Patents by Inventor Roy Rongging Yu

Roy Rongging Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lock and Key Through-Via Method for Wafer Level 3D Integration and Structures Produced Thereby
    Publication number: 20110111560
    Abstract: A three dimensional device stack structure comprises two or more active device and interconnect layers further connected together using through substrate vias. Methods of forming the three dimensional device stack structure comprise alignment, bonding by lamination, thinning and post thinning processing. The via features enable the retention of alignment through the lamination process and any subsequent process steps thus achieving a mechanically more robust stack structure compared to the prior art.
    Type: Application
    Filed: November 9, 2009
    Publication date: May 12, 2011
    Applicant: International Business Machines Corporation
    Inventors: Sampath Purushothaman, Mary E. Rothwell, Ghavam Ghavami Shahidi, Roy Rongging Yu