Patents by Inventor Ryan Petersen
Ryan Petersen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240122157Abstract: In one or more arrangements, a sweep system for livestock grazing is provided to facilitate movement of livestock when an enclosure is moved. The system includes a frame having a front end, a rear end, and opposing sides. The system has one or more wheel assemblies attached to the frame to facilitate movement of the frame along the ground. The system includes a sweep mechanism connected to the frame that facilitates movement of the livestock.Type: ApplicationFiled: December 15, 2023Publication date: April 18, 2024Inventors: Zachary John Smith, Sheldon William Stevermer, Lance Ryan Petersen
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Publication number: 20210400908Abstract: In one or more arrangements, a portable livestock enclosure system is provided to facilitate stock cropping of a field. The system includes a mobile enclosure and one or more enclosed grazing areas. The one or more enclosed grazing areas are operably connected to the mobile enclosure. The mobile enclosure also includes a set of lift wheel assemblies configured to move a set of wheels between a retracted position and an extended position. The mobile enclosure and one or more enclosed grazing areas are lifted off of the ground to facilitate movement of the portable livestock enclosure system when set of wheels are moved to the extended position. The mobile enclosure and one or more enclosed grazing areas are placed on or near the ground when the set of wheels are moved to the retracted position.Type: ApplicationFiled: June 23, 2021Publication date: December 30, 2021Inventors: Zachary John Smith, Sheldon William Stevermer, Lance Ryan Petersen
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Patent number: 11178128Abstract: Certain aspects involve facilitating the integration of sensitive data from a data provider into an instance of a web-based, third-party application. For example, a data provider service can receive an authentication API call from a third-party system. The authentication API call can include a user identifier and a request for an access token usable by a web-based interface of the third-party system. The data provider service can generate an access token for the third-party system from which the authentication API call is received. The data provider service can subsequently receive, from the user device, a feature API call including the access token and a feature request for sensitive data. The data provider service can generate output data specific to the user identified by the access token included in the feature API call. The data provider service can provide the output to the user device via the web-based interface.Type: GrantFiled: January 23, 2020Date of Patent: November 16, 2021Assignee: EQUIFAX INC.Inventors: Timothy G. Poschel, Ryan Petersen, Josh Hanson
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Publication number: 20200162443Abstract: Certain aspects involve facilitating the integration of sensitive data from a data provider into an instance of a web-based, third-party application. For example, a data provider service can receive an authentication API call from a third-party system. The authentication API call can include a user identifier and a request for an access token usable by a web-based interface of the third-party system. The data provider service can generate an access token for the third-party system from which the authentication API call is received. The data provider service can subsequently receive, from the user device, a feature API call including the access token and a feature request for sensitive data. The data provider service can generate output data specific to the user identified by the access token included in the feature API call. The data provider service can provide the output to the user device via the web-based interface.Type: ApplicationFiled: January 23, 2020Publication date: May 21, 2020Inventors: Timothy G. POSCHEL, Ryan PETERSEN, Josh HANSON
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Patent number: 10581825Abstract: Certain aspects involve facilitating the integration of sensitive data from a data provider into an instance of a web-based, third-party application. For example, a data provider service can receive an authentication API call from a third-party system. The authentication API call can include a user identifier and a request for an access token usable by a web-based interface of the third-party system. The data provider service can generate an access token for the third-party system from which the authentication API call is received. The data provider service can subsequently receive, from the user device, a feature API call including the access token and a feature request for sensitive data. The data provider service can generate output data specific to the user identified by the access token included in the feature API call. The data provider service can provide the output to the user device via the web-based interface.Type: GrantFiled: January 29, 2018Date of Patent: March 3, 2020Assignee: EQUIFAX INC.Inventors: Timothy G. Poschel, Ryan Petersen, Josh Hanson
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Publication number: 20190180235Abstract: This disclosure pertains to systems and methods for moving things from a Start Location to an End Location, which provide users with reduced costs, improved logistics, flexibility, a visualized supply chain, and powerful analytics. In some embodiments, the disclosed systems and methods include a user interface which accepts input from a user, then generates and presents a concrete collection of shipping options meeting user-defined route constraints.Type: ApplicationFiled: May 12, 2017Publication date: June 13, 2019Inventor: Ryan PETERSEN
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Publication number: 20180219846Abstract: Certain aspects involve facilitating the integration of sensitive data from a data provider into an instance of a web-based, third-party application. For example, a data provider service can receive an authentication API call from a third-party system. The authentication API call can include a user identifier and a request for an access token usable by a web-based interface of the third-party system. The data provider service can generate an access token for the third-party system from which the authentication API call is received. The data provider service can subsequently receive, from the user device, a feature API call including the access token and a feature request for sensitive data. The data provider service can generate output data specific to the user identified by the access token included in the feature API call. The data provider service can provide the output to the user device via the web-based interface.Type: ApplicationFiled: January 29, 2018Publication date: August 2, 2018Applicant: EQUIFAX, INC.Inventors: Timothy G. Poschel, Ryan Petersen, Josh Hanson
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Patent number: 8151030Abstract: The present invention provides a method of increasing DDR memory bandwidth in DDR SDRAM modules. DDR memory has an inherent feature called the Variable Early Read command, where the read command is issued one CAS latency before the termination of an ongoing data burst By using the Variable Early Read command the effect of the CAS latency is minimized in terms of the effect on bandwidth. The enhanced bandwidth technology achieved with this invention optimizes the remaining two access latencies (tRP and tRCD) for optimal bandwidth. These optimizations in the SPD allow for much better bandwidth in real world applications.Type: GrantFiled: May 25, 2005Date of Patent: April 3, 2012Assignee: OCZ Technology Group, Inc.Inventors: Ryan Petersen, Franz Michael Schuette
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Patent number: 7876564Abstract: A method and apparatus for cooling chips on a computer memory module. The apparatus includes a primary and secondary heat spreaders, at least a first heatpipe coupled to the primary heat spreader and having a remote portion spaced apart from the primary heat spreader and thermally contacting the secondary heat spreader, and a coolant within the first heatpipe and the primary heat spreader so as to absorb heat from the primary heat spreader and conduct the heat to the secondary heat spreader. The primary heat spreader has at least two panels configured to engage the memory module therebetween, with facing contact surfaces of the panels adapted for thermal contact with the module chips. The secondary heat spreader is configured to increase surface dissipation of heat from the first heatpipe into the environment. The coolant has a boiling point at or below a maximum preselected operating temperature of the module chips.Type: GrantFiled: May 27, 2008Date of Patent: January 25, 2011Assignee: CCZ Technology Group, Inc.Inventors: Mohasit Monh, Ryan Petersen
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Publication number: 20080291630Abstract: A method and apparatus for cooling chips on a computer memory module. The apparatus includes a primary and secondary heat spreaders, at least a first heatpipe coupled to the primary heat spreader and having a remote portion spaced apart from the primary heat spreader and thermally contacting the secondary heat spreader, and a coolant within the first heatpipe and the primary heat spreader so as to absorb heat from the primary heat spreader and conduct the heat to the secondary heat spreader. The primary heat spreader has at least two panels configured to engage the memory module therebetween, with facing contact surfaces of the panels adapted for thermal contact with the module chips. The secondary heat spreader is configured to increase surface dissipation of heat from the first heatpipe into the environment. The coolant has a boiling point at or below a maximum preselected operating temperature of the module chips.Type: ApplicationFiled: May 27, 2008Publication date: November 27, 2008Applicant: OCZ TECHNOLOGY GROUP, INC.Inventors: Mohasit Monh, Ryan Petersen
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Publication number: 20080049960Abstract: A gaming headset adapted for precise delivery of chemical substances capable of olfactory stimulation, such as odorants, fragrances, pheromones, etc. The headset includes at least one earpiece containing a speaker, a feature for securing the earpiece to the person's head while positioning the speaker over one of the person's ears when the headset is worn, an armature disposed relative to the earpiece so as to extend toward the person's mouth, a microphone located on the armature so as to be located in front of the person's mouth, and a feature supported by and extending along the armature for delivering at least one chemical substance to the person's nostril's when the headset is worn.Type: ApplicationFiled: August 28, 2007Publication date: February 28, 2008Applicant: OCZ TECHNOLOGY GROUP, INC.Inventors: Ryan Petersen, Franz Schuette
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Publication number: 20070159789Abstract: A heat spreader and method for thermal management of a computer memory module by promoting natural convection cooling of the memory module. The heat spreader includes a frame surrounding a planar body adapted to be mounted to a memory module of a computer, and a grid defined in the planar body by a plurality of uniformly distributed perforations. The perforations extend through the planar body to allow natural convention between an interior space beneath the planar body and an exterior space above the planar body.Type: ApplicationFiled: January 9, 2007Publication date: July 12, 2007Applicant: OCZ TECHNOLOGY GROUP, INC.Inventors: Franz Schuette, Ryan Petersen, Eric Nelson, Bhulinder Sethi
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Publication number: 20070005902Abstract: A memory module having at least one random access memory device and a memory bus on a substrate. The memory module further comprises an SRAM cache interfaced with the random access memory device through an ASIC associated with the SRAM cache and operable as a prefetch controller for the SRAM cache. The ASIC and SRAM cache cooperate to enable data to be prefetched and cached during idle cycles of the memory device, thereby increasing the overall operating speed of the memory circuit by minimizing latencies should the prefetched data be requested. The ASIC can be programmed to prefetch not only data from the originally accessed row during a read operation, but also to speculatively prefetch data from logically coherent rows in order to anticipate and counteract a page miss and the associated latencies based on the locality of data.Type: ApplicationFiled: December 7, 2005Publication date: January 4, 2007Applicant: OCZ TECHNOLOGY GROUP, INC.Inventors: Ryan Petersen, Franz Schuette
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ON-DEVICE DATA COMPRESSION TO INCREASE SPEED AND CAPACITY OF FLASH MEMORY-BASED MASS STORAGE DEVICES
Publication number: 20060212645Abstract: A mass storage device having at least one flash memory device and DRAM or SRAM-based cache within a package, and which comprises co-processor means within the package for performing compression and decompression of cached data before writing the cached data to the flash memory device.Type: ApplicationFiled: December 7, 2005Publication date: September 21, 2006Applicant: OCZ TECHNOLOGY GROUP, INC.Inventors: Ryan Petersen, Franz Schuette -
Publication number: 20060056214Abstract: A memory module capable of exhibiting reduced input clock skew. More particularly, an unbuffered memory module that comprises a substrate, multiple memory components mounted to the substrate, and input/output and address and command bus connectors that transmit digital information to and from the memory components further includes a phase lock loop (PLL) circuit that electrically interconnects a clock-in connector to the memory components for generating and transmitting a module clock signal to the memory components without routing any information to the memory components through a register. In this manner, the PLL operates to provide the memory module with an onboard clock generator that synchronizes the memory components of the module.Type: ApplicationFiled: August 24, 2005Publication date: March 16, 2006Applicant: OCZ TECHNOLOGIES, INC.Inventors: Ryan Petersen, Eric Nelson
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Publication number: 20060056215Abstract: A memory module adapted for installation in an open memory socket on a mainboard of a computer. The memory module includes a substrate with an edge connector comprising pins along an edge of the substrate, and at least one memory package mounted to the substrate and containing a memory die electrically connected to input/output leads located along the perimeter of the memory package and through which data signals are transmitted to and from the memory die. Data signal lines electrically connect a plurality of the input/output leads of the memory package to a plurality of the pins of the edge connector. Termination resistors individually electrically connect each of the data signal lines to ground, a supply voltage, or a reference voltage of the memory package so as to reduce noise and signal reflections through the data signal lines.Type: ApplicationFiled: August 25, 2005Publication date: March 16, 2006Applicant: OCZ TECHNOLOGY GROUP, INC.Inventors: Ryan Petersen, Franz Schuette
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Publication number: 20050266711Abstract: A method and apparatus for providing power to a memory array of a computer's memory subsystem, and more particularly power at a level greater than that available through the computer motherboard so as to boost memory performance and operational stability. The apparatus includes a supply device for supplying an input voltage to the memory subsystem at a level that is higher than the power level provided to the memory subsystem by the motherboard. The method entails electrically connecting the supply device to the memory subsystem, and then electrically connecting a power source to the device to deliver the input voltage to the memory subsystem. The additional input voltage supplied to the memory subsystem causes memory chips on memory modules of the memory subsystem to run at higher frequencies, such that the various internal operations of the memory, such as reading and writing, occur more quickly.Type: ApplicationFiled: September 29, 2004Publication date: December 1, 2005Applicant: OCZ TECHNOLOGYInventors: Ryan Petersen, Eric Nelson
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Publication number: 20050226076Abstract: An apparatus for buffering power transients in a supply power for expansion cards inserted into expansion slots on a computer motherboard. The apparatus comprises a printed circuit board, a connector on the printed circuit board, and at least one capacitor on the printed circuit board. The connector is configured to fit into one of the expansion slots on the motherboard, and comprises at least one power pin and at least one ground pin. The at least one capacitor is connected to the power and ground pins of the connector and has sufficient capacitance to buffer power transients within the supply power to the expansion slots.Type: ApplicationFiled: March 31, 2005Publication date: October 13, 2005Applicant: OCZ TECHNOLOGY GROUP, INC.Inventor: Ryan Petersen