Abstract: The invention, which relates to a wafer lifting device having a lifting platform arranged under a wafer receptacle, which lifting platform can be moved in the vertical direction and at least three pins which can be moved in through holes in the wafer receptacle. The pins are separately guided in the through holes. A pin is guided and held such that it can be moved longitudinally, and the pin guide is fixedly connected to the wafer receptacle.

Abstract: A holder in a brush-cleaning installation, preferably for combined use in the brush-cleaning and centrifugal-drying process, contains a carrier part from which there extend, in a spider-shaped manner, a plurality of carrying arms. On the carrying arms there is mounted, in a rotatable manner in each case, a guide roller which, in addition to positioning the semiconductor wafer vertically, also makes it possible for the semiconductor wafer to be positioned horizontally with the aid of an annular collar on a bottom section of the guide roller.

Abstract: The invention, which relates to a wafer lifting device having a lifting platform arranged under a wafer receptacle, which lifting platform can be moved in the vertical direction and at least three pins which can be moved in through holes in the wafer receptacle. The pins are separately guided in the through holes. A pin is guided and held such that it can be moved longitudinally, and the pin guide is fixedly connected to the wafer receptacle.

Abstract: A cleaning device is used to clean a polishing pad and has a first cleaning system with a grinding wheel and a second cleaning system with a distributor for discharging a gas-water mixture at high pressure. The polishing pad, which is arranged on a polishing table, can be set in rotary motion, so that the surface sections that will be cleaned are first preliminarily cleaned by the grinding wheel and are then subjected to a second cleaning by the gas-water mixture of the distributor.

Abstract: A device for cleaning a wafer of abrasive agent suspension (slurry) remaining after polishing with brushes and DI water includes an upper gear casing having an upper side with an end, a motor in the upper gear casing, a drive shaft, an upper gear mechanism, and a lower gear casing substantially mirroring the upper gear casing. The lower receiving plate and upper receiving plate form a brush unit, between which a part of a wafer can be clamped and cleaned by rotating the brush unit. The lower gear mechanism turns the lower drive wheel in a same direction as the upper drive wheel. The cleaning is achieved by a rotational movement of a number of pairs of brushes (scrubber brushes) on both sides of the wafer and the application of deionized water.

Abstract: A holder in a brush-cleaning installation, preferably for combined use in the brush-cleaning and centrifugal-drying process, contains a carrier part from which there extend, in a spider-shaped manner, a plurality of carrying arms. On the carrying arms there is mounted, in a rotatable manner in each case, a guide roller which, in addition to positioning the semiconductor wafer vertically, also makes it possible for the semiconductor wafer to be positioned horizontally with the aid of an annular collar on a bottom section of the guide roller.

Abstract: A device for cleaning a wafer of abrasive agent suspension (slurry) remaining after polishing with brushes and DI water includes an upper gear casing having an upper side with an end, a motor in the upper gear casing, a drive shaft, an upper gear mechanism, and a lower gear casing substantially mirroring the upper gear casing. The lower receiving plate and upper receiving plate form a brush unit, between which a part of a wafer can be clamped and cleaned by rotating the brush unit. The lower gear mechanism turns the lower drive wheel in a same direction as the upper drive wheel. The cleaning is achieved by a rotational movement of a number of pairs of brushes (scrubber brushes) on both sides of the wafer and the application of deionized water.

Abstract: A scanning device for semiconductor wafers with which rapid and dependable scanning is permitted. The invention is characterized by a base plate with a guiding pin protruding from it for the manual guidance of a depositing plate which is displaceable on the latter. The depositing plate is intended to receive a semiconductor wafer and is provided on an underside with meandering guiding channels for guiding by the guiding pin. A liquid drop is kept on a surface of the semiconductor wafer by a scanning tube and collects metal and dopant traces from the semiconductor wafer. The liquid drop can then be analyzed for determining a purity of the surface of the semiconductor wafer.