a bonding between the second substrate and the thin film metal layer on the first substrate is provided; and d) at least locally strengthening the bonding between the second substrate and the thin film metal layer on the first substrate. The invention also relates to a device comprising two substrates, for example made from glass, silicon, ceramic, aluminum, or boron, and an intermediate thin film metal layer.Type: GrantFiled: December 21, 2012Date of Patent: February 21, 2017Assignee: Micronit Microfluidics B.V.Inventors: Ronny Van 'T Oever, Marko Theodoor Blom, Jeroen Haneveld, Johannes Oonk, Marinus Bernardus Olde Riekerink, Peter Tijssen, Hendrik Jan Hildebrand Tigelaar, Jean-Noël Fehr, Jean-Christophe Roulet, Amitava Gupta
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Publication number: 20160231163Abstract: The invention relates to a device for measuring a volume of a liquid, said device comprising:—a receptacle for receiving said liquid, said receptacle comprising an inlet opening and an outlet opening, and—a capillary channel having capillary action, which capillary channel has a predetermined internal transverse cross-section, wherein an inlet opening of the capillary channel at an first end thereof is in liquid through flow connection with the outlet opening of the receptacle and wherein the other, second end of the capillary channel comprises an opening; wherein:—the inlet opening of the receptacle has a larger transverse cross-section than the inlet opening of said capillary channel, and—a length of a liquid slug in the capillary channel is a measure for said volume.Type: ApplicationFiled: December 24, 2014Publication date: August 11, 2016Inventors: Ronny Van 't Oever, Marko Theodoor Blom, Adriaan Johannes Nutma, Herman Jacobus Blok
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Patent number: 9387475Abstract: An assembly comprising at least one microfluidic device and a mounting piece, this microfluidic device comprising at least one material layer and at least one first fluidic port, which first fluidic port it situated at least partially in an end surface of the material layer and which mounting piece comprises at least one fluidic component, wherein the mounting piece is coupled to the microfluidic device by means of first coupling means provided for this purpose such that the fluidic component is connected to the first fluidic port. The invention also relates to such a mounting piece.Type: GrantFiled: August 31, 2007Date of Patent: July 12, 2016Assignee: Micronit Microfluidics B.V.Inventors: Ronny Van't Oever, Marko Theodoor Blom
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Publication number: 20150262874Abstract: The invention relates to a method for forming an electrically conductive via in a substrate and such a substrate comprising an electrically conductive, said method comprising the steps, to be performed in suitable sequence, of: a) providing a first substrate as said substrate; b) forming a through hole in said first substrate; c) providing a second substrate; d) bringing a first surface of said second substrate into contact with said first surface of said first substrate, such that said through hole in said first substrate is covered by said first surface of said second substrate; e) filling said through hole in said first substrate with an electrically conductive material by means of electroplating for forming said electrically conductive via, and f) removing said second substrate, wherein said first surface of said first substrate and said first surface of said second substrate each have a surface roughness R a of less than 2 nm, preferably less than 1 nm, more preferably less than 0.Type: ApplicationFiled: November 5, 2013Publication date: September 17, 2015Inventors: Ronny Van'T Oever, Marko Theodoor Blom, Jeroen Haneveld, Johannes Oonk, Peter Tijssen
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Publication number: 20150238961Abstract: The invention relates to a device (20), comprising: a liquid container (21) for containing a liquid; a capillary-stop valve (22) that is in medium through flow connection with said liquid container (21) for stopping said liquid in said container from flowing out of said container via said capillary-stop valve (22); a first electrode (7) being arranged such that in use said first electrode is in contact with said liquid in said liquid container; a second electrode (2) that is spaced apart from said capillary-stop valve by an electrically insulating medium gap (24), and a voltage source (V) connected to said first and second electrode which is activatable for applying an electric potential difference at the first and second electrode such that the liquid in the liquid container is attracted in the direction of said second electrode so as to allow the liquid to overcome the stopping effect of the capillary-stop valve for discharging liquid from said liquid container via said capillary-stop valve.Type: ApplicationFiled: September 25, 2013Publication date: August 27, 2015Inventors: Elwin Xander Vrouwe, Manjeet Dhindsa, Marinus Bernardus Olde Riekerink, Ronny Van 'T Oever, Marko Theodoor Blom
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Publication number: 20140335301Abstract: The invention relates to method for bonding at least two substrates, for example made from glass, silicon, ceramic, aluminum, or boron, by using an intermediate thin film metal layer for providing the bonding, said method comprising the following steps of: a) providing said two substrates; b) depositing said thin film metal layer on at least a part of a surface of a first substrate of the two substrates; c) bringing a surface of the second substrate into contact with said thin film metal layer on said surface of the first substrate such that a bonding between the second substrate and the thin film metal layer on the first substrate is provided; and d) at least locally strengthening the bonding between the second substrate and the thin film metal layer on the first substrate. The invention also relates to a device comprising two substrates, for example made from glass, silicon, ceramic, aluminum, or boron, and an intermediate thin film metal layer.Type: ApplicationFiled: December 21, 2012Publication date: November 13, 2014Inventors: Ronny Van 'T Oever, Marko Theodoor Blom, Jeroen Haneveld, Johannes Oonk, Marinus Bernardus Olde Riekerink, Peter Tijssen, Hendrik Jan Hildebrand Tigelaar, Jean-Noël Fehr, Jean-Christophe Roulet, Amitava Gupta
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Publication number: 20140246801Abstract: The invention relates to a method for manufacturing microfluidic chips having at least one capillary for through-flow of a fluid, comprising the steps of: (a) providing a starting material; (b) forming at least one shared capillary in the starting material, said shared capillary comprising an fluidic inlet and an fluidic outlet; (c) functionalizing the chips by supplying a functionalization fluid to the shared capillary; and (d) dividing the starting material into separate chips. The invention further relates to a device for functionalizing microfluidic chips having at least one capillary for through-flow of a fluid, said device comprising a material holder for holding a starting material in a fixed position during functionalization, said material holder comprising at least one inlet connector for connecting at least one shared capillary formed in the starting material to a functionalization fluid supply. The invention further relates to a microfluidic chip and a device for holding a microfluidic chip.Type: ApplicationFiled: March 1, 2013Publication date: September 4, 2014Applicant: MICRONIT MICROFLUIDICS B.V.Inventors: Marinus Bernardus OLDE RIEKERINK, Wilfred BUESINK, Arenda Hendrika Jacoba KOELEWIJN-HUBERS, Marko Theodoor BLOM, Ronny VAN 'T OEVER
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Patent number: 8522413Abstract: A system for fluidic coupling and uncoupling of fluidic conduits and a microfluidic chip, wherein the fluidic conduits are connected mechanically to a first structural part and the microfluidic chip is carried by a second structural part. The structural parts are moved perpendicularly toward and away from each other by means of a mechanism provided for this purpose. Outer ends of the fluidic conduits can thus be moved over a determined distance substantially perpendicularly to the outer surface of the microfluidic chip and connecting openings in the outer surface of the microfluidic chip. This enables accurate realization of fluidic coupling and uncoupling without the occurrence of undesirable moments of force and with minimal risk of damage to the fluidic conduits or the connecting openings. With such system requirements which can be set in respect of convenience, speed, temperature resistance, sealing, chemical resistance, reproducibility and so forth, can be fulfilled.Type: GrantFiled: June 23, 2008Date of Patent: September 3, 2013Assignee: Micronit Microfluids B.V.Inventors: Ronny Van't Oever, Marko Theodoor Blom, Wilfred Buesink
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Patent number: 8343441Abstract: Aspects of the invention include methods and devices for manufacturing and testing microfluidic chips having at least one capillary for through-flow of a fluid.Type: GrantFiled: June 25, 2010Date of Patent: January 1, 2013Assignee: Micronit Microfluidics B.V.Inventors: Ronny van 't Oever, Marko Theodoor Blom
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Publication number: 20110000283Abstract: Aspects of the invention include methods and devices for manufacturing and testing microfluidic chips having at least one capillary for through-flow of a fluid.Type: ApplicationFiled: June 25, 2010Publication date: January 6, 2011Inventors: Ronny van 't Oever, Marko Theodoor Blom
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Publication number: 20100320748Abstract: A system for fluidic coupling and uncoupling of fluidic conduits and a microfluidic chip, wherein the fluidic conduits are connected mechanically to a first structural part and the microfluidic chip is carried by a second structural part. The structural parts are moved perpendicularly toward and away from each other by means of a mechanism provided for this purpose. Outer ends of the fluidic conduits can thus be moved over a determined distance substantially perpendicularly to the outer surface of the microfluidic chip and connecting openings in the outer surface of the microfluidic chip. This enables accurate realization of fluidic coupling and uncoupling without the occurrence of undesirable moments of force and with minimal risk of damage to the fluidic conduits or the connecting openings. With such system requirements which can be set in respect of convenience, speed, temperature resistance, sealing, chemical resistance, reproducibility and so forth, can be fulfilled.Type: ApplicationFiled: June 23, 2008Publication date: December 23, 2010Applicant: MICRONIT MICROFLUIDICS B.V.Inventors: Ronny Van't Oever, Marko Theodoor Blom, Wilfred Buesink
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Publication number: 20100288729Abstract: Methods for manufacturing a microstructure, wherein use is made of a powder blasting and/or etching and a single mask layer with openings and structures of varying dimensions, wherein the mask layer at least at one given point in time has been wholly worn away within at least one region by mask erosion while the microstructure is not yet wholly realized. Use can be made of a combination of ‘vertical’ erosion, i.e. parallel to the thickness direction and ‘horizontal’ erosion, i.e. perpendicularly of the thickness direction, of the mask layer. The horizontal mask erosion occurs at the edges of the mask structure.Type: ApplicationFiled: October 3, 2008Publication date: November 18, 2010Applicant: MICRONIT MICROFLUIDICS B.V.Inventors: Ronny Van'T Oever, Marko Theodoor Blom, Johannes Oonk
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Publication number: 20100239462Abstract: An assembly comprising at least one microfluidic device and a mounting piece, this microfluidic device comprising at least one material layer and at least one first fluidic port, which first fluidic port it situated at least partially in an end surface of the material layer and which mounting piece comprises at least one fluidic component, wherein the mounting piece is coupled to the microfluidic device by means of first coupling means provided for this purpose such that the fluidic component is connected to the first fluidic port. The invention also relates to such a mounting piece.Type: ApplicationFiled: August 31, 2007Publication date: September 23, 2010Applicant: MICRONIT MICROFLUIDICS B.V.Inventors: Ronny Van't Oever, Marko Theodoor Blom
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Patent number: 7256106Abstract: The present invention relates to a method for dividing a substrate into a number of individual chip parts, comprising the steps of: forming a number of chip parts in the substrate, comprising, for each chip part, of arranging recesses in the substrate for containing fluid; arranging one or more breaking grooves in the substrate along individual chip parts; applying mechanical force to the substrate to break the substrate along the breaking grooves. The invention also relates to a substrate as well as a chip part.Type: GrantFiled: December 19, 2002Date of Patent: August 14, 2007Assignee: Micronit Microfluidics B.V.Inventor: Ronny Van't Oever
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Publication number: 20050148158Abstract: The present invention relates to a method for dividing a substrate into a number of individual chip parts, comprising the steps of: forming a number of chip parts in the substrate, comprising, for each chip part, of arranging recesses in the substrate for containing fluid; arranging one or more breaking grooves in the substrate along individual chip parts; applying mechanical force to the substrate to break the substrate along the breaking grooves. The invention also relates to a substrate as well as a chip part.Type: ApplicationFiled: December 19, 2002Publication date: July 7, 2005Applicant: MICRONIT MICROFLUIDICS B.V.Inventor: Ronny Van't Oever
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Patent number: 6630990Abstract: Methods and apparatus are disclosed for determining the volume, hemoglobin concentration, maturity and cell shape of mammalian red blood cells in a whole blood sample and simultaneously monitoring system standardization. Methods for distinguishing red blood cells from other cellular particles, prior to the red blood cell analysis are also disclosed. Red blood cells are passed through a beam of light in single file at a selected wavelength, obtaining an initial cytogram by means of the resultant magnitude of one light loss signal and one forward angle light scatter signal at a selected angular interval and a third side angle light scatter or two forward angle light scatter signals at a selected angular intervals and a third side-angle light scatter signal, projecting the cytogram, point by point, onto a pre-calibrated 3-dimensional surface containing grid lines of volume and hemoglobin concentration and determining accurate values of cell volume and hemoglobin concentration.Type: GrantFiled: June 5, 2001Date of Patent: October 7, 2003Assignee: Abbott LaboratoriesInventors: Ronny van't Oever, Young Ran Kim, James C. Bearden, Jr., Marilou Z. Landayan