Abstract: Methods for preparing a patterned metal/metal oxide layer by using a solution type precursor or sol-gel precursor are provided and, especially, a method for preparing a patterned carrier transport of a solar cell and a method for preparing biomedical material are provided, which comprise the following steps: (A) providing a substrate, and a mold with designed patterns formed thereon; (B) coating the substrate with a solution of a precursor to form a precursor layer, wherein the precursor is a metal precursor or a metal oxide precursor; (C) pressing the mold together with the precursor layer to transfer the patterns of the mold onto the precursor layer; (D) curing or pre-curing the precursor layer; (E) removing the mold; and (F) conducting an optional post-treatment, if it being demanded, to further modify the properties of precursor layer.

Abstract: Methods for preparing a patterned metal/metal oxide layer by using a solution type precursor or sol-gel precursor are provided and, especially, a method for preparing a patterned carrier transport of a solar cell and a method for preparing biomedical material are provided, which comprise the following steps: (A) providing a substrate, and a mold with designed patterns formed thereon; (B) coating the substrate with a solution of a precursor to form a precursor layer, wherein the precursor is a metal precursor or a metal oxide precursor; (C) pressing the mold together with the precursor layer to transfer the patterns of the mold onto the precursor layer; (D) curing or pre-curing the precursor layer; (E) removing the mold; and (F) conducting an optional post-treatment, if it being demanded, to further modify the properties of precursor layer.

Abstract: A method for forming a patterned modified metal layer is disclosed, which comprises the following steps: (A) providing a metal base which is in the form of either a bulk metal or a metal coated substrate, and a mold with patterns; (B) applying the mold onto the metal base to transfer the patterns of the mold to the metal surface; (C) removing the mold; and (D) modifying the whole metal base or the, surface and a certain depth beneath the surface of metal base to form a modified metal layer with designated patterns.