Patents by Inventor Rudy Cardema

Rudy Cardema has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and system for thermally processing a plurality of wafer-shaped objects
    Patent number: 7977258
    Abstract: Process and system for processing wafer-shaped objects, such as semiconductor wafers is disclosed. In accordance with the present disclosure, a multiple of two wafers are processed in a thermal processing chamber. The thermal processing chamber is in communication with at least one heating device for heating the wafers. The wafers are placed in the thermal processing chamber in a face-to-face configuration or in a back-to-back configuration.
    Type: Grant
    Filed: April 6, 2007
    Date of Patent: July 12, 2011
    Assignee: Mattson Technology, Inc.
    Inventors: Zsolt Nenyei, Paul J. Timans, Wilfried Lerch, Jüergen Niess, Manfred Falter, Patrick Schmid, Conor Patrick O'Carroll, Rudy Cardema, Igor Fidelman, Sing-Pin Tay, Yao Zhi Hu, Daniel J. Devine
  • Method and system for thermally processing a plurality of wafer-shaped objects
    Publication number: 20080248657
    Abstract: Process and system for processing wafer-shaped objects, such as semiconductor wafers is disclosed. In accordance with the present disclosure, a multiple of two wafers are processed in a thermal processing chamber. The thermal processing chamber is in communication with at least one heating device for heating the wafers. The wafers are placed in the thermal processing chamber in a face-to-face configuration or in a back-to-back configuration.
    Type: Application
    Filed: April 6, 2007
    Publication date: October 9, 2008
    Inventors: Zsolt Nenyei, Paul J. Timans, Wilfried Lerch, Juergen Niess, Manfred Falter, Patrick Schmid, Conor Patrick O'Carroll, Rudy Cardema, Igor Fidelman, Sing-Pin Tay, Yao Zhi Hu, Daniel J. Devine
  • Heating configuration for use in thermal processing chambers
    Publication number: 20050213949
    Abstract: An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear lamps for emitting light energy onto a wafer. The linear lamps can be placed in various configurations. In accordance with the present invention, tuning devices which are used to adjust the overall irradiance distribution of the light energy sources are included in the heating device. The tuning devices can be, for instance, are lamps or lasers.
    Type: Application
    Filed: May 19, 2005
    Publication date: September 29, 2005
    Inventors: Zion Koren, Conor O'Carroll, Shuen Choy, Paul Timans, Rudy Cardema, James Taoka, Arieh Strod