Abstract: The various technologies presented herein relate to measuring a signal generated by a die-based test circuit incorporated into an IC and utilizing the measured signal to authenticate the IC. The signal can be based upon a sensor response generated by the test circuit fabricated into the die, wherein the sensor response is based upon a property of the die material. The signal can be compared with a reference value obtained from one or more test circuit(s) respectively located on one or more reference dies, wherein the reference dies are respectively cut from different wafers, and the location at which the reference dies were cut is known. If the measured signal matches the reference value, the die is deemed to be from the same cut location as the dies from which the reference value was obtained. If the measured signal does not match the reference value, the die is not authenticated.

Abstract: The various technologies presented herein relate to measuring a signal generated by a die-based test circuit incorporated into an IC and utilizing the measured signal to authenticate the IC. The signal can be based upon a sensor response generated by the test circuit fabricated into the die, wherein the sensor response is based upon a property of the die material. The signal can be compared with a reference value obtained from one or more test circuit(s) respectively located on one or more reference dies, wherein the reference dies are respectively cut from different wafers, and the location at which the reference dies were cut is known. If the measured signal matches the reference value, the die is deemed to be from the same cut location as the dies from which the reference value was obtained. If the measured signal does not match the reference value, the die is not authenticated.

Abstract: The various technologies presented herein relate to measuring a signal generated by a die-based test circuit incorporated into an IC, and utilizing the measured signal to authenticate the IC. The signal can be based upon a sensor response generated by the test circuit fabricated into the die, wherein the sensor response is based upon a property of the die material. The signal can be compared with a reference value obtained from one or more test circuit(s) respectively located on one or more reference dies, wherein the reference dies are respectively cut from different wafers, and the location at which the reference dies were cut is known. If the measured signal matches the reference value, the die is deemed to be from the same cut location as the dies from which the reference value was obtained. If the measured signal does not match the reference value, the die is not authenticated.

Abstract: Described herein are various technologies pertaining to identifying counterfeit integrated circuits (ICs) by way of allowing the origin of fabrication to be verified. An IC comprises a main circuit and a test circuit that is independent of the main circuit. The test circuit comprises at least one ring oscillator (RO) signal that, when energized, is configured to output a signal that is indicative of a semiconductor fabrication facility where the IC was manufactured.

Abstract: The various technologies presented herein relate to enabling a value generated based upon a physical unclonable function (PUF) response to be available as needed, while also preventing exposure of the PUF to a malicious entity. A masked PUF response can be generated based upon applying a function to a combination of the PUF response and a data file (e.g., a bitstream), and the masked PUF response is forwarded to a requesting entity, rather than the PUF response. Hence, the PUF is masked from any entity requiring access to the PUF. The PUF can be located in a FPGA, wherein the data file is a bitstream pertinent to one or more configurable logic blocks included in the FPGA. A first masked PUF response generated with a first data file can have a different value to a second masked PUF response generated with a second data file.

Abstract: Described herein are various technologies pertaining to identifying counterfeit integrated circuits (ICs) by way of allowing the origin of fabrication to be verified. An IC comprises a main circuit and a test circuit that is independent of the main circuit. The test circuit comprises at least one ring oscillator (RO) signal that, when energized, is configured to output a signal that is indicative of a semiconductor fabrication facility where the IC was manufactured.

Abstract: An integrated circuit (IC) based physically unclonable function (PUF) that comprises a common source amplifier for generating PUF output voltages, a unity gain, negative feedback operational amplifier for generating bias voltages, a voltage regulator and a bit exclusion circuit that excludes unstable PUF bits. Compensation circuitry built into the IC-PUF provides a high power supply rejection ratio and enables highly reliable operation of the IC-PUF across varying input voltages and operating temperatures. The IC-PUF generates a uniformly random output bit stream by taking advantage of process variations that are inherent to the fabrication of (metal-oxide semiconductor) MOS transistors.

Abstract: Described herein are various technologies pertaining to identifying counterfeit integrated circuits (ICs) by way of allowing the origin of fabrication to be verified. An IC comprises a main circuit and a test circuit that is independent of the main circuit. The test circuit comprises at least one ring oscillator (RO) signal that, when energized, is configured to output a signal that is indicative of a semiconductor fabrication facility where the IC was manufactured.

Abstract: The various technologies presented herein relate to pertaining to identifying and mitigating risks and attacks on a supply chain. A computer-implemented representation of a supply chain is generated comprising nodes (locations) and edges (objects, information). Risk to attack and different attack vectors can be defined for the various nodes and edges, and further, based upon the risks and attacks, (difficulty, consequence) pairs can be determined. One or more mitigations can be generated to increase a difficulty of attack and/or reduce consequence of an attack. The one or more mitigations can be constrained, e.g., by cost, time, etc., to facilitate determination of how feasible a respective mitigation is to implement with regard to finances available, duration to implement, etc. A context-free grammar can be utilized to identify one or more attacks in the supply chain. Further, the risks can undergo a ranking to enable mitigation priority to be determined.

Abstract: An apparatus for increasing security in inter-chip communication includes a sending control module, a communication bus, and a receiving control module. The communication bus is coupled between the sending control module and the receiving control module. The sending control module operates to send data on the communication bus, disable the communication bus when threats are detected, or both.

Abstract: The various technologies presented herein relate to performing on-chip frequency division of an operating frequency of a ring oscillator (RO). Per the various embodiments herein, a conflict between RO size versus operational frequency can be addressed by dividing the output frequency of the RO to a frequency that can be measured on-chip. A frequency divider circuit (comprising NOR gates and latches, for example) can be utilized in conjunction with the RO on the chip. In an embodiment, the frequency divider circuit can include a pair of latches coupled to the RO to facilitate dividing the oscillating frequency of the RO by 2. In another embodiment, the frequency divider circuit can include four latches (operating in pairs) coupled to the RO to facilitate dividing the oscillating frequency of the RO by 4. A plurality of ROs can be MUXed to the plurality of ROs by a single oscillation-counting circuit.

Abstract: Generating a physically a physically unclonable function (“PUF”) circuit value includes comparing each of first identification components in a first bank to each of second identification components in a second bank. A given first identification component in the first bank is not compared to another first identification component in the first bank and a given second identification component in the second bank is not compared to another second identification component in the second bank. A digital bit value is generated for each comparison made while comparing each of the first identification components to each of the second identification components. A PUF circuit value is generated from the digital bit values from each comparison made.

Abstract: An apparatus for increasing security in inter-chip communication includes a sending control module, a communication bus, and a receiving control module. The communication bus is coupled between the sending control module and the receiving control module. The sending control module operates to send data on the communication bus, disable the communication bus when threats are detected, or both.

Abstract: An apparatus for increasing security in inter-chip communication includes a sending control module, a communication bus, and a receiving control module. The communication bus is coupled between the sending control module and the receiving control module. The sending control module operates to send data on the communication bus, disable the communication bus when threats are detected, or both.