Abstract: Transient voltage noise, including resistive and reactive noise, causes timing errors at runtime. A heuristic framework, Walking Pads, is introduced to minimize transient voltage violations by optimizing power supply pad placement. It is shown that the steady-state optimal design point differs from the transient optimum, and further noise reduction can be achieved with transient optimization. The methodology significantly reduces voltage violations by balancing the average transient voltage noise of the four branches at each pad site. When pad placement is optimized using a representative stressmark, voltage violations are reduced 46-80% across 11 Parsec benchmarks with respect to the results from IR-drop-optimized pad placement. It is shown that the allocation of on-chip decoupling capacitance significantly influences the optimal locations of pads.

Abstract: Transient voltage noise, including resistive and reactive noise, causes timing errors at runtime. A heuristic framework, Walking Pads, is introduced to minimize transient voltage violations by optimizing power supply pad placement. It is shown that the steady-state optimal design point differs from the transient optimum, and further noise reduction can be achieved with transient optimization. The methodology significantly reduces voltage violations by balancing the average transient voltage noise of the four branches at each pad site. When pad placement is optimized using a representative stressmark, voltage violations are reduced 46-80% across 11 Parsec benchmarks with respect to the results from IR-drop-optimized pad placement. It is shown that the allocation of on-chip decoupling capacitance significantly influences the optimal locations of pads.

Abstract: A virtual force controlled collapse chip connection (C4) pad placement optimization frame-work for 2D power delivery grids is proposed. The present optimization framework regards power pads as mobile “positive charged particles” and current resources as a “negative charged back-ground.” The virtual electrostatic force is calculated from voltage gradients. This optimization framework optimizes pad locations by moving pads according to the virtual forces exerted on them by other pads and current sources in the system. Within this framework, three algorithms are proposed to meet various requirements of optimization quality and speed. These algorithms minimize resistive voltage drop (IR drop), the maximum current density, and power distribution network metal power dissipation at the same time.

Abstract: Transient voltage noise, including resistive and reactive noise, causes timing errors at runtime. A heuristic framework, Walking Pads, is introduced to minimize transient voltage violations by optimizing power supply pad placement. It is shown that the steady-state optimal design point differs from the transient optimum, and further noise reduction can be achieved with transient optimization. The methodology significantly reduces voltage violations by balancing the average transient voltage noise of the four branches at each pad site. When pad placement is optimized using a representative stressmark, voltage violations are reduced 46-80% across 11 Parsec benchmarks with respect to the results from IR-drop-optimized pad placement. It is shown that the allocation of on-chip decoupling capacitance significantly influences the optimal locations of pads.

Abstract: A virtual force controlled collapse chip connection (C4) pad placement optimization frame-work for 2D power delivery grids is proposed. The present optimization framework regards power pads as mobile “positive charged particles” and current resources as a “negative charged back-ground.” The virtual electrostatic force is calculated from voltage gradients. This optimization framework optimizes pad locations by moving pads according to the virtual forces exerted on them by other pads and current sources in the system. Within this framework, three algorithms are proposed to meet various requirements of optimization quality and speed. These algorithms minimize resistive voltage drop (IR drop), the maximum current density, and power distribution network metal power dissipation at the same time.

Abstract: Transient voltage noise, including resistive and reactive noise, causes timing errors at runtime. A heuristic framework, Walking Pads, is introduced to minimize transient voltage violations by optimizing power supply pad placement. It is shown that the steady-state optimal design point differs from the transient optimum, and further noise reduction can be achieved with transient optimization. The methodology significantly reduces voltage violations by balancing the average transient voltage noise of the four branches at each pad site. When pad placement is optimized using a representative stressmark, voltage violations are reduced 46-80% across 11 Parsec benchmarks with respect to the results from IR-drop-optimized pad placement. It is shown that the allocation of on-chip decoupling capacitance significantly influences the optimal locations of pads.