Abstract: The invention relates to a method to reduce thermal stresses in a sputter target during sputtering. The method provides the following steps providing a target holder, applying a target material comprising indium-tin-oxide on the target holder by spraying and introducing pores in the target material while applying the target material on the target holder. These pores leading to a porosity of at least 2% in the sprayed target material to reduce thermal stresses. The invention further relates to a sputter target having reduced thermal stresses and to a process for coating a substrate surface with indium-tin-oxide.

Abstract: The invention relates to a method of manufacturing a sputter target. The method comprises the steps of: —providing a target holder having a coefficient of thermal expansion; —providing a target material having a coefficient of thermal expansion. The target material comprises at least a first and a second compound. The first compound has a first coefficient of thermal expansion whereas the second compound has a second coefficient of thermal expansion. The second coefficient of thermal expansion is higher than the first coefficient of thermal expansion and the second coefficient of thermal expansion is higher than the coefficient of thermal expansion of the target holder; —bonding the target material to the target holder. The invention further relates to the resulting sputter target.