Patents by Inventor Ryo Moteki

Ryo Moteki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050074656
    Abstract: Disclosure is concerned with a small type fuel cell for a power source of portable electronic appliances, particularly to a fuel cell using liquid fuel such as methanol etc., an electronic appliance, and a method of doing business. The fuel cell characterized by having a circulating container for supplying liquid fuel of a predetermined concentration to the fuel cell and for recovering and storing the liquid fuel discharged from the fuel cell, wherein the circulating container is replaceable.
    Type: Application
    Filed: August 18, 2004
    Publication date: April 7, 2005
    Applicant: Hitachi Maxell, Ltd.
    Inventors: Tohru Koyama, Shigeo Suzuki, Ryo Moteki, Kenichi Souma
  • Patent number: 6114005
    Abstract: A laminate capable of mounting semiconductor elements thereon; comprising an insulating layer which is constituted by a resin portion of sea-island structure and a woven reinforcement. The resin portion of sea-island structure is, for example, such that a resin as islands are dispersed in a resin as a matrix. Thus, the insulating layer exhibits a coefficient of thermal expansion of 3.0.about.10 (ppm/K) in a planar direction thereof and a glass transition temperature of 150.about.300 (.degree.C.). Owing to these physical properties, thermal stresses which the laminate undergoes in packaging the semiconductor elements thereon can be reduced, so that the connections of the laminate with the semiconductor elements can be made highly reliable.
    Type: Grant
    Filed: May 20, 1997
    Date of Patent: September 5, 2000
    Assignee: Hitachi, Ltd.
    Inventors: Akira Nagai, Masatsugu Ogata, Shuji Eguchi, Masahiko Ogino, Toshiaki Ishii, Masanori Segawa, Hiroyoshi Kokaku, Ryo Moteki, Ichiro Anjoh
  • Patent number: 5677045
    Abstract: A laminate capable of mounting semiconductor elements thereon; comprising an insulating layer which is constituted by a resin portion of sea-island structure and a woven reinforcement. The resin portion of sea-island structure is, for example, such that a resin as islands are dispersed in a resin as a matrix. Thus, the insulating layer exhibits a coefficient of thermal expansion of 3.0.about.10 (ppm/K) in a planar direction thereof and a glass transition temperature of 150.about.300 (.degree.C.). Owing to these physical properties, thermal stresses which the laminate undergoes in packaging the semiconductor elements thereon can be reduced, so that the connections of the laminate with the semiconductor elements can be made highly reliable.
    Type: Grant
    Filed: April 28, 1995
    Date of Patent: October 14, 1997
    Assignee: Hitachi, Ltd.
    Inventors: Akira Nagai, Masatsugu Ogata, Shuji Eguchi, Masahiko Ogino, Toshiaki Ishii, Masanori Segawa, Hiroyoshi Kokaku, Ryo Moteki, Ichiro Anjoh