Abstract: A system and method for measuring lubricant thickness and degradation, carbon wear and carbon thickness, and surface roughness and debris on thin film magnetic disks at angles that are not substantially Brewster's angle of the thin film (carbon) protective overcoat in a high temperature environment. A focused optical light whose polarization can be switched between P or S polarization is incident at an angle to the surface of the thin film magnetic disk. The polarization switch can be accomplished using a temperature compensated quartz half plate. The range of angles can be from zero degrees from normal to near Brewster's angle and from an angle greater than Brewster's angle to 90 degrees. This range of angles allows the easy measurement of the change in lubricant thickness due to the interaction of the thin film head, the absolute lubricant thickness and degradation of the lubricant. It also allows the measurement of changes in carbon thickness and the absolute carbon thickness.

Abstract: A system and method for measuring lubricant thickness and degradation, carbon wear and carbon thickness, and surface roughness of thin film magnetic disks at angles that are not substantially Brewster's angle of the thin film (carbon) protective overcoat. A focused optical light whose polarization can be switched between P or S polarization is incident at an angle to the surface of the thin film magnetic disk. The range of angles can be from zero degrees from normal to near Brewster's angle and from an angle greater than Brewster's angle to 90 degrees. This range of angles allows the easy measurement of the change in lubricant thickness due to the interaction of the thin film head, the absolute lubricant thickness and degradation of the lubricant. It also allows the measurement of changes in carbon thickness and the absolute carbon thickness. The surface roughness can also be measured at any of the angles specified above.

Abstract: A system and method for measuring lubricant thickness and degradation, carbon wear and carbon thickness, and surface roughness of thin film magnetic disks at angles that are not substantially Brewster's angle of the thin film (carbon) protective overcoat. A focused optical light whose polarization can be switched between P or S polarization is incident at an angle to the surface of the thin film magnetic disk. The range of angles can be from zero degrees from normal to near Brewster's angle and from an angle greater than Brewster's angle to 90 degrees. This range of angles allows the easy measurement of the change in lubricant thickness due to the interaction of the thin film head, the absolute lubricant thickness and degradation of the lubricant. It also allows the measurement of changes in carbon thickness and the absolute carbon thickness. The surface roughness can also be measured at any of the angles specified above.

Abstract: A profilometer has a constant force mechanism for biasing of the stylus arm. The mechanism has a centrally-aligned configuration of the moving magnet relative to the magnetic coil and also has a magnetic shield isolating these elements from other ferromagnetic materials in the assembly. The moving magnet is made of a material that is hard magnetically and the magnetic shield is made of a series of low hysteresis, high permeability materials. The force thus generated by the stylus biasing device is very linear with the drive current upon the magnetic coil at any particular position of the stylus, thereby allowing for control and predictability of the stylus force upon the surface to be profiled. This predictability is used for dynamic stylus force adjustments during profiling of a specimen. The profilometer is also equipped with a balanced, spring-loaded stylus-stabilizing sensor assembly, task-specific dual-view optics for protection of the delicate stylus assembly, and a temperature drift compensator.

Abstract: A wafer handler featuring a carriage movable along a rail path, the carriage supporting an upright rotatable arm with a cantilevered wafer chuck. Elevators for raising and lowering trays containing wafer stacks are disposed on either side of the rail path. Each elevator has a curved track section which may be interposed along the rail path. The upright arm has a track follower, parallel to a boom supporting the wafer chuck and freely movable along the rail path, except when it encounters a curved track section. In this instance, the track follower will follow the curved track section, causing rotation of the arm, boom and wafer chuck, bringing the chuck into the wafer stack at an elevation determined by the elevator. In this manner, motion in the X, Y and Z planes may be provided for stacked wafers over extended distances.