Abstract: According to the invention, a device and a method for producing materials having a monocrystalline or multicrystalline structure are provided, in which a container is arranged between two pressure regions and the setting of the height of the melt in the container takes place via the setting of the differential pressure between the pressure regions. As a result, even particulate material can be fed continuously to the container and melted uniformly. Delivery material with high purity can also be pulled out of the container.

Abstract: A device and a method for handling rod-shaped elements on drilling gear are disclosed. The device for handling rod-shaped elements on drilling gear includes a drill rod magazine on which the rod components are deposited between a center of a drill hole and a center of a drilling mast, an elevator with a guide that lifts the drill rods above a drill hole, and a drive for displacing the elevator, a gripper attached to the elevator for picking up the rod component from the drill rod magazine, and a plurality of monitors. The plurality of monitors automatically monitor the movement of the rod-shaped components amongst the magazine, the elevator, and the gripper.

Abstract: According to the invention, a device and a method for producing materials having a monocrystalline or multicrystalline structure are provided, in which a container is arranged between two pressure regions and the setting of the height of the melt in the container takes place via the setting of the differential pressure between the pressure regions. As a result, even particulate material can be fed continuously to the container and melted uniformly. Delivery material with high purity can also be pulled out of the container.

Abstract: The invention relates to a device and a method for handling rod-shaped elements on drilling gear. The safety is inter alia increased by a device and a method wherein rod-shaped elements are placed on a placement device in defined positions and under defined conditions, the rod-shaped elements are separated on the placement device while being monitored, their safe support on a gripper is checked and once the elements are handed over to an elevator this action is confirmed.

Abstract: A method and a device for polishing disk shaped workpieces, has semiconductor wafers fixed on carrier plates, the carrier plates being pressed against a polishing plate, over which a polishing cloth is stretched, by means of polishing heads, and the polishing heads are accommodated in a polishing-plate superstructure. The carrier plates, following a polishing operation, are simultaneously lifted off the polishing plate by means of lifting devices in the polishing heads. The polishing-plate superstructure is displaced, together with the carrier plates, along a linear guide above a polishing line.