Abstract: The Xray irradiation device 1 issues Xrays to board mark 7 and projects the image of the board mark 7 on the fluorescence screen 3, the fluorescence face 39 of which visibly displays the image of the board mark 7 that can be captured by the CCD camera 2. The CCD camera 2 images the board mark 7 and the mask mark 5 depicted on the photo mask 4 overlapping together. The board 6 and the photo mask 4 are aligned by exposure stage 8 so as to the board mark 7 and the mask mark 5 coincide.

Abstract: A board stage of an aligner that can avoid bending of a printed circuit board to be exposed and accomplish high accurate exposure. In one preferred mode a suction plate 2 having small holes 20 is mounted on a supporting body on which a space 30 bigger than the small holes is provided. The holes 20 are connected to the space 30 and to a vacuum device via an air passage 31 and a bottom passage 32. The diameter of the suction hole 20 is so less than 0.4 mm not to make at the printed circuit board such bending that causes exposure troubles.

Abstract: A marking apparatus for forming alignment marks, which improves the alignment accuracy of each layer in the production of multi-layered printed circuit boards. An X-ray generator 11 irradiates X-rays at a standard mark 50 in a core board 51 of a board 5, and projects the image of the standard mark 50 on a fluorescence screen 12. The image is captured by a visible light CCD camera 13, thereby the position of the standard mark 50 is detected. Using the detected position of the standard mark 50 as an alignment reference, the apparatus irradiates ultra-violet rays at dry film resist layers 55 via mirrors 22 and 23, and imprints the marks emerged on photo masks 24 and 25 on the dry film resist layers 55, respectively.

Abstract: A marking apparatus for forming alignment marks, which improves the alignment accuracy of each layer in the production of multi-layered printed circuit boards. An X-ray generator 11 irradiates X-rays at a standard mark 50 in a core board 51 of a board 5, and projects the image of the standard mark 50 on a fluorescence screen 12. The image is captured by a visible light CCD camera 13, thereby the position of the standard mark 50 is detected. Using the detected position of the standard mark 50 as an alignment reference, the apparatus irradiates ultra-violet rays at dry film resist layers 55 via mirrors 22 and 23, and imprints the marks emerged on photo masks 24 and 25 on the dry film resist layers 55, respectively.

Abstract: The Xray irradiation device 1 issues Xrays to board mark 7 and projects the image of the board mark 7 on the fluorescence screen 3, the fluorescence face 39 of which visibly displays the image of the board mark 7 that can be captured by the CCD camera 2. The CCD camera 2 images the board mark 7 and the mask mark 5 depicted on the photo mask 4 overlapping together. The board 6 and the photo mask 4 are aligned by exposure stage 8 so as to the board mark 7 and the mask mark 5 coincide.

Abstract: In an apparatus for removing protective films, a groove is formed in a roller having an adhesive surface sufficient to peel off a protective film from a printed wiring board. The exposed printed wiring board, on which a dry film provided with a protective film is applied, is passed between the rollers. Thus, the protective film is peeled off from the surface of the dry film resist of the printed wiring board and adhered to the roller so as to be removed. As a result, the protective film can be removed at a high speed, and automated removal of protective films can be achieved.