Patents by Inventor Ryan Spence

Ryan Spence has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Damped EGT probe
    Patent number: 8858074
    Abstract: A temperature probe includes a flange, a support structure, thermocouple wires, and guide plates. The flange has a midline. The support structure is attached to the midline and extends away from the flange. The thermocouple wires extend along the support structure, and terminate in a set of outer sensing tips and a set of inner sensing tips. The guide plates secure the thermocouple wires to the support structure. The guide plates are offset laterally from the midline of the flange.
    Type: Grant
    Filed: July 16, 2012
    Date of Patent: October 14, 2014
    Assignee: United Technologies Corporation
    Inventors: Michael D. Greenberg, Ryan Spence, William T. Kelly, Joseph DeLorme, Bobby J. McLarty
  • DAMPED EGT PROBE
    Publication number: 20140016670
    Abstract: A temperature probe includes a flange, a support structure, thermocouple wires, and guide plates. The flange has a midline. The support structure is attached to the midline and extends away from the flange. The thermocouple wires extend along the support structure, and terminate in a set of outer sensing tips and a set of inner sensing tips. The guide plates secure the thermocouple wires to the support structure. The guide plates are offset laterally from the midline of the flange.
    Type: Application
    Filed: July 16, 2012
    Publication date: January 16, 2014
    Applicant: UNITED TECHNOLOGIES CORPORATION
    Inventors: Michael D. Greenberg, Ryan Spence, William T. Kelly, Joseph DeLorme, Bobby J. McLarty