Abstract: A bearing, having: a support for fastening the bearing to a first body; a supporting bearing for fastening the bearing to a second body; and a multilayered spring which is integrated into the support and/or the supporting bearing and has an elastomer track which is arranged between two cover plates, wherein at least one of the cover plates has at least one projection which extends into the elastomer track from the one cover plate in the direction of the other cover plate.

Abstract: A hydraulically damping bearing includes a damping fluid having a complex viscosity that is above the complex viscosity of polydimethyl siloxane within a first frequency range in which the damping fluid is excited upon the bearing being activated. The complex velocity of the damping fluid is below the complex viscosity of polydimethyl siloxane within a second frequency range in which the damping fluid is excited upon the bearing being activated.

Abstract: The invention relates to a laser scribing system (10) for structuring substrates, said system being characterized in that the planar rotor (56) together with the laser device (60) has a mass that is essentially less than the mass of the table (20) and the substrate (30) such that the machining speed is increased, and the substrate arranged on the table (20) is still during the machining, or moves in a direction at a constant speed vSubstrat such that vibrations are reduced and the precision of the scribing traces increased. Furthermore, other planar rotors (56) can be mounted with a laser device (60) without changing the structure of the machine such that the productivity is easily increased. The laser light (65) is also guided, by means of optical fibers, as close as possible to the machining point, reducing the free length of the light beam (65) such that the adjustment requirements for the optical-mechanical components are reduced and the system is more robust.

Abstract: The invention relates to a laser scribing system (10) for structuring substrates, said system being characterised in that the planar rotor (56) together with the laser device (60) has a mass that is essentially less than the mass of the table (20) and the substrate (30) such that the machining speed is increased, and the substrate arranged on the table (20) is still during the machining, or moves in a direction at a constant speed vSubstrat such that vibrations are reduced and the precision of the scribing traces increased. Furthermore, other planar rotors (56) can be mounted with a laser device (60) without changing the structure of the machine such that the productivity is easily increased.; The laser light (65) is also guided, by means of optical fibres, as close as possible to the machining point, reducing the free length of the light beam (65) such that the adjustment requirements for the optical-mechanical components are reduced and the system is more robust.

Abstract: Method for bonding a chip to a chip carrier including arranging the chip in alignment with the chip carrier to form a chip stack. First bond area situated on the chip at an interface between the chip and the chip carrier in contact with second bond area situated on the chip carrier at the interface. Projecting a laser beam through the chip and/or the chip carrier, the laser beam impinging on the first bond area and/or the second bond area melting the first bond area and/or the second bond area to form a bond electrically coupling the chip and the chip carrier. A device including a chip having a first bond area situated on a chip carrier side of the chip and a chip carrier having a second bond area situated on a chip side of the chip carrier. The first bond area is bonded to the second bond to form a contact area. The contact area less than about 40 &mgr;m2. A system for bonding a chip to a chip carrier including a laser and an aperture for holding a chip stack in alignment.

Abstract: The penetration depth of a machining laser beam into workpiece is continuously monitored in that a measuring laser beam is directed onto the vapor capillary that is generated in the workpiece by the machining laser beam.