Abstract: The physical movement of reticles and solder bump masks within a wafer processing plant are continually tracked and documented in a historical database for the useful life of the reticles or masks. In an example embodiment of the mask tracking method, the method includes moving the masks from one location to another in mask pods. In addition, a mask data set is generated for each mask composed of a mask identification code cross-referenced to a pod identification code and the mask data sets are processed by a computer arrangement. The mask data sets are then updated in the computer arrangement to include a facility location identification code as each mask moves to a subsequent location during wafer processing. The present invention provides the advantage that wafer lots and reticles can be matched to an event on the processing line and stored as data for later review and analysis.

Abstract: Management of move requests from a factory system to an automated handling system (AMHS) is provided. In one embodiment, a method and system is provided which includes receiving a move request from the factory system and selectively passing the move request to the AMHS based on a comparison of the move request with one or more conditions of the AMHS. The move request may be selectively passed to the AMHS by, for example, passing the move request to the AMHS without modification, changing a destination tool identified in the move request and/or delaying the move request, or canceling the move request. By selectively passing the move request based on conditions of the AMHS, move requests can more efficiently be managed and the throughput of the automated material handling system can be increased.

Abstract: Tracking the movement of individual wafers in a semiconductor processing system is improved by using an apparatus to axially rotate a wafer and using both the rotation angle and the wafer's location in the processing system as tracking coordinates. In an example embodiment, the apparatus imparts angles of rotation on the wafers in different stages of wafer processing. The rotation angles of each wafer are collected as data along with the wafer's location in the process. The combined wafer location and angle of rotation data are used to map the path the wafer has traveled from the onset of processing. An important advantage to this apparatus is the increased control and improved yields that the apparatus brings to wafer processing.

Abstract: Management of move requests from a factory system to an automated handling system (AMHS) is provided. In one embodiment, a method and system is provided which includes receiving a move request from the factory system and selectively passing the move request to the AMHS based on a comparison of the move request with one or more conditions of the AMHS. The move request may be selectively passed to the AMHS by, for example, passing the move request to the AMHS without modification, changing a destination tool identified in the move request and/or delaying the move request, or canceling the move request. By selectively passing the move request based on conditions of the AMHS, move requests can more efficiently be managed and the throughput of the automated material handling system can be increased.

Abstract: The detection of a processing deviation in a cluster tool of a wafer processing system is achieved by assigning individual wafers a set of positional coordinates each time the wafer moves within the cluster tool. In an example embodiment, a wafer is placed into a first chamber of the cluster tool and it is rotated to a certain angle of rotation. Each time the wafer moves within the cluster tool the wafer is given a different angle of rotation; both the rotation angle and the wafer location are then recorded as a set of positional coordinates. The wafer exits the cluster tool and is examined for structural or surface defects that indicate that there was a variation in the processing parameters. A wafer movement map is developed from the positional coordinates and the map is then used as an analysis tool to identify the processing location that caused defect to occur. An important advantage is the increased control and traceability that the tracking method brings to single wafer handling and processing.

Abstract: Reticles are selected for use in a wafer processing system based on the wafer-processing recipe and on the level of degradation exhibited by the reticle after multiple exposures to light and constant physical handling. In an example embodiment of an integrated reticle sorter and stocker, a scanner identifies the reticle and gathers dimensional data on each reticle. A sorter sorts reticles within reticle pods according to the processing recipe and stores the pods within a storage location in the stocker. A computer arrangement then records information from the scanner and the sorter and assesses whether any of the reticles has degraded beyond an acceptable level of usage.

Abstract: A system for verifying the integrity of components moving within a material handling system ensures that only components of acceptable integrity and condition are allowed to move onto the processing locations of a semiconductor plant. In an example embodiment, components that are warped or cracked are initially detected and scanned by a beam break system and/or an optical system. An integrity verification assessment is made immediately on the component to determine whether the scanned component meets with a predefined baseline parameter or characteristic. The components that do not pass integrity verification are then removed from the material handling system while the components that pass move on to the first processing location.

Abstract: Wafer processing time and handling is reduced by coupling a retrofitable processing tool between two standard processing tools. In an example embodiment, the retrofitable tool includes a metrology unit, which is coupled between two processing tools, that provides metrology capability without having to remove the wafers from the processing line. Once the metrology process is complete the wafers are transferred to the next processing tool and the retrofitable tool is decoupled from the two processing tools. An important advantage is the increased processing flexibility that the processing line reconfiguration method and the retrofitable tool bring to wafer processing.

Abstract: A system and method for stocking and sorting reticles used in a semiconductor fabrication facility, the facility having a material handling system that presents a reticle to a photolithography process area. In an example embodiment of the reticle management system, a reticle storage system and a reticle sorting apparatus are coupled to a host system that is adapted to track and control the movement of reticles in the material handling system. The host system is capable of interfacing with a management input module that integrates management directives into the reticle flow plan in the manufacturing process. The result is a reticle management system that is flexible enough to manage a finite number of reticles and pods in minimizing the delivery time of a reticle to the desired location while responding to changing conditions external to the manufacturing process.

Abstract: An apparatus and a system for stocking and sorting wafers in a wafer processing system reduce cycle time in manufacturing and reduce excessive handling of delicate wafers. In an example embodiment, the apparatus includes in an enclosure having therein a scanner adapted to identify codes located on the wafer carriers that indicate the position of a wafer within the carrier. A sorting mechanism for sorting wafers and carriers within the enclosure is also included as well as a computer arrangement that communicates with the management system of the wafer processing system. One of the advantages of the present invention is the reduction in cycle time that is achieved by sorting wafers immediately on demand while at a stocking location.

Abstract: The physical movement of reticles and solder bump masks within a wafer processing plant are continually tracked and documented in a historical database for the useful life of the reticles or masks. In an example embodiment of the mask tracking method, the method includes moving the masks from one location to another in mask pods. In addition, a mask data set is generated for each mask composed of a mask identification code cross-referenced to a pod identification code and the mask data sets are then stored in a computer arrangement. The mask data sets are then updated in the computer arrangement to include a facility location identification code as each mask moves to a subsequent location during wafer processing. An important advantage is that wafer lots and reticles can now be matched to an event on the processing line and stored as data for later review and analysis.

Abstract: An apparatus for identification of work pieces and protection of equipment used to operate on the work pieces in a computer controlled manufacturing arrangement. The equipment to be protected includes at least one receptacle for holding a work piece, and the apparatus comprises a rail and an electronic sensor mounted to the rail. The rail is shaped to generally to surround a selected portion of the equipment and is arranged to be supported proximate the equipment to deflect objects from the equipment. The electronic sensor is mounted to the rail at a location to sense a work piece in the receptacle and arranged to be coupled to the computer.