Patents by Inventor Russell Kastberg

Russell Kastberg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ASSEMBLY OF A CHIP TO A SUBSTRATE
    Publication number: 20240063171
    Abstract: An exemplary method includes at a bonding temperature, bonding a semiconductor chip to an organic laminate substrate using solder; without cooldown from the bonding temperature to room temperature, at an underfill dispense temperature, dispensing underfill between the semiconductor chip and the organic laminate substrate; and curing the underfill within a range of temperatures above the underfill dispense temperature. Another exemplary method includes depositing a first solder on pads of an organic laminate substrate; contacting a second solder on pillars of a semiconductor chip to the first solder on the pads of the organic laminate substrate; and solder bonding the semiconductor chip to the organic laminate substrate.
    Type: Application
    Filed: October 30, 2023
    Publication date: February 22, 2024
    Inventors: Katsuyuki Sakuma, Mukta Ghate Farooq, Paul S. Andry, Russell Kastberg
  • Assembly of a chip to a substrate
    Patent number: 11824037
    Abstract: An exemplary method includes at a bonding temperature, bonding a semiconductor chip to an organic laminate substrate using solder; without cooldown from the bonding temperature to room temperature, at an underfill dispense temperature, dispensing underfill between the semiconductor chip and the organic laminate substrate; and curing the underfill within a range of temperatures above the underfill dispense temperature. Another exemplary method includes depositing a first solder on pads of an organic laminate substrate; contacting a second solder on pillars of a semiconductor chip to the first solder on the pads of the organic laminate substrate; and solder bonding the semiconductor chip to the organic laminate substrate.
    Type: Grant
    Filed: December 31, 2020
    Date of Patent: November 21, 2023
    Assignee: International Business Machines Corporation
    Inventors: Katsuyuki Sakuma, Mukta Ghate Farooq, Paul S. Andry, Russell Kastberg
  • ASSEMBLY OF A CHIP TO A SUBSTRATE
    Publication number: 20220208719
    Abstract: An exemplary method includes at a bonding temperature, bonding a semiconductor chip to an organic laminate substrate using solder; without cooldown from the bonding temperature to room temperature, at an underfill dispense temperature, dispensing underfill between the semiconductor chip and the organic laminate substrate; and curing the underfill within a range of temperatures above the underfill dispense temperature. Another exemplary method includes depositing a first solder on pads of an organic laminate substrate; contacting a second solder on pillars of a semiconductor chip to the first solder on the pads of the organic laminate substrate; and solder bonding the semiconductor chip to the organic laminate substrate.
    Type: Application
    Filed: December 31, 2020
    Publication date: June 30, 2022
    Inventors: Katsuyuki Sakuma, Mukta Ghate Farooq, Paul S. Andry, Russell Kastberg