Abstract: Improved lighting packages are described for light emitting diode (LED) lighting solutions having a wide variety of applications which seek to balance criteria such as heat dissipation, brightness, and color uniformity. The present approach includes a backing of thermally conductive material. The backing includes a cell structure. The cell structure comprises a plurality of hollow cells contiguously positioned in a side by side manner. The present approach also includes an array of LEDs. The array of LEDs is mounted to a printed circuit board (PCB). The PCB is attached to the cell structure to balance heat dissipation and color uniformity of the LEDs.