Abstract: A method and apparatus for substrate processing at lower cost than existing processing systems are disclosed, which by implementing an arrangement using load locks of smaller dimensions or of a non-indexing type, as compared to existing large dimension or indexing load locks, along with a substrate loading and unloading technique can achieve the fast throughput of existing systems while reducing the size and cost of the load lock apparatus required. A processed substrate is returned by an internal robot from one of its processing modules to the shelf or slot in the small load lock from which the last substrate was removed for processing by the robot, rather than being returned to the original source shelf or slot from which it was removed for processing, as in the prior art. Also venting for a first one of the load locks is started as soon as the second load lock becomes the substrate source for the internal robot rather than waiting until the first load lock has been refilled with processed substrates.

Abstract: Gas-loaded thermal conditioning is used to cause the temperature of a substrate to approach that of a high thermal inertia temperature-controlled plate by adjustable pressure of gas above the substrate, so as to press the substrate against the plate. There is no mechanical contact with the substrate except the plate which it rests on, and there is no danger of overheating or overcooling.