Patents by Inventor Roy Turtenwald

Roy Turtenwald has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Discharge plenum for packaged HVAC unit
    Patent number: 10274224
    Abstract: A discharge plenum for use with a packaged HVAC unit has an outer enclosure with opposing side walls, a front wall, a rear wall, and a top wall. A planar barrier is arranged within the discharge plenum, and extends between the side walls and furthermore extends to the front wall. One air volume is arranged in a bottom portion of the discharge plenum directly below the planar barrier, and another is arranged in a top portion of the discharge plenum directly above the planar barrier, so that the planar barrier separates the two air volumes. A turning vane is provided within the discharge plenum to direct a flow of air received into the discharge plenum towards the air volume in the bottom portion.
    Type: Grant
    Filed: November 4, 2015
    Date of Patent: April 30, 2019
    Assignee: Modine Manufacturing Company
    Inventors: Erik Hansen, Jacob Pachniak, Roy Turtenwald
  • Discharge Plenum for Packaged HVAC UNit
    Publication number: 20170122619
    Abstract: A discharge plenum for use with a packaged HVAC unit has an outer enclosure with opposing side walls, a front wall, a rear wall, and a top wall. A planar barrier is arranged within the discharge plenum, and extends between the side walls and furthermore extends to the front wall. One air volume is arranged in a bottom portion of the discharge plenum directly below the planar barrier, and another is arranged in a top portion of the discharge plenum directly above the planar barrier, so that the planar barrier separates the two air volumes. A turning vane is provided within the discharge plenum to direct a flow of air received into the discharge plenum towards the air volume in the bottom portion.
    Type: Application
    Filed: November 4, 2015
    Publication date: May 4, 2017
    Inventors: Erik Hansen, Jacob Pachniak, Roy Turtenwald