Patents by Inventor Ryan M. Alderfer

Ryan M. Alderfer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10914535
    Abstract: A one-piece heat exchanger manufactured using an additive manufacturing process is described. The heat exchanger includes a plurality of channels formed therein. At least some of the plurality of channels may be configured to provide structural support to the heat exchanger to reduce its weight. Different coolant media may be used in a first set and a second set of the plurality of channels to provide different types of cooling in an integrated one-piece heat exchanger structure.
    Type: Grant
    Filed: October 3, 2017
    Date of Patent: February 9, 2021
    Assignee: Lockheed Martin Corporation
    Inventors: David L. Vos, Ryan M. Alderfer, Randall J. Stutzman
  • Patent number: 10816280
    Abstract: A one-piece heat exchanger manufactured using an additive manufacturing process is described. The heat exchanger includes a plurality of channels formed therein. At least some of the plurality of channels may be configured to provide structural support to the heat exchanger to reduce its weight. Different coolant media may be used in a first set and a second set of the plurality of channels to provide different types of cooling in an integrated one-piece heat exchanger structure.
    Type: Grant
    Filed: October 3, 2017
    Date of Patent: October 27, 2020
    Assignee: Lockheed Martin Corporation
    Inventors: David L. Vos, Ryan M. Alderfer, Matthew Daniel Miller
  • Patent number: 10527362
    Abstract: A one-piece heat exchanger manufactured using an additive manufacturing process is described. The heat exchanger includes a plurality of channels formed therein. At least some of the plurality of channels may be configured to provide structural support to the heat exchanger to reduce its weight. Different coolant media may be used in a first set and a second set of the plurality of channels to provide different types of cooling in an integrated one-piece heat exchanger structure.
    Type: Grant
    Filed: September 21, 2015
    Date of Patent: January 7, 2020
    Assignee: Lockheed Martin Corporation
    Inventors: David L. Vos, Ryan M. Alderfer, Matthew Daniel Miller
  • Patent number: 10461018
    Abstract: A one-piece heat exchanger manufactured using an additive manufacturing process is described. The heat exchanger includes a plurality of channels formed therein. At least some of the plurality of channels may be configured to provide structural support to the heat exchanger to reduce its weight. Different coolant media may be used in a first set and a second set of the plurality of channels to provide different types of cooling in an integrated one-piece heat exchanger structure.
    Type: Grant
    Filed: October 3, 2017
    Date of Patent: October 29, 2019
    Assignee: Lockheed Martin Corporation
    Inventors: David L. Vos, Ryan M. Alderfer, Randall J. Stutzman
  • Patent number: 10371462
    Abstract: A one-piece heat exchanger manufactured using an additive manufacturing process is described. The heat exchanger includes a plurality of channels formed therein. At least some of the plurality of channels may be configured to provide structural support to the heat exchanger to reduce its weight. Different coolant media may be used in a first set and a second set of the plurality of channels to provide different types of cooling in an integrated one-piece heat exchanger structure.
    Type: Grant
    Filed: September 21, 2015
    Date of Patent: August 6, 2019
    Assignee: Lockheed Martin Corporation
    Inventors: David L. Vos, Ryan M. Alderfer, Randall J. Stutzman
  • Patent number: 10112698
    Abstract: A deployment or hinge mechanism and, more particularly, a compact unmanned aerial vehicle (UAV) wing deployment mechanism is provided. The deployment mechanism includes a hinged mechanism that stows in a stacked configuration and deploys in a level configuration.
    Type: Grant
    Filed: June 3, 2016
    Date of Patent: October 30, 2018
    Assignee: LOCKHEED MARTIN CORPORATION
    Inventors: Nicholas L. Barnes, Ryan M. Alderfer, Timothy J. Marley, Stephen J. Schober
  • Publication number: 20180043482
    Abstract: A one-piece heat exchanger manufactured using an additive manufacturing process is described. The heat exchanger includes a plurality of channels formed therein. At least some of the plurality of channels may be configured to provide structural support to the heat exchanger to reduce its weight. Different coolant media may be used in a first set and a second set of the plurality of channels to provide different types of cooling in an integrated one-piece heat exchanger structure.
    Type: Application
    Filed: October 3, 2017
    Publication date: February 15, 2018
    Applicant: Lockheed Martin Corporation
    Inventors: David L. Vos, Ryan M. Alderfer, Matthew Daniel Miller
  • Publication number: 20180043480
    Abstract: A one-piece heat exchanger manufactured using an additive manufacturing process is described. The heat exchanger includes a plurality of channels formed therein. At least some of the plurality of channels may be configured to provide structural support to the heat exchanger to reduce its weight. Different coolant media may be used in a first set and a second set of the plurality of channels to provide different types of cooling in an integrated one-piece heat exchanger structure.
    Type: Application
    Filed: October 3, 2017
    Publication date: February 15, 2018
    Applicant: Lockheed Martin Corporation
    Inventors: David L. Vos, Ryan M. Alderfer, Randall J. Stutzman
  • Publication number: 20180043481
    Abstract: A one-piece heat exchanger manufactured using an additive manufacturing process is described. The heat exchanger includes a plurality of channels formed therein. At least some of the plurality of channels may be configured to provide structural support to the heat exchanger to reduce its weight. Different coolant media may be used in a first set and a second set of the plurality of channels to provide different types of cooling in an integrated one-piece heat exchanger structure.
    Type: Application
    Filed: October 3, 2017
    Publication date: February 15, 2018
    Applicant: Lockheed Martin Corporation
    Inventors: David L. Vos, Ryan M. Alderfer, Randall J. Stutzman
  • Publication number: 20170082372
    Abstract: A one-piece heat exchanger manufactured using an additive manufacturing process is described. The heat exchanger includes a plurality of channels formed therein. At least some of the plurality of channels may be configured to provide structural support to the heat exchanger to reduce its weight. Different coolant media may be used in a first set and a second set of the plurality of channels to provide different types of cooling in an integrated one-piece heat exchanger structure.
    Type: Application
    Filed: September 21, 2015
    Publication date: March 23, 2017
    Applicant: Lockheed Martin Corporation
    Inventors: David L. Vos, Ryan M. Alderfer, Matthew Daniel Miller
  • Publication number: 20170082371
    Abstract: A one-piece heat exchanger manufactured using an additive manufacturing process is described. The heat exchanger includes a plurality of channels formed therein. At least some of the plurality of channels may be configured to provide structural support to the heat exchanger to reduce its weight. Different coolant media may be used in a first set and a second set of the plurality of channels to provide different types of cooling in an integrated one-piece heat exchanger structure.
    Type: Application
    Filed: September 21, 2015
    Publication date: March 23, 2017
    Applicant: Lockheed Martin Corporation
    Inventors: David L. Vos, Ryan M. Alderfer, Randall J. Stutzman
  • Publication number: 20160355250
    Abstract: A deployment or hinge mechanism and, more particularly, a compact unmanned aerial vehicle (UAV) wing deployment mechanism is provided. The deployment mechanism includes a hinged mechanism that stows in a stacked configuration and deploys in a level configuration.
    Type: Application
    Filed: June 3, 2016
    Publication date: December 8, 2016
    Inventors: Nicholas L. Barnes, Ryan M. Alderfer, Timothy J. Marley, Stephen J. Schober