Abstract: An illumination device connected to a display screen having a front display surface and a rear installation surface parallel to each other includes a light source, a mounting plate, and a support mechanism. The light source emits light to form an illumination area defined by a first illumination boundary close to the front display surface and a second illumination boundary away from the front display surface. The mounting plate is detachably attached to the rear installation surface. The support mechanism is connected to the light source and the mounting plate respectively, for keeping the first illumination boundary parallel to the front display surface or inclined outwardly at a first inclined angle relative to the front display surface.

Abstract: An illumination device connected to a display screen having a front display surface and a rear installation surface parallel to each other includes a light source, a mounting plate, and a support mechanism. The light source emits light to form an illumination area defined by a first illumination boundary close to the front display surface and a second illumination boundary away from the front display surface. The mounting plate is detachably attached to the rear installation surface. The support mechanism is connected to the light source and the mounting plate respectively, for keeping the first illumination boundary parallel to the front display surface or inclined outwardly at a first inclined angle relative to the front display surface.

Abstract: An illumination device includes a first illumination unit, a second illumination unit and a driving mechanism. The first illumination unit has a first illumination direction and the second illumination unit has a second illumination direction. The first and second illumination units are pivotally connected to the driving mechanism. The driving mechanism is capable of driving the first and second illumination units to rotate with respect to the driving mechanism. The illumination device can be operated in a first state and a second state. When the illumination device is operated in the first state, the first illumination direction does not intersect the second illumination direction. When the illumination device is operated in the second state, the first illumination direction intersects the second illumination direction.

Abstract: A method for wafer level package (WLP) of sensor chips is provided, including the steps of: providing a wafer, the wafer including a plurality of die regions, each the die region on a first surface of the wafer comprising an active area and a pad surrounding the active area; bounding a transparent protective layer to the first surface of the wafer; forming a stress buffer on a second surface of the wafer; using etching or laser drill to form a via hole at the location between two neighboring die regions through the stress buffer and the wafer to expose the pad or a conductive line between two neighboring pads; and forming a plurality of bump electrodes on the stress buffer for electrical connection to the pads through the via holes. The method can prevent pollution of the die, improve the convenience of package, reduce the manufacture cost, increase the package reliability, and solve the stress problem caused by attaching the die directly to the PCB.

Abstract: A method for wafer level package (WLP) of sensor chips is provided, including the steps of: providing a wafer, the wafer including a plurality of die regions, each the die region on a first surface of the wafer comprising an active area and a pad surrounding the active area; bounding a transparent protective layer to the first surface of the wafer; forming a stress buffer on a second surface of the wafer; using etching or laser drill to form a via hole at the location between two neighboring die regions through the stress buffer and the wafer to expose the pad or a conductive line between two neighboring pads; and forming a plurality of bump electrodes on the stress buffer for electrical connection to the pads through the via holes. The method can prevent pollution of the die, improve the convenience of package, reduce the manufacture cost, increase the package reliability, and solve the stress problem caused by attaching the die directly to the PCB.

Abstract: The invention discloses a tunable long period fiber grating structure and fabrication method, which produces an expected microbending deformation by adjusting the temperature and making use of the unmatched coefficients of thermal expansion between different materials, and thus creating a phenomenon of mode coupling effect occurred in traditional optical gratings in order to provide the structure and fabrication method for having an effect of tuning spectra by controlling the temperature. This invention not only can be applied to the optical communications and wavelength dependent multiplexed devices and equipments, but also can be applied to the temperature and deformation detection.