Patents by Inventor Ruediger Thorwarth

Ruediger Thorwarth has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4908938
    Abstract: A method for repairing interconnect interruptions. Faults at the interconnects occurring in manufacturing processes of printed circuit boards were previously repaired with suitable methods. The fashioning of the interconnects in a meander form and their miniaturization requires a completely new procedure. The dimensions of current interconnects amount, for example, to: width.times.height=70 .mu.m.times.20 .mu.m. For repairing such interconnects that are usually arranged in extremely tight proximity on an interconnect carrier, it is necessary to position preforms utilized for repair absolutely congruently on the interconnect interruption and to hold them until the joining zones are completely formed between the preform and the interconnect. This is achieved by use of an insulating foil having work windows and by use of a preform panel that contains a plurality of preforms.
    Type: Grant
    Filed: March 23, 1989
    Date of Patent: March 20, 1990
    Assignee: Siemens Aktiengesellschaft
    Inventors: Ruediger Thorwarth, Siegfried Enzensberger, Rolf Diemann
  • Patent number: 4580027
    Abstract: A solder device and method in which the soldering element comprises two half shell-shaped soldering jaws which are formed of a electrically resistant material. During a soldering operation the jaws are closed and moved onto a soldering location to either melt solder located at the location or additional solder clamped in the jaws and to press a loop of a wire being soldered at the location. At the melting of the solder, the flow of current pulses stopped to allow the solder to solidify in the form of a cone which can be utilized in subsequent soldering operation as a centering arrangement or aid.
    Type: Grant
    Filed: August 14, 1984
    Date of Patent: April 1, 1986
    Assignee: Siemens Aktiengesellschaft
    Inventor: Ruediger Thorwarth
  • Patent number: 4418264
    Abstract: To repair conductor path interruptions on printed circuit boards by means of micro-resistance welding, a specifically shaped metallic part is sucked on a central electrode by use of vacuum. The central electrode lowers the part so as to bridge the conductor path interruption to be repaired. On each side of the central electrode an outer electrode is provided which are lowered into contact with ends of the shaped part to provide independent micro-resistance welding at each end thereof by use of separate welding pulses, with the central electrode functioning in common for each welding.
    Type: Grant
    Filed: July 8, 1981
    Date of Patent: November 29, 1983
    Assignee: Siemens Aktiengesellschaft
    Inventor: Ruediger Thorwarth