Abstract: A radio-frequency module includes a mounting substrate, a first filter, a second filter, a shield layer, and a conductor. The mounting substrate has a first main surface and a second main surface on opposite sides. The shield layer is disposed on an outer surface of a resin layer with which the first filter and the second filter are covered. The radio-frequency module is capable of performing simultaneous transmission by using both the first filter and the second filter. The conductor is disposed on the first main surface of the mounting substrate and is in contact with the transmitting filter and the mounting substrate. The conductor is in contact with the shield layer on a side other than a side closer to the second filter than to the first filter.

Abstract: A radio-frequency module includes a first inductor and a second inductor disposed on or above a major surface of a module substrate, a resin member, a metal shield layer covering a surface of the resin member, and a metal shield plate disposed on the major surface between the first inductor and the second inductor. The metal shield plate is in contact with a ground electrode of the major surface and the metal shield layer. The first inductor is disposed in any one of a transmitting path, a receiving path, and a transmitting and receiving path. The second inductor is disposed in any one of the transmitting path, the receiving path, and the transmitting and receiving path, other than the path in which the first inductor is disposed.

Abstract: A radio-frequency module is able to simultaneously communicate a signal of a first communication band and a signal of a second communication band and does not simultaneously communicate a signal of the first communication band and a signal of a third communication band. The radio-frequency module includes a mounting substrate, a filter, a filter, and a filter. The filter is provided on the mounting substrate and has the first communication band as the pass band thereof. The filter is provided on the mounting substrate and has the second communication band as the pass band thereof. The filter is provided on the mounting substrate and has the third communication band as the pass band thereof. The filter and the filter are indirectly stacked on top of each other and the filter and the filter are not stacked on top of each other.

Abstract: A radio frequency module includes: a module board including a first principal surface; a reception filter disposed on or above the first principal surface; a transmission filter disposed on the reception filter; a switch mounted on the module board; and a bonding wire that connects the transmission filter to the switch. One end of the bonding wire is connected to the transmission filter and the other end of the bonding wire is connected to the switch.

Abstract: A radio-frequency module includes a mounting substrate, a first power amplifier, a second power amplifier, a circuit component (IC chip), and an external connection terminal. The mounting substrate has a first main surface and a second main surface on opposite sides of the mounting substrate. The first power amplifier is mounted on the first main surface of the mounting substrate. The second power amplifier is mounted on the first main surface of the mounting substrate. The circuit component is mounted on the second main surface of the mounting substrate. The external connection terminal is disposed on the second main surface of the mounting substrate. The external connection terminal is connected to a power supply that supplies a power supply voltage to the first power amplifier and the second power amplifier.

Abstract: A radio-frequency module is able to simultaneously communicate a signal of a first communication band and a signal of a second communication band and does not simultaneously communicate a signal of the first communication band and a signal of a third communication band. The radio-frequency module includes a mounting substrate, a filter, a filter, and a filter. The filter is provided on the mounting substrate and has the first communication band as the pass band thereof. The filter is provided on the mounting substrate and has the second communication band as the pass band thereof. The filter is provided on the mounting substrate and has the third communication band as the pass band thereof. The filter and the filter are indirectly stacked on top of each other and the filter and the filter are not stacked on top of each other.

Abstract: A radio frequency module includes: a module board including a first principal surface; a reception filter disposed on or above the first principal surface; a transmission filter disposed on the reception filter; a switch mounted on the module board; and a bonding wire that connects the transmission filter to the switch. One end of the bonding wire is connected to the transmission filter and the other end of the bonding wire is connected to the switch.