Patents by Inventor Ryan COUTTS

Ryan COUTTS has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10188015
    Abstract: The disclosure generally relates to a hybrid design whereby a heat spreader arranged to reduce an external skin temperature on a handheld device may further enable the external skin temperature to be directly measured. For example, the heat spreader may be thermally coupled to at least one external surface and include at least one region in which a plurality of recesses are formed such that an electrical resistance is produced in the at least one region when a current is applied thereto. The heat spreader may be formed from a material having a substantially linear resistance-to-temperature correlation, whereby the electrical resistance produced in the at least one region may be measured and correlated to a temperature on the at least one external surface.
    Type: Grant
    Filed: September 20, 2016
    Date of Patent: January 22, 2019
    Assignee: QUALCOMM Incorporated
    Inventors: Mehdi Saeidi, Rajat Mittal, Ryan Coutts
  • Publication number: 20180143862
    Abstract: A method includes generating temperature information from a plurality of temperature sensors within a computing device, wherein a first one of the temperature sensors is physically located at a first processing unit of the computing device; processing the temperature information to identify that the first temperature sensor is associated with temperature that is at or above a threshold; and assigning a processing thread to a first core of a plurality of cores of a second processing unit in response to identifying that the first temperature sensor is associated with temperature that is at or above the threshold and based at least in part on a physical distance between the first core and the first temperature sensor.
    Type: Application
    Filed: December 8, 2016
    Publication date: May 24, 2018
    Inventors: Mehdi Saeidi, Vivek Sahu, Taravat Khadivi, Ryan Coutts, Ronald Alton, Palkesh Jain, Rajat Mittal
  • Patent number: 9943008
    Abstract: An electronic device includes an integrated circuit, a flexible heat spreader, an actuator, and a controller. The actuator is coupled to the flexible heat spreader and the controller is configured to control the actuator between a first actuation mode and a second actuation mode. When in the first actuation mode, the actuator positions the flexible heat spreader with an air gap between the flexible heat spreader and the integrated circuit such that the flexible heat spreader is thermally separated from the integrated circuit to increase a thermal impedance between the flexible heat spreader and the integrated circuit. When in the second actuation mode, the actuator positions the flexible heat spreader in thermal contact with the integrated circuit without the air gap there between to reduce the thermal impedance between the flexible heat spreader and the integrated circuit.
    Type: Grant
    Filed: March 31, 2016
    Date of Patent: April 10, 2018
    Assignee: QUALCOMM Incorporated
    Inventors: Rajat Mittal, Mehdi Saeidi, Vivek Sahu, Ryan Coutts
  • Publication number: 20180084667
    Abstract: The disclosure generally relates to a hybrid design whereby a heat spreader arranged to reduce an external skin temperature on a handheld device may further enable the external skin temperature to be directly measured. For example, the heat spreader may be thermally coupled to at least one external surface and include at least one region in which a plurality of recesses are formed such that an electrical resistance is produced in the at least one region when a current is applied thereto. The heat spreader may be formed from a material having a substantially linear resistance-to-temperature correlation, whereby the electrical resistance produced in the at least one region may be measured and correlated to a temperature on the at least one external surface.
    Type: Application
    Filed: September 20, 2016
    Publication date: March 22, 2018
    Inventors: Mehdi SAEIDI, Rajat MITTAL, Ryan COUTTS
  • Patent number: 9829941
    Abstract: A mobile device includes an exterior housing, a display, a capacitive sensor, a temperature sensor, and a controller. The capacitive sensor is coupled to the exterior housing at a backside of the mobile device and the temperature sensor is coupled to one or more components of the mobile device. The controller is coupled to the capacitive sensor and to the temperature sensor. The controller is configured to adjust a temperature threshold of the mobile device in response to detecting the presence of a case installed on the exterior housing. The controller is also configured to adjust one or more operating parameters of the mobile device to control a temperature of the exterior housing to below the temperature threshold based on the output of the capacitive sensor and one or more readings of the temperature sensor.
    Type: Grant
    Filed: August 19, 2016
    Date of Patent: November 28, 2017
    Assignee: QUALCOMM Incorporated
    Inventors: Mehdi Saeidi, Melika Roshandell, Rajat Mittal, Ryan Coutts
  • Publication number: 20170290194
    Abstract: An electronic device includes an integrated circuit, a flexible heat spreader, an actuator, and a controller. The actuator is coupled to the flexible heat spreader and the controller is configured to control the actuator between a first actuation mode and a second actuation mode. When in the first actuation mode, the actuator positions the flexible heat spreader with an air gap between the flexible heat spreader and the integrated circuit such that the flexible heat spreader is thermally separated from the integrated circuit to increase a thermal impedance between the flexible heat spreader and the integrated circuit. When in the second actuation mode, the actuator positions the flexible heat spreader in thermal contact with the integrated circuit without the air gap there between to reduce the thermal impedance between the flexible heat spreader and the integrated circuit.
    Type: Application
    Filed: March 31, 2016
    Publication date: October 5, 2017
    Inventors: Rajat MITTAL, Mehdi SAEIDI, Vivek SAHU, Ryan COUTTS