Patents by Inventor Rui-Ting Zheng

Rui-Ting Zheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7948574
    Abstract: An exemplary bezel includes two generally L-shaped bezel parts and two generally I-shaped bezel parts. All the bezel parts are joined end-to-end to cooperatively define a window therebetween, and this assembly is configured to accommodate a display panel. A minimum area of a rectangular region that can be occupied by the two generally L-shaped bezel parts alone includes a central unoccupied portion sufficient in size to accommodate the two generally I-shaped bezel parts.
    Type: Grant
    Filed: October 29, 2007
    Date of Patent: May 24, 2011
    Assignees: Innocom Technology (ShenZhen) Co., Ltd., Chimei Innolux Corporation
    Inventors: I-Fee Chen, Rui-Ting Zheng, Xiao-Ming Cao, Chung-Shen Tang
  • Publication number: 20080100770
    Abstract: An exemplary bezel (200) includes two generally U-shaped bezel parts (2009, 2010) and two generally I-shaped bezel parts (2019, 2020). Each of the generally U-shaped bezel parts includes a first bezel portion (2011), a second bezel portion (2012) opposite to the first bezel portion and a third bezel portion (2013) between the first and second bezel portions. One of the generally I-shaped bezel parts is connected between the first bezel portions and the other one of the I-shaped bezel parts is connected between the second bezel portions.
    Type: Application
    Filed: October 29, 2007
    Publication date: May 1, 2008
    Inventors: I-Fee Chen, Rui-Ting Zheng, Xiao-Ming Cao, Chung-Shen Tang
  • Publication number: 20040250945
    Abstract: A method for bonding patterned imprint by transferring is disclosed, which comprises the following steps: (a) providing a first module having a molding substrate, a molding layer and a patterned molding features, and a second module having a substrate; wherein said molding layer and said patterned molding features are located on said molding substrate; (b) coating a release layer on said molding features; (c) filling a transfer layer into the recess which is located between the patterned molding features; (d) coating an adhesion layer on said substrate of said second module; (e) combining and contacting said second module and said first module together for transferring said transfer layer to said substrate of said second module; and (f) separating said second module from said first module.
    Type: Application
    Filed: September 29, 2003
    Publication date: December 16, 2004
    Applicant: Industrial Technology Research Institute
    Inventors: Rui-Ting Zheng, Hsi-Hsiang Lin, Hung-Yin Tsai, Chien-Chang Su, Chien-Yang Chen