Abstract: A redistribution layer is formed on a carrier wafer. A cavity is formed within the redistribution layer. An electro-optical die is flip-chip connected to the redistribution layer. A plurality of optical fiber alignment structures within the electro-optical die is positioned over and exposed to the cavity. Mold compound material is disposed over the redistribution layer and the electro-optical die. A residual kerf region of the electro-optical die interfaces with the redistribution layer to prevent mold compound material from entering into the optical fiber alignment structures and the cavity. The carrier wafer is removed from the redistribution layer. The redistribution layer and the mold compound material are cut to obtain an electro-optical chip package that includes the electro-optical die. The cutting removes the residual kerf region from the electro-optical die to expose the plurality of optical fiber alignment structures and the cavity at an edge of the electro-optical chip package.

Abstract: A vehicle is disclosed. The vehicle includes a passenger cabin; a steering assembly including a steering wheel mounted on a steering column assembly; and a ventilation system having a first air outlet for discharging a first jet of air, and a second air outlet for discharging a second jet of air. The first air outlet and the second air outlet are located on the steering column and the second jet of air intersects and deflects the first jet of air.

Abstract: A needle bending assembly configured to at least temporarily contain a needle can include a first housing section, a second housing section, and a coupling element coupled between the first housing section and the second housing section. The first housing section defines a first cavity configured to at least temporarily contain a first section of the needle. The second housing section defines a second cavity configured to at least temporarily contain a second section of the needle forming a distal tip. The coupling element is configured such that when the needle is contained within the housing sections, movement of the second housing section relative to the first housing section results in a bending of the needle at a location corresponding to the coupling element.

Abstract: A combination washer/dryer machine has a rotatable drum inside a cabinet. The drum has an external surface. A tub is positioned inside the cabinet. The drum is rotatable in the tub. The tub has an inner surface. A seal extends between the exterior surface of the drum and the inner surface of the tub forming a desired gap during washing operations and the seal operates to minimize the bypass of drying air during drying operations.

Abstract: An analyzer system for in vitro diagnostics includes a sample handler module having a robot arm that delivers samples from drawers into carriers on a linear synchronous motor automation track. Samples are delivered via the automation track to individual track sections associated with individual analyzer modules. Analyzer modules aspirate sample portions directly from the sample carriers and perform analysis thereon.

Abstract: The present disclosure relates to a dose detection system for use with a medication delivery device in which a dose setting member rotates relative to an actuator during dose delivery. The dose detection system includes a module which is removably attached to the medication delivery device. The module includes a rotation sensor attached to the actuator during dose delivery. A sensed element is attached to the dose setting member and includes surface features detectable by the rotation sensor. The rotation sensor comprises a following member including a contact portion resting against and spring-biased in the direction of the surface features. The contact surface is positioned to move over the surface features during rotation of the sensed element, and the rotation sensor is responsive to the movement of the contact portion over the surface features to detect the rotation of the dose setting member.

Abstract: A laundry appliance including a cabinet, a tub, and a drum. The tub is positioned inside the cabinet. The tub includes a front tub wall having a front tub opening, a rear tub wall, and a tub sidewall that extends between the front tub wall and the rear tub wall. The drum is rotatably supported within the tub. The drum includes a front drum opening, a rear drum wall, a drum sidewall that extends between the front drum opening and the rear drum wall, and a laundry compartment positioned inside the drum that is accessible through the front drum opening. An air gap is positioned radially between the tub sidewall and the drum sidewall. At least one heating element is positioned on or in the tub sidewall to heat the tub sidewall and therefore air flowing through the air gap.

Abstract: A remote memory system includes a substrate of a multi-chip package, an integrated circuit chip connected to the substrate, and an electro-optical chip connected to the substrate. The integrated circuit chip includes a high-bandwidth memory interface. An electrical interface of the electro-optical chip is electrically connected to the high-bandwidth memory interface. A photonic interface of the electro-optical chip is configured to optically connect with an optical link. The electro-optical chip includes at least one optical macro that converts outgoing electrical data signals received through the electrical interface from the high-bandwidth interface into outgoing optical data signals. The optical macro transmits the outgoing optical data signals through the photonic interface to the optical link. The optical macro also converts incoming optical data signals received through the photonic interface into incoming electrical data signals.

Abstract: A package assembly includes a silicon photonics chip having an optical waveguide exposed at a first side of the chip and an optical fiber coupling region formed along the first side of the chip. The package assembly includes a mold compound structure formed to extend around second, third, and fourth sides of the chip. The mold compound structure has a vertical thickness substantially equal to a vertical thickness of the chip. The package assembly includes a redistribution layer formed over the chip and over a portion of the mold compound structure. The redistribution layer includes electrically conductive interconnect structures to provide fanout of electrical contacts on the chip to corresponding electrical contacts on the redistribution layer. The redistribution layer is formed to leave the optical fiber coupling region exposed. An optical fiber is connected to the optical fiber coupling region in optical alignment with the optical waveguide within the chip.

Abstract: A vertical integrated photonics chiplet assembly includes a package substrate and an external device connected to a top surface of the package substrate. A photonics chip is disposed within the package substrate. The photonics chip includes optical coupling devices positioned at a top surface of the photonics chip. A plurality of conductive via structures are disposed within the package substrate in electrical connection with electrical circuits within the photonics chip. The plurality of conductive via structures are electrically connected through the package substrate to the external device. An opening is formed through the top surface of the substrate to expose a portion of the top surface of the photonics chip at which the optical coupling devices are positioned. An optical fiber array is disposed and secured within the opening such that a plurality of optical fibers of the optical fiber array optically couple to the optical coupling devices.

Abstract: An interposer device includes a substrate that includes a laser source chip interface region, a silicon photonics chip interface region, an optical amplifier module interface region. A fiber-to-interposer connection region is formed within the substrate. A first group of optical conveyance structures is formed within the substrate to optically connect a laser source chip to a silicon photonics chip when the laser source chip and the silicon photonics chip are interfaced to the substrate. A second group of optical conveyance structures is formed within the substrate to optically connect the silicon photonics chip to an optical amplifier module when the silicon photonics chip and the optical amplifier module are interfaced to the substrate. A third group of optical conveyance structures is formed within the substrate to optically connect the optical amplifier module to the fiber-to-interposer connection region when the optical amplifier module is interfaced to the substrate.

Abstract: An intact semiconductor wafer (wafer) includes a plurality of die. Each die has a top layer including routings of conductive interconnect structures electrically isolated from each other by intervening dielectric material. A top surface of the top layer corresponds to a top surface of the wafer. Below the top layer, each die has a device layer including optical devices and electronic devices. Each die has a cladding layer below the device layer and on a substrate of the wafer. Each die includes a photonic test port within the device layer. For each die, a light transfer region is formed within the intact wafer to extend through the top layer to the photonic test port within the device layer. The light transfer region provides a window for transmission of light into and out of the photonic test port from and to a location on the top surface of the wafer.

Abstract: Freeze frame insert is a cooling device that is intended to provide users with a cooling surface for eyewear frames. To accomplish this, the device includes insulating sleeves and gel packets. As the insulating sleeves and gel packets can be made of varying dimensions, this allows the device to be used with any size or shape of glasses or eyewear. As such, the user can choose any style of frame or design without needing to specifically consider accommodating an integrated chilling method ahead of time. Further, both the insulating sleeve and the cooling gel packet can be resized as necessary during manufacture to fit any frame, regardless of the size of the shape of the eyewear. The insulating sleeve may furthermore be made from a more flexible material, allowing one insulating sleeve to flex to fit a variety of frames.

Abstract: Systems and methods are provided to enable a partial migration of applications from one database system to another without modifying the applications. In embodiments, a proxy server is configured to monitor the application's usage of a current database, and generate a migration plan to partially migrate database objects used by the application to a different type of database. An object may be selected for migration based on its usage level or its portability. After the partial migration, the proxy server may remain in place as a request router to route the application's requests to the two databases. In embodiments, the migration system may forward queries to both databases and compare the query results received from the two. Based on the comparison results, the migration system may programmatically determine adjustments to its query handling configuration settings.

Abstract: A package assembly includes a silicon photonics chip having an optical waveguide exposed at a first side of the chip and an optical fiber coupling region formed along the first side of the chip. The package assembly includes a mold compound structure formed to extend around second, third, and fourth sides of the chip. The mold compound structure has a vertical thickness substantially equal to a vertical thickness of the chip. The package assembly includes a redistribution layer formed over the chip and over a portion of the mold compound structure. The redistribution layer includes electrically conductive interconnect structures to provide fanout of electrical contacts on the chip to corresponding electrical contacts on the redistribution layer. The redistribution layer is formed to leave the optical fiber coupling region exposed. An optical fiber is connected to the optical fiber coupling region in optical alignment with the optical waveguide within the chip.

Abstract: A redistribution layer is formed on a carrier wafer. A cavity is formed within the redistribution layer. An electro-optical die is flip-chip connected to the redistribution layer. A plurality of optical fiber alignment structures within the electro-optical die is positioned over and exposed to the cavity. Mold compound material is disposed over the redistribution layer and the electro-optical die. A residual kerf region of the electro-optical die interfaces with the redistribution layer to prevent mold compound material from entering into the optical fiber alignment structures and the cavity. The carrier wafer is removed from the redistribution layer. The redistribution layer and the mold compound material are cut to obtain an electro-optical chip package that includes the electro-optical die. The cutting removes the residual kerf region from the electro-optical die to expose the plurality of optical fiber alignment structures and the cavity at an edge of the electro-optical chip package.

Abstract: A computer memory system includes an electro-optical chip, an electrical fanout chip electrically connected to an electrical interface of the electro-optical chip, and at least one dual in-line memory module (DIMM) slot electrically connected to the electrical fanout chip. A photonic interface of the electro-optical chip is optically connected to an optical link. The electro-optical chip includes at least one optical macro that converts outgoing electrical data signals into outgoing optical data signals for transmission through the optical link. The optical macro also converts incoming optical data signals from the optical link into incoming electrical data signals and transmits the incoming electrical data signals to the electrical fanout chip. The electrical fanout chip directs bi-directional electrical data communication between the electro-optical chip and a dynamic random access memory (DRAM) DIMM corresponding to the at least one DIMM slot.

Abstract: The airflow exhaust system for a combination washer/dryer includes an exit duct portion to couple with an exit from a tub. A lint screen box portion is associated with the exit duct. A transition duct portion is associated with the lint screen box portion. A fan is associated with the transition duct. The fan includes an outlet to couple with an exhaust tube. A mounting assembly stationarily fastens the airflow exhaust system within a housing of the combination washer/dryer machine.

Abstract: A semiconductor wafer includes a semiconductor chip that includes a photonic device. The semiconductor chip includes an optical fiber attachment region in which an optical fiber alignment structure is to be fabricated. The optical fiber alignment structure is not yet fabricated in the optical fiber attachment region. The semiconductor chip includes an in-plane fiber-to-chip optical coupler positioned at an edge of the optical fiber attachment region. The in-plane fiber-to-chip optical coupler is optically connected to the photonic device. A sacrificial optical structure is optically coupled to the in-plane fiber-to-chip optical coupler. The sacrificial optical structure includes an out-of-plane optical coupler configured to receive input light from a light source external to the semiconductor chip. At least a portion of the sacrificial optical structure extends through the optical fiber attachment region.

Abstract: An interposer device includes a substrate that includes a laser source chip interface region, a silicon photonics chip interface region, an optical amplifier module interface region. A fiber-to-interposer connection region is formed within the substrate. A first group of optical conveyance structures is formed within the substrate to optically connect a laser source chip to a silicon photonics chip when the laser source chip and the silicon photonics chip are interfaced to the substrate. A second group of optical conveyance structures is formed within the substrate to optically connect the silicon photonics chip to an optical amplifier module when the silicon photonics chip and the optical amplifier module are interfaced to the substrate. A third group of optical conveyance structures is formed within the substrate to optically connect the optical amplifier module to the fiber-to-interposer connection region when the optical amplifier module is interfaced to the substrate.