Abstract: The disclosure relates to a heat exchange compound module and a manufacturing method for a heat exchange compound module. The heat exchange compound module comprises a metal-ceramic substrate and a heat exchange structure. The metal-ceramic substrate comprises an outer layer of a first metallic material. The heat exchange structure is made of a second metallic material and is connected to the outer layer of the metal-ceramic substrate only by an eutectic bond between the first metallic material and the second metallic material.

Abstract: Processes for forming an electric heater comprise providing a heater element and a power supply, applying a layer of a diffusion solder paste onto the heater element and/or the power supply and drying the applied diffusion solder paste, arranging the heater element and the power supply such that the heater element and the power supply contact each other via the dried diffusion solder paste, and diffusion soldering the arrangement to form a connection between the heater element and the power supply. The diffusion solder paste comprises or consists of 10-30 wt.-% of at least one type of particles selected from the group consisting of copper particles, copper-rich copper/zinc alloy particles, and copper-rich copper/tin alloy particles, 60-80 wt.-% of at least one type of particles selected from tin particles, tin-rich tin/copper alloy particles, tin-rich tin/silver alloy particles, and tin-rich tin/copper/silver alloy particles, and 3-30 wt.-% of a solder flux.

Abstract: A process for forming an electric heater comprising the steps: (a) providing a heater element and a power supply, (b) applying a layer of a copper paste onto the heater element and/or the power supply and drying the applied layer of copper paste, (c1) applying a solder agent onto the dried copper paste and appropriately arranging the heater element and the power supply such that the heater element and the power supply contact each other by means of the dried copper paste and the solder agent or (c2) appropriately arranging the heater element and the power supply such that the heater element and the power supply contact each other by means of the dried copper paste, and applying a solder agent next to the dried copper paste or (c3) if in step (b) the copper paste has been applied only onto the heater element and then dried, applying a solder agent onto the power supply and appropriately arranging the heater element and the power supply such that the heater element and the power supply contact each other by me

Abstract: The disclosure relates to a heat exchange compound module and a manufacturing method for a heat exchange compound module. The heat exchange compound module comprises a metal-ceramic substrate and a heat exchange structure. The metal-ceramic substrate comprises an outer layer of a first metallic material. The heat exchange structure is made of a second metallic material and is connected to the outer layer of the metal-ceramic substrate only by an eutectic bond between the first metallic material and the second metallic material.

Abstract: A process for forming an electric heater comprising the steps: (a) providing a heater element and a power supply, (b) applying a layer of a copper paste onto the heater element and/or the power supply and drying the applied layer of copper paste, (c1) applying a solder agent onto the dried copper paste and appropriately arranging the heater element and the power supply such that the heater element and the power supply contact each other by means of the dried copper paste and the solder agent or (c2) appropriately arranging the heater element and the power supply such that the heater element and the power supply contact each other by means of the dried copper paste, and applying a solder agent next to the dried copper paste or (c3) if in step (b) the copper paste has been applied only onto the heater element and then dried, applying a solder agent onto the power supply and appropriately arranging the heater element and the power supply such that the heater element and the power supply contact each other by me

Abstract: The invention provides an electroconductive paste for use in forming an electrode on a silicon nitride substrate which includes at least two types of copper particles each having a different median particle diameter (d50), a glass frit comprising at least bismuth oxide, silicon oxide, and boron oxide, at least one adhesion promoting additive comprising aluminum oxide, cerium oxide, or combinations thereof, and an organic vehicle. The invention is also directed to an electroconductive paste for use in forming an electrode on an aluminum nitride substrate, which includes at least three types of copper particles each having a different median particle diameter (d50), a glass frit comprising at least bismuth oxide and silicon oxide, and boron oxide, at least one adhesion promoting additive comprising bismuth oxide, zinc oxide, titanium oxide, cerium oxide, or combinations thereof, and an organic vehicle.

Abstract: A dielectric glass composition suitable for use in an electronic device which comprises a sufficient amount of silicon dioxide to impart durability to the glass composition when subject to a humid environment, and one or more alkali metal oxides, wherein (i) the total content of the alkali metal oxides is at least about 10 wt % and no more than about 35 wt %, based upon 100% total weight of the glass composition, (ii) the median particle size (d50) of the glass composition is no more than about 5 ?m, and (iii) the glass composition has a coefficient of thermal expansion of at least about 10 ppm/K and no more than about 25 ppm/K, is provided.

Abstract: A dielectric tape suitable for use in an electronic device is provided. A dielectric slip composition comprises an organic vehicle and a dielectric glass composition comprising at least about 20 wt % and no more than about 50 wt % silicon dioxide, based upon 100% total weight of the glass composition, at least about 10 wt % and no more than about 50 wt % alkali metal oxides, based upon 100% total weight of the glass composition, and at least about 1 wt % and no more than about 10 wt % of at least one transition metal oxide. A method of forming an electronic device is also provided. The method includes the steps of applying at least one dielectric tape to at least one non-planar surface of a substrate, and subjecting the at least one dielectric tape to one or more thermal treatment steps to form a dielectric layer.

Abstract: A dielectric tape suitable for use in an electronic device is provided. A dielectric slip composition comprises an organic vehicle and a dielectric glass composition comprising at least about 20 wt % and no more than about 50 wt % silicon dioxide, based upon 100% total weight of the glass composition, at least about 10 wt % and no more than about 50 wt % alkali metal oxides, based upon 100% total weight of the glass composition, and at least about 1 wt % and no more than about 10 wt % of at least one transition metal oxide. A method of forming an electronic device is also provided. The method includes the steps of applying at least one dielectric tape to at least one non-planar surface of a substrate, and subjecting the at least one dielectric tape to one or more thermal treatment steps to form a dielectric layer.

Abstract: A dielectric glass composition suitable for use in an electronic device which comprises a sufficient amount of silicon dioxide to impart durability to the glass composition when subject to a humid environment, and one or more alkali metal oxides, wherein (i) the total content of the alkali metal oxides is at least about 10 wt % and no more than about 35 wt %, based upon 100% total weight of the glass composition, (ii) the median particle size (d50) of the glass composition is no more than about 5 ?m, and (iii) the glass composition has a coefficient of thermal expansion of at least about 10 ppm/K and no more than about 25 ppm/K, is provided.

Abstract: An electroconductive paste comprising first copper particles having a specific surface area of about 0.15-1.0 m2/g, second copper particles having a specific surface area of about 0.5-2.5 m2/g, glass frit and an organic vehicle. According to another embodiment of the invention, the first copper particles are about 60-80 wt. % of the paste, while the content of the second copper particles is up to about 20 wt. % of the paste. According to another embodiment, the glass frit is lead-free and is about 1-10 wt. % of the paste. Preferably, the glass frit comprises a boron-zinc-barium oxide glass frit. According to another embodiment, the paste further comprises copper oxide. Another embodiment of the invention relates to an electroconductive paste comprising about 60-95 wt. % copper component, a boron-zinc-barium oxide glass frit, and an organic vehicle.

Abstract: A method of soldering to a polymer thick film material, comprising the steps of providing a substrate having a polymer thick film layer on at least one surface of the substrate, incorporating a metal preform into the polymer thick film layer such that a surface of the metal preform is exposed, curing the polymer thick film layer to secure the metal preform thereto, and soldering to the exposed surface of the metal preform using a solder material.

Abstract: An electroconductive paste comprising first copper particles having a specific surface area of about 0.15-1.0 m2/g, second copper particles having a specific surface area of about 0.5-2.5 m2/g, glass frit and an organic vehicle. According to another embodiment of the invention, the first copper particles are about 60-80 wt. % of the paste, while the content of the second copper particles is up to about 20 wt. % of the paste. According to another embodiment, the glass frit is lead-free and is about 1-10 wt. % of the paste. Preferably, the glass frit comprises a boron-zinc-barium oxide glass frit. According to another embodiment, the paste further comprises copper oxide. Another embodiment of the invention relates to an electroconductive paste comprising about 60-95 wt. % copper component, a boron-zinc-barium oxide glass frit, and an organic vehicle.