Patents by Inventor Ruben Javier Flores-Cuadras

Ruben Javier Flores-Cuadras has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Coupled Dual-Band Dipole Antenna with Interference Cancellation Gap, Method of Manufacture and Kits Therefor
    Publication number: 20130321231
    Abstract: A planar dipole antenna for dual-band Wi-Fi application is disclosed. The antenna has a ground copper and a radiation copper. The ground copper is adhered to a substrate and has an upper, shorter and generally horizontal segment and a lower, longer and also generally horizontal segment that are connected at one end thereof by a vertical segment. The radiation copper is adhered to the substrate and has a copper shaped substantially as a mirror symmetry of the ground copper and spaced apart from the ground copper by a gap at the end of the ground and radiation coppers where the shorter and longer horizontal segments thereof are connected. The antenna has a gross span of approximately 42 mm and a height of approximately 7 mm. The gap is approximately 0.
    Type: Application
    Filed: November 21, 2011
    Publication date: December 5, 2013
    Applicant: Taoglas Group Holdings
    Inventor: Ruben Javier Flores-Cuadras