Abstract: According to one aspect of the present invention, there is provided a prepreg with a carrier, comprising: a sheet-like base member; a first insulating resin layer provided to cover a surface of the sheet-like base member; a first carrier provided to cover the first insulating resin layer; a second insulating resin layer provided to cover a back surface of the sheet-like base member; and a second carrier provided to cover the second insulating resin layer, wherein the first and the second insulating resin layers have different resin compositions or the first and the second insulating resin layers have different thicknesses, and a front surface and a back surface of the prepreg with the carrier is visually identifiable.

Abstract: The present invention is to provide a printed wiring board having a fine wiring formed on a resin base material by the semi-additive method, and is also to provide an electroless copper plating method capable of producing the printed wiring board, a method for producing a printed wiring board using the electroless copper plating method, a printed wiring board produced by the production method, and a semiconductor device provided with the printed wiring board. An electroless copper plating method comprising the step of performing acid treatment before an electroless copper plating step including cleaner, providing palladium catalyst, palladium reduction, and electroless copper plating process, a method for producing a printed wiring board using the electroless copper plating method, a printed wiring board produced by the method for producing the printed wiring board, and a semiconductor device provided with the printed wiring board.

Abstract: According to one aspect of the present invention, there is provided a prepreg with a carrier, comprising: a sheet-like base member; a first insulating resin layer provided to cover a surface of the sheet-like base member; a first carrier provided to cover the first insulating resin layer; a second insulating resin layer provided to cover a back surface of the sheet-like base member; and a second carrier provided to cover the second insulating resin layer, wherein the first and the second insulating resin layers have different resin compositions or the first and the second insulating resin layers have different thicknesses, and a front surface and a back surface of the prepreg with the carrier is visually identifiable.

Abstract: In a process for producing an electronic part which comprises soldering (A) an electronic member having conductor portions I for electric connection having a solder layer or a solder bump (a solder portion) on a surface of a tip and (B) an electronic member to be connected having conductor portions II for electric connection arranged at positions corresponding to positions of conductor portions I by pressing (A) to (B) under heating via an adhesive layer, the solder portion is brought into contact with the adhesive layer, the solder portion is melted by heating at a temperature of or higher than a melting point of the solder, the soldering is conducted by pressing the melted solder portion, and the adhesive layer is cured. An electronic part is obtained in accordance with the process. Electric connection is surely achieved and a highly reliable electronic part can be obtained with excellent productivity.

Abstract: In a process for producing an electronic part which comprises soldering (A) an electronic member having conductor portions I for electric connection having a solder layer or a solder bump (a solder portion) on a surface of a tip and (B) an electronic member to be connected having conductor portions II for electric connection arranged at positions corresponding to positions of conductor portions I by pressing (A) to (B) under heating via an adhesive layer, the solder portion is brought into contact with the adhesive layer, the solder portion is melted by heating at a temperature of or higher than a melting point of the solder, the soldering is conducted by pressing the melted solder portion, and the adhesive layer is cured. An electronic part is obtained in accordance with the process. Electric connection is surely achieved and a highly reliable electronic part can be obtained with excellent productivity.

Abstract: A current supply circuit for a telephone exchange is disclosed in which a current-supplying current amplifier series-connected between a power supply and a load amplifys an output current of an input current supply circuit, and a driving current amplifier for driving the current-supplying current amplifier is controlled by an output of an output voltage detector parallel-connected with the load in a negative-feedback fashion to set the differential mode output impedance of the current supply circuit at a large or small value in accordance with frequency and to set the common mode output impedance at a small value; and in which a part of the output voltage detector for connecting the load to the driving current amplifier includes a diode for preventing a direct current from flowing in a opposite direction to that of a direct current from the power supply in order to suppress, independently of the state of the load, a current which flows from the load side into the driving current amplifier, whereby an increase