Abstract: A first package for an integrated circuit has both a first set of electrical contacts and a first connector. A second package has a second set of electrical contacts and a second connector. The first and the second connector are mating connectors that are electrically and physically coupled. The first set of electrical contacts and the first connector are disposed on opposite surfaces of the first package and the second set of electrical contacts and the second connector are disposed on the same surface of the second package. The first and second set of electrical contacts couple to a printed circuit board directly or indirectly through a socket. The connectors allow higher speed signals to be routed over the first and second connectors, while power, ground and slower speed signals can be routed over the first set and second set of electrical contacts.

Abstract: A semiconductor device includes a casing, a semiconductor die supported by the casing, at least one contact pad disposed on a bottom surface of the semiconductor device, and a plurality of external contacts extending from the casing and being coupled to the semiconductor die. A circuit assembly includes a printed circuit board, a semiconductor device, and a socket. The semiconductor device includes a casing, a semiconductor die supported by the casing, at least one contact pad disposed on a bottom surface of the semiconductor device, and a plurality of external contacts extending from the casing and being coupled to the semiconductor die. The socket is coupled to the printed circuit board and adapted to receive the semiconductor device. The socket includes a first plurality of contacts adapted to interface with the external contacts of the semiconductor device and at least one base contact adapted to interface with the contact pad.

Abstract: A conductive plane of an integrated circuit package and a heatsink combine to form a structure for controlling electromagnetic emissions from the integrated circuit die that is mounted in the package. The heatsink includes a base and a projecting portion extending from the base. The projecting portion is electrically connected to an exposed ground plane in the package. The projecting portion defines a recess positioned over the integrated circuit die, which thermally engages the integrated circuit die.

Abstract: A lift mechanism is provided that facilitates removal of an integrated circuit from a socket. Such a socket includes a base portion and a cover that slidably engages with the base portion. An actuation device moves the cover laterally with respect to the base. A lift mechanism responds to the cover moving in a first lateral direction into an open position in which the integrated circuit can be removed from the socket, by moving at least partially in an upward direction sufficiently to displace the integrated circuit away from the socket, thereby more easily allowing the integrated circuit to be grasped and removed from the socket.

Abstract: A semiconductor device includes a casing, a semiconductor die supported by the casing, at least one contact pad disposed on a bottom surface of the semiconductor device, and a plurality of external contacts extending from the casing and being coupled to the semiconductor die. A circuit assembly includes a printed circuit board, a semiconductor device, and a socket. The semiconductor device includes a casing, a semiconductor die supported by the casing, at least one contact pad disposed on a bottom surface of the semiconductor device, and a plurality of external contacts extending from the casing and being coupled to the semiconductor die. The socket is coupled to the printed circuit board and adapted to receive the semiconductor device. The socket includes a first plurality of contacts adapted to interface with the external contacts of the semiconductor device and at least one base contact adapted to interface with the contact pad.

Abstract: An integrated circuit package includes a semiconductor die, a base, and a plurality of external contacts. The base is coupled to the semiconductor die and includes at least one contact pad coupled to the semiconductor die. The plurality of external contacts extend from the base and are coupled to the semiconductor die. A circuit assembly includes a printed circuit board, an integrated circuit package, and a socket. The integrated circuit package includes a semiconductor die, a base coupled to the semiconductor die, and a plurality of external contacts extending from the base and being coupled to the semiconductor die. The base includes at least one contact pad coupled to the semiconductor die. The socket is coupled to the printed circuit board and adapted to receive the base. A contact is adapted to interface with the contact pad and one of the printed circuit board and the socket.