Patents by Inventor Roy J. Burt

Roy J. Burt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of etching in the presence of positive photoresist
    Patent number: 4940510
    Abstract: A wet chemical etchant for etching chromium films that have been patterned with positive photoresist comprising about 3 to about 9 grams potassium hydroxide per liter of water and about 15 to about 25 grams potassium permanganate per liter of water.
    Type: Grant
    Filed: June 1, 1987
    Date of Patent: July 10, 1990
    Assignee: Digital Equipment Corporation
    Inventor: Roy J. Burt
  • Semiconductor chip mounting system
    Patent number: 4737839
    Abstract: A semiconductor chip module with a flat mounting surface is disclosed. A wafer-scale silicon semiconductor chip is provided with electronic circuits formed therein. The chip has a metallized back face and contacts on the opposite, front face. A solder layer secures the metallized back face of the chip to the mounting surface substantially without voids.
    Type: Grant
    Filed: March 11, 1986
    Date of Patent: April 12, 1988
    Assignee: Trilogy Computer Development Partners, Ltd.
    Inventor: Roy J. Burt
  • Method for mounting a semiconductor chip
    Patent number: 4577398
    Abstract: A method of attaching a semiconductor chip to a mounting surface is disclosed. A solder barrier is applied to the mounting surface, and a preform of solder is located within the solder barrier. The preform is heated and then cooled in a vacuum to preflow the solder and secure the solder to the mounting surface substantially without voids. The semiconductor chip is then placed over the preflowed solder, which is reheated and then recooled in a vacuum to secure the chip to the mounting surface.
    Type: Grant
    Filed: September 7, 1984
    Date of Patent: March 25, 1986
    Assignee: Trilogy Computer Development Partners, Ltd.
    Inventors: John W. Sliwa, Roy J. Burt, Chune Lee, John MacKay, Cindy A. Johnson
  • Semiconductor chip mounting system
    Patent number: 4574470
    Abstract: A semiconductor chip module with a flat mounting surface is disclosed. A wafer-scale silicon semiconductor chip is provided with electronic circuits formed therein. The chip has a metallized back face and contacts on the opposite, front face. A solder layer secures the metallized back face of the chip to the mounting surface substantially without voids.
    Type: Grant
    Filed: March 19, 1984
    Date of Patent: March 11, 1986
    Assignee: Trilogy Computer Development Partners, Ltd.
    Inventor: Roy J. Burt