Patents by Inventor Ryan J. Lewis
Ryan J. Lewis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11988453Abstract: Some embodiments include a thermal management plane. The thermal management plane may include a top casing comprising a polymer material; a top encapsulation layer disposed on the top casing; a bottom casing comprising a polymer material; a bottom encapsulation layer disposed on the bottom casing; a hermetical seal coupling the bottom casing with the top casing; a wicking layer disposed between the bottom casing and the top casing; and a plurality of spacers disposed between the top casing and the bottom casing within the vacuum core, wherein each of the plurality of spacers have a low thermal conduction. In some embodiments, the thermal management plane has a thickness less than about 200 microns.Type: GrantFiled: February 7, 2022Date of Patent: May 21, 2024Assignee: KELVIN THERMAL TECHNOLOGIES, INC.Inventors: Ryan J. Lewis, Ronggui Yang, Yung-Cheng Lee
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Patent number: 11930621Abstract: Some embodiments include a thermal ground plane comprising a first and second casing with folding and non-folding regions. The thermal ground plane may also include a vapor structure and a mesh. The mesh may be disposed on an interior surface of the second casing and the mesh include a plurality of arteries extending substantially parallel with a length of the thermal ground plane. The folding region of the first casing may have an out-of-plane wavy structure. The valleys and peaks of the out-of-plane wavy structure, for example, may extend across a width of the first active region substantially parallel with a width of the thermal ground plane.Type: GrantFiled: June 18, 2021Date of Patent: March 12, 2024Assignee: Kelvin Thermal Technologies, Inc.Inventors: Ryan J. Lewis, Yung-Cheng Lee, Ali Nematollahisarvestani, Jason W. West, Kyle Wagner
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Publication number: 20230292466Abstract: Some embodiments include a thermal ground plane comprising a first and second casing with folding and non-folding regions. The thermal ground plane may also include a vapor structure and a mesh. The mesh may be disposed on an interior surface of the second casing and the mesh include a plurality of arteries extending substantially parallel with a length of the thermal ground plane. The folding region of the first casing may have an out-of-plane wavy structure. The valleys and peaks of the out-of-plane wavy structure, for example, may extend across a width of the first active region substantially parallel with a width of the thermal ground plane.Type: ApplicationFiled: June 18, 2021Publication date: September 14, 2023Inventors: Ryan J. Lewis, Yung-Cheng Lee, Ali Nematollahisarvestani, Jason W. West, Kyle Wagner
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Publication number: 20230096345Abstract: A phone case with a phone case body and a thermal ground plane is disclosed. The phone case, for example, may include fin that folds, bends, and/or extends outward from the phone case body. The phone case, for example, may include a magnetic area that comprises a toroid or donut shape. The phone case, for example, may include an aperture that extends through the phone case body and/or the thermal ground plane. The thermal ground plane may include a first casing; a liquid transport layer comprising a mesh or an array of pillars; a vapor transport layer comprising a mesh or an array of pillars; and a second casing, an outer periphery of the first casing and an outer periphery of the second casing are sealed together encasing the liquid transport layer, the vapor transport layer, and a heat transfer fluid.Type: ApplicationFiled: September 22, 2022Publication date: March 30, 2023Inventors: Ryan J. Lewis, Jason W. West, Daniel Katzman, Hunter Hach, Keller Lofgren
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Patent number: 11445636Abstract: A vapor chamber that includes a housing including a first sheet and a second sheet opposing each other and joined together at outer edges of the first sheet and the second sheet and defining a hollow vapor flow pass therein; a working fluid in the housing; a first wick in contact with the vapor flow pass; and a second wick between the first wick and an inner wall surface of at least one of the first sheet and the second sheet. The first wick defines a first liquid flow pass, the second wick defines a second liquid flow pass, and a first average diameter of the first liquid flow pass is smaller than or equal to 75% of a second average diameter of the second liquid flow pass.Type: GrantFiled: October 31, 2019Date of Patent: September 13, 2022Assignees: MURATA MANUFACTURING CO., LTD., KELVIN THERMAL TECHNOLOGIES, INC.Inventors: Takuo Wakaoka, Tatsuhiro Numoto, Keijiro Kojima, Ryan J. Lewis
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Publication number: 20220163268Abstract: Some embodiments include a thermal management plane. The thermal management plane may include a top casing comprising a polymer material; a top encapsulation layer disposed on the top casing; a bottom casing comprising a polymer material; a bottom encapsulation layer disposed on the bottom casing; a hermetical seal coupling the bottom casing with the top casing; a wicking layer disposed between the bottom casing and the top casing; and a plurality of spacers disposed between the top casing and the bottom casing within the vacuum core, wherein each of the plurality of spacers have a low thermal conduction. In some embodiments, the thermal management plane has a thickness less than about 200 microns.Type: ApplicationFiled: February 7, 2022Publication date: May 26, 2022Inventors: Ryan J. Lewis, Ronggui Yang, Yung-Cheng Lee
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Publication number: 20220074673Abstract: Some embodiments include a thermal management plane. The thermal management plane may include a top casing comprising a polymer material; a top encapsulation layer disposed on the top casing; a bottom casing comprising a polymer material; a bottom encapsulation layer disposed on the bottom casing; a hermetical seal coupling the bottom casing with the top casing; a wicking layer disposed between the bottom casing and the top casing; and a plurality of spacers disposed between the top casing and the bottom casing within the vacuum core, wherein each of the plurality of spacers have a low thermal conduction. In some embodiments, the thermal management plane has a thickness less than about 200 microns.Type: ApplicationFiled: November 17, 2021Publication date: March 10, 2022Inventors: Ryan J. Lewis, Ronggui Yang, Yung-Cheng Lee
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Publication number: 20210400846Abstract: Some embodiments include a thermal ground plane comprising a first and second casing with folding and non-folding regions. The thermal ground plane may also include a vapor structure and a mesh. The mesh may be disposed on an interior surface of the second casing and the mesh include a plurality of arteries extending substantially parallel with a length of the thermal ground plane. The folding region of the first casing may have an out-of-plane wavy structure. The valleys and peaks of the out-of-plane wavy structure, for example, may extend across a width of the first active region substantially parallel with a width of the thermal ground plane.Type: ApplicationFiled: June 18, 2021Publication date: December 23, 2021Inventors: Ryan J. Lewis, Yung-Cheng Lee, Ali Nematollahisarvestani, Jason W. West, Kyle Wagner
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Publication number: 20210136955Abstract: A vapor chamber that includes a housing including a first sheet and a second sheet opposing each other and joined together at outer edges of the first sheet and the second sheet and defining a hollow vapor flow pass therein; a working fluid in the housing; a first wick in contact with the vapor flow pass; and a second wick between the first wick and an inner wall surface of at least one of the first sheet and the second sheet. The first wick defines a first liquid flow pass, the second wick defines a second liquid flow pass, and a first average diameter of the first liquid flow pass is smaller than or equal to 75% of a second average diameter of the second liquid flow pass.Type: ApplicationFiled: October 31, 2019Publication date: May 6, 2021Inventors: TAKUO WAKAOKA, Tatsuhiro Numoto, Keijiro Kojima, Ryan J. Lewis
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Publication number: 20180320984Abstract: Some embodiments include a thermal management plane. The thermal management plane may include a top casing comprising a polymer material; a top encapsulation layer disposed on the top casing; a bottom casing comprising a polymer material; a bottom encapsulation layer disposed on the bottom casing; a hermetical seal coupling the bottom casing with the top casing; a wicking layer disposed between the bottom casing and the top casing; and a plurality of spacers disposed between the top casing and the bottom casing within the vacuum core, wherein each of the plurality of spacers have a low thermal conduction. In some embodiments, the thermal management plane has a thickness less than about 200 microns.Type: ApplicationFiled: May 8, 2018Publication date: November 8, 2018Inventors: Ryan J. Lewis, Ronggui Yang, Yung-Cheng Lee
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Patent number: 7486591Abstract: Low probability of marine mammal impact (LPMMI) sound signals have a modulation component selected to reduce a behavioral response from a marine mammal from that which would occur when transmitting another sound signal having approximately the same time duration component, approximately the same bandwidth component, and approximately the same center frequency component as the LPMMI waveform but having a modulation component comprising a frequency modulation.Type: GrantFiled: October 11, 2006Date of Patent: February 3, 2009Assignee: Raytheon CompanyInventors: James H. Rooney, III, Jesse T. Gratke, Ryan J. Lewis, Michael F. Janik, Thomas B. Pederson, William C. Zurawski, James H. Miller