Abstract: An exemplary micro-optical component includes a micro-substrate and a micro-optical element disposed on the micro-substrate. The micro-optical element is structured to modify or process light. At least a portion of a component tether is physically attached to the micro-substrate or physically attached to the micro-optical element. The micro-optical component has a thickness less than 250 ?m. Light can be processed by reflection, refraction, diffraction, frequency changes, polarization changes, color-temperature or frequency distribution changes, or phase changes. The micro-optical component can be disposed on a system substrate to form a micro-optical system. The system substrate can include a cavity and the micro-optical element can be disposed at least partially in the cavity. Micro-optical components can be passive optical micro-devices. A light-active element can be disposed on the micro-substrate to receive light from or emit light to the micro-optical element.

Abstract: A printed structure includes a target substrate and structures extending from a surface of the target substrate and a component disposed on the surface in alignment with the structures. The structures can be spatially separated independent structures. The component is non-native to the target substrate and can comprises a component substrate separate and independent from the target substrate. The component can be micro-transfer printed to the target substrate and can comprise a broken, fractured, or separated tether.

Abstract: An example of a method of making a heterogeneous semiconductor structure, includes providing a first substrate including a first material; providing a second substrate including a printable processable coupon, wherein the coupon includes a second material different from the first material; and printing the coupon to the first substrate. The method can includes processing the coupon on the first substrate to form an integrated circuit. An example of a heterogeneous structure includes a substrate including a first material and one or more non-native coupons disposed on the substrate, the coupon including a second material different from the first material. The second material can be or comprise an epitaxial material, such as a compound semiconductor material. The first material can be or comprise an elemental semiconductor, such as silicon.

Abstract: A micro-device structure comprises a source substrate comprising sacrificial portions laterally spaced apart by anchors. At least a portion of each of the sacrificial portions is exposed through an opening. A micro-device is disposed on (e.g., exclusively in direct contact with) each of the sacrificial portions and laterally attached to one of the anchors by a hybrid tether. The hybrid tether comprises an organic tether layer and an inorganic tether layer.