Abstract: Vapor condensation mass soldering apparatus (46) is of modular construction and includes a primary vapor zone assembly (50), a secondary vapor zone assembly (52), an ambient air moisture-removal zone assembly (54) and a hood assembly (56) mounted in readily separable, vertically stacked relationship. An article load-unload assembly (48) is secured to the front of the other assemblies (50, 52, 54 and 56). Each of the zone assemblies (50, 52 and 54) also includes respective condenser coil modules (142, 150 and 154) of special construction which can readily be mounted on and removed from their respective assemblies as integral units.

Abstract: A technique for elevating the temperature of a heat transfer liquid is disclosed. The liquid, at a low temperature (e.g., 70.degree. F.), is directed through a coil (72) located in the upper portion of an enclosed chamber (71). Condensing, hot vapor on the coils (72) heats the liquid (e.g., 200.degree. F.) passing therethrough. The heated liquid from the coil (72) passes, via a conduit (73) into a reservoir in the lower portion of the chamber (71) where immersion heaters (76-76) heat the liquid (e.g., 400.degree. F.) to the desired temperature. The heated liquid is then discharged from the chamber (71) via an outlet pipe (74). Advantageously, the vapor from the heated liquid in the reservoir is the same vapor which condenses on the coils (72).

Abstract: A filter (21) for removing flux from a hot heat transfer liquid-flux mixture. The heat transfers liquid-flux mixture is directed into a chamber (41) having a plurality of spaced, hollow members (64--64) through which a coolant passes. Upon being cooled the flux deposits on the surface of the members (64--64). The liquid, with substantial portions of the flux removed therefrom, then leaves the filter (21).