Abstract: CMC articles and methods for forming CMC articles are provided. In one example aspect, a method for forming a CMC article includes forming a CMC preform defining a first section and a second section. The first section has one or more plies that include sacrificial fibers. The second section of the CMC preform does not include sacrificial fibers. The first and second sections can be laid up to form the CMC prior to thermally processing, e.g., consolidation, firing, and infiltration. When the CMC preform is fired or burned out, the sacrificial fibers are removed or decomposed resulting in formation of channels within the first section of the pyrolyzed CMC preform. The channels are used as gas transport paths during chemical vapor infiltration to facilitate infiltration of a gaseous infiltrant into the fired CMC preform. The channels are then backfilled with a liquid infiltrant during a melt infiltration process.

Abstract: Disclosed herein are methods of forming substantially crystalline, dense silicon carbide fibers from infusible polysilazane fibers by utilizing a single stage pyrolysis. The pyrolysis is performed using a continuous process in a single furnace with a constant atmospheric condition. Also disclosed are substantially crystalline, dense silicon carbide fibers formed by these methods.

Abstract: Methods of producing low-halogen-containing polysilazane resins, which are used to make silicon carbide fibers and ceramic coatings, provide processes for removing halogens, including chlorine, from precursor polysilazane resins.

Abstract: Disclosed herein are methods of curing silicon carbide precursor polymer fibers, such as polysilazanes, using moisture and free radical generators, such as peroxides. Also disclosed are methods of forming, curing, and using silicon carbide precursor polymers that contain alkenyl groups and free radical generators, such as peroxides.

Abstract: The present disclosure generally relates to methods of using boron-containing additives for crosslinking polysilazane green fibers, which are precursors to silicon carbide fibers. These methods provide a controllable process for crosslinking silicon carbide fibers while providing a simple way for the introduction of boron as a sintering aid into the polymer structure.

Abstract: Disclosed herein are methods of curing silicon carbide precursor polymer fibers, such as polysilazanes, using moisture and free radical generators, such as peroxides. Also disclosed are methods of forming, curing, and using silicon carbide precursor polymers that contain alkenyl groups and free radical generators, such as peroxides.

Abstract: The present disclosure generally relates to methods of using boron-containing additives for crosslinking polysilazane green fibers, which are precursors to silicon carbide fibers. These methods provide a controllable process for crosslinking silicon carbide fibers while providing a simple way for the introduction of boron as a sintering aid into the polymer structure.

Abstract: A cure catalyst is provided. The cure catalyst may include a Lewis acid and one or both of a nitrogen-containing molecule or a non-tertiary phosphine. The nitrogen-containing molecule may include a mono amine or a heterocyclic aromatic organic compound. A curable composition may include the cure catalyst. An electronic device may include the curable composition. Methods associated with the foregoing are provided also.

Abstract: A method for making a thermal interface structure is provided. The method may include disposing a thermal transport layer on a resin layer to form a stacked structure, and slicing the stacked structure to form a cross-sectional slice having a first exposed portion of the thermal transport layer on a first surface of the slice, and a second exposed portion of the thermal transport layer on the second surface of the slice.

Abstract: A method is provided for making an interconnect structure. The method includes applying a removable layer to an electronic device or to a base insulative layer; applying an adhesive layer to the electronic device or to the base insulative layer; and securing the electronic device to the base insulative layer using the adhesive layer.

Abstract: A method is provided for making an interconnect structure. The method includes applying a low-temperature removable layer and adhesive layer to an electronic device or to a base insulative layer; and securing the electronic device to the base insulative layer using the adhesive layer.

Abstract: An electronic component includes a base insulative layer having a first surface and a second surface; an electronic device having a first surface and a second surface, and the electronic device being secured to the base insulative layer; an adhesive layer disposed between the first surface of the electronic device and the second surface of the base insulative layer; and a removable layer disposed between the first surface of the electronic device and the second surface of the base insulative layer. The base insulative layer secures to the electronic device through the removable layer. The removable layer releases the base insulative layer from the electronic device at a sufficiently low temperature.

Abstract: An electronic component includes a base insulative layer having a first surface and a second surface; an electronic device having a first surface and a second surface, and the electronic device being secured to the base insulative layer; an adhesive layer disposed between the first surface of the electronic device and the second surface of the base insulative layer; and a removable layer disposed between the first surface of the electronic device and the second surface of the base insulative layer. The base insulative layer secures to the electronic device through the removable layer. The removable layer is capable of releasing the base insulative layer from the electronic device. The removal may be done without damage to a predetermined part of the electronic component.

Abstract: An underfill composition including a polymer precursor is provided. The polymer precursor includes 4 or more pendant oxetane functional groups. The underfill composition includes greater than about 20 weight percent of the polymeric precursor. Associated article and method are also provided.

Abstract: An underfill composition including a polymer precursor is provided. The polymer precursor includes an inorganic backbone and one or more pendant oxetane functional groups. Associated article and method are also provided.

Abstract: A composition including a first curable and a second curable material is provided. The first curable material may include an alcohol and an anhydride. At a first temperature (T1) the first curable material may cures and the second curable material may not cure. An associated method is provided.

Abstract: A syneretic composition is provided. The syneretic composition includes a first curable material comprising an alcohol and an anhydride, and a second curable material. At a first temperature (T1) the first curable material cures to form a polymeric matrix, and the second curable material has a degree of conversion that is less than 50 percent. The second curable material is liquid and capable of exuding from the polymeric matrix at a syneresis temperature (Tsyn). A method and an article are provided also.

Abstract: A thermal transport structure having a thermal transport layer and a resin layer is provided. The thermal transport layer may include a first surface and a second surface, and having a thermally conductive material disposed in the thermal transport layer, where the thermally conductive material is oriented in a predetermined direction in order to facilitate heat conduction relative to the predetermined direction. Further, the resin layer is secured to the thermal transport layer second surface, where the resin layer is relatively less thermally conductive than the thermal transport layer.

Abstract: A method for brominating hydroxyaromatic compounds to form products, such as p-bromophenol, is disclosed. The method uses elemental bromine as the brominating agent and comprises contacting a hydroxyaromatic compound with bromine and oxygen in the presence of metal catalyst. Suitable catalysts include elemental copper, copper compounds, and compounds of Group IV–VIII transition metals.

Abstract: Brominated hydroxyaromatic compounds such as p-bromophenol are prepared by contacting a hydroxyaromatic compound with oxygen and a bromine source such as hydrogen bromide or an alkali metal or alkaline earth metal bromide in an acidic medium, in the presence of elemental copper or a copper compound as catalyst. The brominated product of this reaction may be converted alternately to a dihydroxyaromatic compound such as hydroquinone by hydrolyses, or a dihydroxybiphenyl compound such as 4,4?-dihydroxybiphenyl by reductive coupling.