Patents by Inventor Russell E. Winstead

Russell E. Winstead has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6272324
    Abstract: An electrical connector establishes electrical connection between transceiver electronics disposed in a main body of the phone and remote electrical components contained in a movable cover. One or more fixed contacts operatively connected to the transceiver electronics are disposed on the main body of the phone. Movable contacts operatively connected to the remote electrical components are disposed on the cover. The movable contacts on the cover engage the fixed contacts on the main body when the cover is in the open and closed positions. Commutating contacts can be used to maintain a continuous connection as the cover travels between open and closed positions.
    Type: Grant
    Filed: September 28, 1998
    Date of Patent: August 7, 2001
    Assignee: Ericsson Inc.
    Inventors: Charles A. Rudisill, Gerard J. Hayes, Russell E. Winstead
  • Patent number: 5377961
    Abstract: A system is provided for depositing an extremely small amount of solder on a printed circuit board by varying the direction of an electric current applied to a solder stream. The force exerted on the solder can be substantially instantaneously reversed without the necessity of changing the form of the energy applied to the solder from electrical to vibratory, ultrasonic, magnetic, or the like. The direction and magnitude of the force is related to the cross product of an electric current vector and a magnetic field vector (F=I.times.B). A programmable current source is used to place an electric current through the liquid solder as it is flowing through a conduit. A magnetic coil is disposed adjacent the conduit in order to provide a magnetic field in the same plane as the electric current. The conduit supplies liquid solder to a nozzle which then deposits a droplet of solder onto a printed circuit board.
    Type: Grant
    Filed: April 16, 1993
    Date of Patent: January 3, 1995
    Assignee: International Business Machines Corporation
    Inventors: Ted M. Smith, Russell E. Winstead