Patents by Inventor Ruby Ann Maya Merto

Ruby Ann Maya Merto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for making integrated circuit packages
    Patent number: 11152324
    Abstract: A method of making a plurality of integrated circuit (“IC”) packages includes picking up a plurality of physically unconnected IC components; and simultaneously placing each of the physically unconnected IC components on corresponding portions of an unsingulated IC package strip that includes a sheet of integrally connected leadframes.
    Type: Grant
    Filed: October 3, 2017
    Date of Patent: October 19, 2021
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Roxanna Bauzon Samson, Ruby Ann Maya Merto, Lorraine Rivera Duldulao, Jason Binay-an Colte
  • Window Clamp
    Publication number: 20180261568
    Abstract: A wire bonding machine window clamp assembly. The assembly includes a support plate adapted to support a leadframe strip. The assembly also includes a frame structure defining a central clamp opening adapted to expose a portion of the leadframe strip. The frame structure includes at least one elongate frame member having a first surface portion adapted to engage a top surface of the leadframe strip and a second surface portion adapted to engage upper surfaces of integrated circuit (“IC”) component stacks mounted on the leadframe strip.
    Type: Application
    Filed: May 11, 2018
    Publication date: September 13, 2018
    Inventors: Ruby Ann Maya Merto, Jerry Gomez Cayabyab, Edsel Gomez Balagtas
  • Window Clamp
    Publication number: 20180261567
    Abstract: A wire bonding machine window clamp assembly. The assembly includes a support plate adapted to support a leadframe strip. The assembly also includes a frame structure defining a central clamp opening adapted to expose a portion of the leadframe strip. The frame structure includes at least one elongate frame member having a first surface portion adapted to engage a top surface of the leadframe strip and a second surface portion adapted to engage upper surfaces of integrated circuit (“IC”) component stacks mounted on the leadframe strip.
    Type: Application
    Filed: May 8, 2018
    Publication date: September 13, 2018
    Inventors: Ruby Ann Maya Merto, Jerry Gomez Cayabyab, Edsel Gomez Balagtas
  • Window clamp
    Patent number: 9997490
    Abstract: A wire bonding machine window clamp assembly. The assembly includes a support plate adapted to support a leadframe strip. The assembly also includes a frame structure defining a central clamp opening adapted to expose a portion of the leadframe strip. The frame structure includes at least one elongate frame member having a first surface portion adapted to engage a top surface of the leadframe strip and a second surface portion adapted to engage upper surfaces of integrated circuit (“IC”) component stacks mounted on the leadframe strip.
    Type: Grant
    Filed: March 20, 2015
    Date of Patent: June 12, 2018
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Ruby Ann Maya Merto, Jerry Gomez Cayabyab, Edsel Gomez Balagtas
  • METHOD AND APPARATUS FOR MAKING INTEGRATED CIRCUIT PACKAGES
    Publication number: 20180033758
    Abstract: A method of making a plurality of integrated circuit (“IC”) packages includes picking up a plurality of physically unconnected IC components; and simultaneously placing each of the physically unconnected IC components on corresponding portions of an unsingulated IC package strip that includes a sheet of integrally connected leadframes.
    Type: Application
    Filed: October 3, 2017
    Publication date: February 1, 2018
    Inventors: Roxanna Bauzon Samson, Ruby Ann Maya Merto, Lorraine Rivera Duldulao, Jason Binay-an Colte
  • WINDOW CLAMP
    Publication number: 20160276305
    Abstract: A wire bonding machine window clamp assembly. The assembly includes a support plate adapted to support a leadframe strip. The assembly also includes a frame structure defining a central clamp opening adapted to expose a portion of the leadframe strip. The frame structure includes at least one elongate frame member having a first surface portion adapted to engage a top surface of the leadframe strip and a second surface portion adapted to engage upper surfaces of integrated circuit (“IC”) component stacks mounted on the leadframe strip.
    Type: Application
    Filed: March 20, 2015
    Publication date: September 22, 2016
    Inventors: Ruby Ann Maya Merto, Jerry Gomez Cayabyab, Edsel Gomez Balagtas
  • METHOD AND APPARATUS FOR MAKING INTEGRATED CIRCUIT PACKAGES
    Publication number: 20160276185
    Abstract: A method of making a plurality of integrated circuit (“IC”) packages includes picking up a plurality of physically unconnected IC components; and simultaneously placing each of the physically unconnected IC components on corresponding portions of an unsingulated IC package strip that includes a sheet of integrally connected leadframes.
    Type: Application
    Filed: March 17, 2015
    Publication date: September 22, 2016
    Inventors: Roxanna Bauzon Samson, Ruby Ann Maya Merto, Lorraine Rivera Duldulao, Jason Binay-an Colte
  • Integrated Circuit Packaging Method Using Pre-Applied Attachment Medium
    Publication number: 20150371930
    Abstract: A method of making an IC package having a die and a substrate that are to be attached at an attachment station including providing the die and substrate and, at a location remote from the attachment station, coating at least one of the die and a die attachment portion of the substrate with attachment medium.
    Type: Application
    Filed: June 18, 2014
    Publication date: December 24, 2015
    Inventors: Ruby Ann Maya Merto, Roxanna Bauzon Samson
  • Window Clamp
    Publication number: 20150343572
    Abstract: A wire bonding window clamp including a frame structure defining a central clamp opening that has a flat bottom surface adapted to engage a leadframe sheet and at least one elongate strand of material extending between opposed portions of the frame structure and adapted to engage the leadframe sheet.
    Type: Application
    Filed: June 3, 2014
    Publication date: December 3, 2015
    Inventors: Ruby Ann Maya Merto, Wilmar Estandian Subido