Patents by Inventor Roy DUFFY
Roy DUFFY has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11735680Abstract: A transmit integrated circuit includes a light source configured to generate a beam of light. A receive integrated circuit includes a first photosensor. A transmit optic is mounted over the transmit and receive integrated circuits. The transmit optic is formed by a prismatic light guide and is configured to receive the beam of light. An annular body region of the transmit optic surrounds a central opening which is aligned with the first photosensor. The annular body region includes a first reflective surface defining the central opening and further includes a ring-shaped light output surface surrounding the central opening. Light is output from the ring-shaped light output surface in response to light which propagates within the prismatic light guide in response to the received beam of light and which reflects off the first reflective surface.Type: GrantFiled: February 10, 2021Date of Patent: August 22, 2023Assignee: STMicroelectronics (Research & Development) LimitedInventors: Thineshwaran Gopal Krishnan, Roy Duffy
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Publication number: 20230194820Abstract: An electronic device includes a carrier substrate having a front face. An electronic chip is mounted on the front face of the carrier substrate and includes an optical component. An encapsulation cover is mounted on top of the front face of the carrier substrate and bounds a chamber within which the chip is situated. A front opening extends through the cover and is situated in front of the optical component. An optical element, designed to allow light to pass, is mounted within the chamber at a position which covers the front opening of the encapsulation cover. The optical element includes a central region designed to deviate the light and having an optical axis aligned with the front opening and the optical component. A positioning pattern is provided on the optical element to assist with mounting the optical element to the cover and mounting the cover to the carrier substrate.Type: ApplicationFiled: February 16, 2023Publication date: June 22, 2023Applicants: STMicroelectronics (Grenoble 2) SAS, STMicroelectronics (Research & Development) LimitedInventors: Nicolas MASTROMAURO, Roy DUFFY, Karine SAXOD
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Patent number: 11609402Abstract: An electronic device includes a carrier substrate having a front face. An electronic chip is mounted on the front face of the carrier substrate and includes an optical component. An encapsulation cover is mounted on top of the front face of the carrier substrate and bounds a chamber within which the chip is situated. A front opening extends through the cover and is situated in front of the optical component. An optical element, designed to allow light to pass, is mounted within the chamber at a position which covers the front opening of the encapsulation cover. The optical element includes a central region designed to deviate the light and having an optical axis aligned with the front opening and the optical component. A positioning pattern is provided on the optical element to assist with mounting the optical element to the cover and mounting the cover to the carrier substrate.Type: GrantFiled: September 17, 2019Date of Patent: March 21, 2023Assignees: STMicroelectronics (Grenoble 2) SAS, STMicroelectronics (Research & Development) LimitedInventors: Nicolas Mastromauro, Roy Duffy, Karine Saxod
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Publication number: 20210167240Abstract: A transmit integrated circuit includes a light source configured to generate a beam of light. A receive integrated circuit includes a first photosensor. A transmit optic is mounted over the transmit and receive integrated circuits. The transmit optic is formed by a prismatic light guide and is configured to receive the beam of light. An annular body region of the transmit optic surrounds a central opening which is aligned with the first photosensor. The annular body region includes a first reflective surface defining the central opening and further includes a ring-shaped light output surface surrounding the central opening. Light is output from the ring-shaped light output surface in response to light which propagates within the prismatic light guide in response to the received beam of light and which reflects off the first reflective surface.Type: ApplicationFiled: February 10, 2021Publication date: June 3, 2021Applicant: STMicroelectronics (Research & Development) LimitedInventors: Thineshwaran GOPAL KRISHNAN, Roy DUFFY
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Patent number: 10955289Abstract: An electronic module includes an ambient light sensor and a proximity sensor. The ambient light sensor includes an ambient light photodetector. The proximity sensor includes an infrared photoemitter, a reference infrared photodetector and another infrared photodetector. The ambient light sensor is arranged in a stack over the proximity sensor with a position that allows infrared photons transmitted by the infrared photoemitter to be received by the reference infrared photodetector.Type: GrantFiled: April 8, 2019Date of Patent: March 23, 2021Assignees: STMicroelectronics (Research & Development) Limited, STMicroelectronics (Grenoble 2) SASInventors: William Halliday, Eric Saugier, Roy Duffy
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Patent number: 10950743Abstract: A transmit integrated circuit includes a light source configured to generate a beam of light. A receive integrated circuit includes a first photosensor. A transmit optic is mounted over the transmit and receive integrated circuits. The transmit optic is formed by a prismatic light guide and is configured to receive the beam of light. An annular body region of the transmit optic surrounds a central opening which is aligned with the first photosensor. The annular body region includes a first reflective surface defining the central opening and further includes a ring-shaped light output surface surrounding the central opening. Light is output from the ring-shaped light output surface in response to light which propagates within the prismatic light guide in response to the received beam of light and which reflects off the first reflective surface.Type: GrantFiled: May 2, 2019Date of Patent: March 16, 2021Assignee: STMicroelectronics (Research & Development) LimitedInventors: Thineshwaran Gopal Krishnan, Roy Duffy
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Publication number: 20200350455Abstract: A transmit integrated circuit includes a light source configured to generate a beam of light. A receive integrated circuit includes a first photosensor. A transmit optic is mounted over the transmit and receive integrated circuits. The transmit optic is formed by a prismatic light guide and is configured to receive the beam of light. An annular body region of the transmit optic surrounds a central opening which is aligned with the first photosensor. The annular body region includes a first reflective surface defining the central opening and further includes a ring-shaped light output surface surrounding the central opening. Light is output from the ring-shaped light output surface in response to light which propagates within the prismatic light guide in response to the received beam of light and which reflects off the first reflective surface.Type: ApplicationFiled: May 2, 2019Publication date: November 5, 2020Applicant: STMicroelectronics (Research & Development) LimitedInventors: Thineshwaran GOPAL KRISHNAN, Roy DUFFY
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Publication number: 20200096720Abstract: An electronic device includes a carrier substrate having a front face. An electronic chip is mounted on the front face of the carrier substrate and includes an optical component. An encapsulation cover is mounted on top of the front face of the carrier substrate and bounds a chamber within which the chip is situated. A front opening extends through the cover and is situated in front of the optical component. An optical element, designed to allow light to pass, is mounted within the chamber at a position which covers the front opening of the encapsulation cover. The optical element includes a central region designed to deviate the light and having an optical axis aligned with the front opening and the optical component. A positioning pattern is provided on the optical element to assist with mounting the optical element to the cover and mounting the cover to the carrier substrate.Type: ApplicationFiled: September 17, 2019Publication date: March 26, 2020Applicants: STMicroelectronics (Grenoble 2) SAS, STMicroelectronics (Research & Development) LimitedInventors: Nicolas MASTROMAURO, Roy DUFFY, Karine SAXOD
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Publication number: 20190316959Abstract: An electronic module includes an ambient light sensor and a proximity sensor. The ambient light sensor includes an ambient light photodetector. The proximity sensor includes an infrared photoemitter, a reference infrared photodetector and another infrared photodetector. The ambient light sensor is arranged in a stack over the proximity sensor with a position that allows infrared photons transmitted by the infrared photoemitter to be received by the reference infrared photodetector.Type: ApplicationFiled: April 8, 2019Publication date: October 17, 2019Applicants: STMicroelectronics (Research & Development) Limited, STMicroelectronics (Grenoble 2) SASInventors: William HALLIDAY, Eric SAUGIER, Roy DUFFY