Patents by Inventor Ryohei Kataoka
Ryohei Kataoka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240086438Abstract: A medium storing a program including: classifying vectors of first sentences in a file into each similar vector; generating an inverted index associating a vector of each first sentence with a position of the first sentence on the file; identifying a feature sentence from a second sentences included in a second sentences; specifying similar vectors being vectors similar to a vector of the feature sentence based on the inverted index; specifying, for each similar vector, first transition data indicating transition of vectors at positions before and after the similar vector based on the inverted index; and specifying, from pieces of first transition data obtained by performing the specifying of the first transition data on the similar vectors, transition data similar to second transition data indicating transition of vectors of sentences before and after the feature sentence, to output the transition data as a response of the search query.Type: ApplicationFiled: November 21, 2023Publication date: March 14, 2024Applicant: FUJITSU LIMITEDInventors: Masahiro KATAOKA, Ryo MATSUMURA, Ryohei NAGAURA
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Publication number: 20240071568Abstract: A non-transitory computer-readable storage medium storing an information processing program that causes at least one computer to execute a process, the process includes calculating a second index indicating a position of an amino acid on a codon file based on a first index indicating positions of a plurality of codons on the codon file with respect to a plurality of codons having different base sequences indicating the same amino acid; identifying positions of amino acid sequences repeatedly expressed in the codon file based on the second index; and specifying each codon sequence corresponding to a position of each amino acid sequence repeatedly expressed in the codon file as a codon sequence having homology.Type: ApplicationFiled: November 6, 2023Publication date: February 29, 2024Applicant: FUJITSU LIMITEDInventors: Masahiro KATAOKA, Ryohei NAGAURA, Kaoru MOGUSHI
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Patent number: 9590294Abstract: A vehicle-mounted antenna device includes a base, a board, a circuit section, and a housing. The base is mountable on a roof of a vehicle. The board has an antenna element section and is stood on a surface of the base. The circuit section serves as at least part of a wireless communication circuit electrically connected to the antenna element section. The housing is made of a resin material and forms a projection of a vehicle outer shape. The board and the circuit section are located in space formed by the base and the housing. The board is stood on the surface of the base so that a first direction perpendicular to the surface of the base differs from a second direction equal to a thickness direction of the board. The circuit section implemented on the board at a position away from the base in the first direction.Type: GrantFiled: June 20, 2013Date of Patent: March 7, 2017Assignee: DENSO CORPORATIONInventors: Yasumune Yukizaki, Tadao Suzuki, Ryohei Kataoka, Yuji Sugimoto
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Patent number: 9583820Abstract: A vehicle-mounted antenna device includes a base, a board, a circuit section, and a housing. The base is mountable on a roof of a vehicle. The board has an antenna element section and is stood on the base. The circuit section is implemented on the board and serves as at least part of a wireless communication circuit electrically connected to the antenna element section. The housing is made of a resin material and forms a projection of an outer shape of the vehicle. The board and the circuit section are located in space formed by the base and the housing. A heat transfer path having a thermal conductivity higher than that of air is formed between the circuit section and the housing without passing the base.Type: GrantFiled: June 20, 2013Date of Patent: February 28, 2017Assignee: DENSO CORPORATIONInventors: Yuji Sugimoto, Hirohito Matsui, Tadao Suzuki, Ryohei Kataoka
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Publication number: 20160066415Abstract: A multilayer wiring board includes an insulating layers stacked on one another, lands formed on an upper surface part of the multilayer wiring board, and a differential transmission line formed on or in each of the insulating layer. An electronic component is mounted on the lands. The differential transmission line is constituted of a pair of signal lines which extend from the lands toward a signal receiving end. Each of the signal lines is provided with an open stub which extends in a stacking direction of the insulating layers, and has a same width as a width of the signal lines, one end of the open stub being connected to a corresponding one of the signal lines, and another end of the open stub being open.Type: ApplicationFiled: August 25, 2015Publication date: March 3, 2016Inventors: Ryohei KATAOKA, Kouji KONDOH, Jyun AKIMICHI, Kanji OTSUKA, Yutaka AKIYAMA, Kaoru HASHIMOTO
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Patent number: 9184495Abstract: A vehicular antenna apparatus includes a substrate, a circuit portion, a case, and a heat transfer path. The substrate has an antenna portion. The circuit portion is mounted on the substrate and configures at least a part of a wireless communication circuit electrically coupled with the antenna portion. The case is made of resin material and configures a protruded portion of an outer surface of a vehicle. The substrate and the circuit portion are arranged in the case. The heat transfer path is arranged between the circuit portion and the case, and has a thermal conductivity higher than air. The circuit portion is electrically coupled with the antenna portion by a solid phase diffusion bonding.Type: GrantFiled: August 26, 2013Date of Patent: November 10, 2015Assignees: DENSO CORPORATION, NIPPON SOKEN, INC.Inventors: Ryohei Kataoka, Tadao Suzuki, Yuji Sugimoto
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Publication number: 20150229021Abstract: A vehicle-mounted antenna device includes a base, a board, a circuit section, and a housing. The base is mountable on a roof of a vehicle. The board has an antenna element section and is stood on a surface of the base. The circuit section serves as at least part of a wireless communication circuit electrically connected to the antenna element section. The housing is made of a resin material and forms a projection of a vehicle outer shape. The board and the circuit section are located in space formed by the base and the housing. The board is stood on the surface of the base so that a first direction perpendicular to the surface of the base differs from a second direction equal to a thickness direction of the board. The circuit section implemented on the board at a position away from the base in the first direction.Type: ApplicationFiled: June 20, 2013Publication date: August 13, 2015Inventors: Yasumune Yukizaki, Tadao Suzuki, Ryohei Kataoka, Yuji Sugimoto
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Publication number: 20150229020Abstract: A vehicle-mounted antenna device includes a base, a board, a circuit section, and a housing. The base is mountable on a roof of a vehicle. The board has an antenna element section and is stood on the base. The circuit section is implemented on the board and serves as at least part of a wireless communication circuit electrically connected to the antenna element section. The housing is made of a resin material and forms a projection of an outer shape of the vehicle. The board and the circuit section are located in space formed by the base and the housing. A heat transfer path having a thermal conductivity higher than that of air is formed between the circuit section and the housing without passing the base.Type: ApplicationFiled: June 20, 2013Publication date: August 13, 2015Applicant: DENSO CORPORATIONInventors: Yuji Sugimoto, Hirohito Matsui, Tadao Suzuki, Ryohei Kataoka
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Patent number: 8730123Abstract: A wireless communication module is arranged such that a radio frequency circuit board stands vertically on a first earth plate. The radio frequency circuit board includes first and second radio frequency transmission and reception circuits at both end portions, respectively. The radio frequency circuit board includes a second earth plate serving as a grounding electric potential of the radio frequency transmission and reception circuits. Feed lines from the radio frequency transmission and reception circuits are connected to the first earth plate, respectively. Ground lines of the feed from the radio frequency transmission and reception circuits, respectively, are connected to the second earth plate. Thus, vertical exciting currents flow at both end portions of the second earth plane, enabling transmission and reception of vertical polarization waves.Type: GrantFiled: May 21, 2012Date of Patent: May 20, 2014Assignees: Denso Corporation, Nippon Soken, Inc.Inventors: Yuji Sugimoto, Tadao Suzuki, Ryohei Kataoka, Miyuki Mizoguchi
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Publication number: 20140062808Abstract: A vehicular antenna apparatus includes a substrate, a circuit portion, a case, and a heat transfer path. The substrate has an antenna portion. The circuit portion is mounted on the substrate and configures at least a part of a wireless communication circuit electrically coupled with the antenna portion. The case is made of resin material and configures a protruded portion of an outer surface of a vehicle. The substrate and the circuit portion are arranged in the case. The heat transfer path is arranged between the circuit portion and the case, and has a thermal conductivity higher than air. The circuit portion is electrically coupled with the antenna portion by a solid phase diffusion bonding.Type: ApplicationFiled: August 26, 2013Publication date: March 6, 2014Applicants: Nippon Soken, Inc., DENSO CORPORATIONInventors: Ryohei Kataoka, Tadao Suzuki, Yuji Sugimoto
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Publication number: 20120299794Abstract: A wireless communication module is arranged such that a radio frequency circuit board stands vertically on a first earth plate. The radio frequency circuit board includes first and second radio frequency transmission and reception circuits at both end portions, respectively. The radio frequency circuit board includes a second earth plate serving as a grounding electric potential of the radio frequency transmission and reception circuits. Feed lines from the radio frequency transmission and reception circuits are connected to the first earth plate, respectively. Ground lines of the feed from the radio frequency transmission and reception circuits, respectively, are connected to the second earth plate. Thus, vertical exciting currents flow at both end portions of the second earth plane, enabling transmission and reception of vertical polarization waves.Type: ApplicationFiled: May 21, 2012Publication date: November 29, 2012Applicants: Denso Corporation, Nippon Soken Inc.Inventors: Yuji Sugimoto, Tadao Suzuki, Ryohei Kataoka, Miyuki Mizoguchi
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Patent number: 7378745Abstract: A plurality of film insulators having conductive patterns that are formed on surfaces and conductive vias that pass through the film insulators in the direction of thickness are stacked together and collectively subjected to pressure and heat to be formed as a single unit. On one outermost layer of the multilayer board that has been thus formed, a plurality of connection terminals are exposed to the outside, connection bumps of an LSI chip being secured to these connection terminals. On the outermost layer of the opposite side, a multiplicity of metal pads are provided, and a solder ball is secured on each metal pad to form a ball grid array (BGA) structure for connecting to a motherboard.Type: GrantFiled: August 30, 2005Date of Patent: May 27, 2008Assignees: NEC Electronics Corporation, Denso CorporationInventors: Akimori Hayashi, Katsunobu Suzuki, Ryuichi Oikawa, Makoto Nakagoshi, Naoko Sera, Tadashi Murai, Chiho Ogihara, Ryohei Kataoka, Koji Kondo, Tomohiro Yokochi
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Patent number: 7323238Abstract: In a printed board having a land as an electrode, a colored thermoplastic resin film is arranged on a land forming surface of a thermoplastic resin member so as to set a difference in light reflectivity between the land and the colored thermoplastic resin film, to be greater than that between the land and the thermoplastic resin member. An opening portion is provided in the colored thermoplastic resin film so that at least a part of the land is exposed from the opening portion. Because the colored thermoplastic resin film is positioned on the circumference portion of the opening portion, the difference in light reflectivity of the land with respect to its circumference portion can be effectively increased. As a result, a recognition ratio of the land can be effectively improved.Type: GrantFiled: September 22, 2005Date of Patent: January 29, 2008Assignees: DENSO Corporation, NEC Electronics CorporationInventors: Koji Kondo, Ryohei Kataoka, Tomohiro Yokochi, Makoto Nakagoshi, Tadashi Murai, Akimori Hayashi, Katsunobu Suzuki
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Patent number: 7031674Abstract: Method for detecting transmission power faults in cellular telephones without detecting transmission power. A microcomputer compares a criteria B with an absolute value |Pi?Pc| of the differential between initial transmission power value Pi and transmission power concentration value PC. A transmission power fault is determined to have occurred when the absolute value 51 Pi?Pc| is larger than criteria B (|Pi?Pc|>B), so transmission power faults can be detected without detecting the transmission power.Type: GrantFiled: September 30, 2002Date of Patent: April 18, 2006Assignees: DENSO Corporation, NTT DoCoMo, Inc.Inventors: Ryohei Kataoka, Hisashi Takeshita, Hiroyuki Itazu, Mio Okamoto
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Publication number: 20060068180Abstract: In a printed board having a land as an electrode, a colored thermoplastic resin film is arranged on a land forming surface of a thermoplastic resin member so as to set a difference in light reflectivity between the land and the colored thermoplastic resin film, to be greater than that between the land and the thermoplastic resin member. An opening portion is provided in the colored thermoplastic resin film so that at least a part of the land is exposed from the opening portion. Because the colored thermoplastic resin film is positioned on the circumference portion of the opening portion, the difference in light reflectivity of the land with respect to its circumference portion can be effectively increased. As a result, a recognition ratio of the land can be effectively improved.Type: ApplicationFiled: September 22, 2005Publication date: March 30, 2006Applicants: DENSO CORPORATION, NEC Electronics CorporationInventors: Koji Kondo, Ryohei Kataoka, Tomohiro Yokochi, Makoto Nakagoshi, Tadashi Murai, Akimori Hayashi, Katsunobu Suzuki
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Publication number: 20060044735Abstract: A plurality of film insulators having conductive patterns that are formed on surfaces and conductive vias that pass through the film insulators in the direction of thickness are stacked together and collectively subjected to pressure and heat to be formed as a single unit. On one outermost layer of the multilayer board that has been thus formed, a plurality of connection terminals are exposed to the outside, connection bumps of an LSI chip being secured to these connection terminals. On the outermost layer of the opposite side, a multiplicity of metal pads are provided, and a solder ball is secured on each metal pad to form a ball grid array (BGA) structure for connecting to a motherboard.Type: ApplicationFiled: August 30, 2005Publication date: March 2, 2006Applicants: NEC ELECTRONICS CORPORATION, DENSO CORPORATIONInventors: Akimori Hayashi, Katsunobu Suzuki, Ryuichi Oikawa, Makoto Nakagoshi, Naoko Sera, Tadashi Murai, Chiho Ogihara, Ryohei Kataoka, Koji Kondo, Tomohiro Yokochi
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Patent number: 6848178Abstract: A multilayer circuit board, in which a plurality of insulating layers and a plurality of conductive layers, each of which includes a conductive pattern, have been laminated, includes an insulating layer, a conductive compound, and a conductive pattern. The insulating layer has a trench. The conductive compound is located in the trench. The conductive pattern adjoins the trench and is electrically connected to the conductive compound. The conductive pattern and the conductive compound make up a conductive wire that has a higher current-carrying capacity than the conductive pattern.Type: GrantFiled: May 14, 2003Date of Patent: February 1, 2005Assignee: Denso CorporationInventors: Koji Kondo, Ryohei Kataoka, Gentaro Masuda
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Publication number: 20030222340Abstract: A multilayer circuit board, in which a plurality of insulating layers and a plurality of conductive layers, each of which includes a conductive pattern, have been laminated, includes an insulating layer, a conductive compound, and a conductive pattern. The insulating layer has a trench. The conductive compound is located in the trench. The conductive pattern adjoins the trench and is electrically connected to the conductive compound. The conductive pattern and the conductive compound make up a conductive wire that has a higher current-carrying capacity than the conductive pattern.Type: ApplicationFiled: May 14, 2003Publication date: December 4, 2003Inventors: Koji Kondo, Ryohei Kataoka, Gentaro Masuda
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Publication number: 20030139154Abstract: Method for detecting transmission power faults in cellular telephones without detecting transmission power. A microcomputer compares a criteria B with an absolute value |Pi−Pc| of the differential between initial transmission power value Pi and transmission power concentration value PC. A transmission power fault is determined to have occurred when the absolute value 51 Pi−Pc| is larger than criteria B (|Pi−Pc|>B), so transmission power faults can be detected without detecting the transmission power.Type: ApplicationFiled: September 30, 2002Publication date: July 24, 2003Inventors: Ryohei Kataoka, Hisashi Takeshita, Hiroyuki Itazu, Mio Okamoto
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Patent number: 4070257Abstract: An electrolytic process employing a diaphragm of a size of at least 1 cm in length in at least two directions, the diaphragm comprising a diaphragm base composed of fibers of fibrous structure containing inorganic fibers and a binder containing a fluorine-containing resin, the fluorine-containing resin being present in an amount of 0.5 - 60% by weight based on the weight of the diaphragm.Type: GrantFiled: January 29, 1976Date of Patent: January 24, 1978Assignee: Electrode CorporationInventors: Kensuke Motani, Shunji Matuura, Ryohei Kataoka