Patents by Inventor Ruomiao Wang

Ruomiao Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MULTILAYER ADHESIVE FOR THERMAL REVERSIBLE JOINING OF SUBSTRATES
    Publication number: 20080292848
    Abstract: One embodiment of the invention includes a multilayer dry adhesive system capable of reversible joining of rigid substrates.
    Type: Application
    Filed: October 4, 2007
    Publication date: November 27, 2008
    Applicant: GM Global Technology Operations, Inc.
    Inventors: Tao Xie, Xingcheng Xiao, Ruomiao Wang, Hamid G. Kia, Jessica A. Schroeder, Todd E. Durocher
  • ATTACHMENT PAD WITH THERMAL REVERSIBLE ADHESIVE AND METHODS OF MAKING AND USING THE SAME
    Publication number: 20080289757
    Abstract: One embodiment provides an attachment pad including a multilayer thermo-reversible adhesive including a shape memory polymer layer and a dry adhesive layer underlying the shape memory polymer layer, the multilayer thermo-reversible adhesive having a curved surface when the shape memory polymer layer is below its glass transition temperature and unaffected by a load; and a means for evenly applying a load and/or detaching force on the perimeter of the multilayer thermo-reversible adhesive including a spring.
    Type: Application
    Filed: April 18, 2008
    Publication date: November 27, 2008
    Applicant: GM GLOBAL TECHNOLOGY OEPRATIONS, INC.
    Inventors: Tao Xie, Xingcheng Xiao, Ruomiao Wang