Patents by Inventor Ruan Fei Fei

Ruan Fei Fei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Surface mount device thin package
    Patent number: 8901583
    Abstract: The present invention is directed to LED packages and LED displays utilizing thin/low profile LED packages with improved structural integrity, emission characteristics, and customizable attributes. In some embodiments the improved structural integrity is provided by various features in the lead frame that cooperate with the casing for a stronger package. Moreover, in some embodiments the improved emission characteristics are provided by cavity features such as shape and depth, which provide for increased surface bonding area for multiple LED chips and increased viewing angle, respectively. Some embodiments also provide for gradated packages having customizable top portions for applications using smaller packages, with bottom portions comprising dimensions compatible with customary mechanical/electrical supports.
    Type: Grant
    Filed: April 12, 2010
    Date of Patent: December 2, 2014
    Assignee: Cree Huizhou Opto Limited
    Inventors: Alex Chi Keung Chan, Charles Chak Hau Pang, Ruan Fei Fei
  • SURFACE MOUNT DEVICE THIN PACKAGE
    Publication number: 20110248293
    Abstract: The present invention is directed to LED packages and LED displays utilizing thin/low profile LED packages with improved structural integrity, emission characteristics, and customizable attributes. In some embodiments the improved structural integrity is provided by various features in the lead frame that cooperate with the casing for a stronger package. Moreover, in some embodiments the improved emission characteristics are provided by cavity features such as shape and depth, which provide for increased surface bonding area for multiple LED chips and increased viewing angle, respectively. Some embodiments also provide for gradated packages having customizable top portions for applications using smaller packages, with bottom portions comprising dimensions compatible with customary mechanical/electrical supports.
    Type: Application
    Filed: April 12, 2010
    Publication date: October 13, 2011
    Inventors: Alex Chi Keung Chan, Charles Chak Hau Pang, Ruan Fei Fei