Abstract: The present disclosure relates to a substrate apparatus (and methods of manufacturing the same) with one or more substrates having a substrate spacing for growing a cell mass. In particular embodiments, the disclosed substrate apparatus includes a substrate wound into a coiled configuration with an intra-coil spacing between coil layers. To provide the intra-coil spacing, certain implementations use a separator. For example, a separator is applied to a substrate surface, and the separator-substrate combination is wound together (e.g., around a spool). In turn, a locking element is attached to the substrate to maintain the coiled configuration. The separator is then removed via heat treatment, chemical treatment, or physical displacement—thereby leaving the intra-coil spacing between the coil layers. Alternatively, no separator is used to provide a substrate spacing. For example, in lieu of a separator, the locking element is actively applied to the substrate during the winding process.

Abstract: The present disclosure relates to a substrate apparatus (and methods of manufacturing the same) with one or more substrates having a substrate spacing for growing a cell mass. In particular embodiments, the disclosed substrate apparatus includes a substrate wound into a coiled configuration with an intra-coil spacing between coil layers. To provide the intra-coil spacing, certain implementations use a separator. For example, a separator is applied to a substrate surface, and the separator-substrate combination is wound together (e.g., around a spool). In turn, a locking element is attached to the substrate to maintain the coiled configuration. The separator is then removed via heat treatment, chemical treatment, or physical displacement—thereby leaving the intra-coil spacing between the coil layers. Alternatively, no separator is used to provide a substrate spacing. For example, in lieu of a separator, the locking element is actively applied to the substrate during the winding process.