Patents by Inventor Ryoichi Shimizu
Ryoichi Shimizu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11932022Abstract: Convenience of an ink bottle and a bottle set is improved. An ink bottle includes: a container portion that contains ink; a guiding portion that is formed in one end portion of the container portion, and includes an outflow port from which the ink in the container portion flow out; and a cover that covers at least an end portion of the container portion on the opposite side of the guiding portion.Type: GrantFiled: February 2, 2023Date of Patent: March 19, 2024Assignee: SEIKO EPSON CORPORATIONInventors: Taku Ishizawa, Tadahiro Mizutani, Ryoichi Tanaka, Manabu Akahane, Koichi Toba, Takumi Nagashima, Yoshiaki Shimizu, Tadashi Watanabe, Noriyuki Fukasawa
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Patent number: 9622352Abstract: In a mark forming step in a manufacturing method for a component incorporated substrate in which an electronic component is positioned with reference to a mark formed in a copper layer, when an imaginary line extending from a search center of a search range of a sensor, to an edge side of the search range is represented as a search reference line and an imaginary line extending, in a state in which a mark center, is matched with the search center, from the mark center in the same direction as the search reference line to an outer ridgeline of the mark is represented as a mark reference line, the mark formed in a shape in which the outer ridgeline of the mark is present in a position where a length of the mark reference line is in a range of 30% or more of the search reference line.Type: GrantFiled: September 26, 2012Date of Patent: April 11, 2017Assignee: MEIKO ELECTRONICS CO., LTD.Inventors: Ryoichi Shimizu, Mitsuo Iwamoto, Mitsuaki Toda
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Patent number: 9526182Abstract: The method includes positioning an electronic component using main marks formed on a metal layer and mounting the electronic component on a second surface of the metal layer with an adhesive layer interposed between the metal layer and both of the electronic component and terminals; then burying the electronic component and the main marks in an insulating substrate; then removing part of the metal layer and forming a first window for exposing the main marks therefrom and a second window for exposing the adhesive layer including a position corresponding to the terminal therefrom; then using the exposed main marks as references and forming a laser via hole LVH reaching the terminal in the adhesive layer exposed from the second window; and thereby forming a wiring pattern from the metal layer electrically connected to the terminal through a first conductive via formed by plating the LVH with copper.Type: GrantFiled: October 31, 2011Date of Patent: December 20, 2016Assignee: MEIKO ELECTRONICS CO., LTD.Inventors: Ryoichi Shimizu, Tohru Matsumoto, Takuya Hasegawa, Yoshio Imamura
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Publication number: 20160118346Abstract: A device embedded substrate includes: an insulating layer; a first metal layer and a second metal layer that are formed such that the insulating layer is sandwiched therebetween; a device that is embedded in the insulating layer, and in which a connection terminal non-formation surface where a connection terminal is not formed is located on a side close to the first metal layer; an adhesive layer that is located on the connection terminal non-formation surface of the device; and a conductive via that electrically connects the second metal layer and the connection terminal of the device, wherein an area of the adhesive layer on a surface side in contact with the device is smaller than an area of the connection terminal non-formation surface of the device.Type: ApplicationFiled: May 20, 2013Publication date: April 28, 2016Applicant: MEIKO ELECTRONICS CO., LTD.Inventors: Mitsuaki Toda, Tohru Matsumoto, Ryoichi Shimizu
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Patent number: 9320185Abstract: A thin conductive layer which is to form a conductor pattern (18) is prepared, a mask layer (3) is formed on the conductive layer except a plurality of actual connection spots and at least one dummy connection spot on the conductive layer, actual solder pads (6) and a dummy solder pad (7) are formed, with use of solder, on the actual connection spots and the dummy connection spot, respectively, where the conductive layer is exposed, connection terminals (9) of an electric or electronic component (8) are connected to the actual solder pads (6), an insulating base (16) of resin is formed which is laminated directly on or indirectly via the mask layer (3) on the conductive layer and in which the component (8) is embedded, and part of the conductive layer is removed by using the dummy solder pad (7) as a reference, to form the conductor pattern (18).Type: GrantFiled: October 1, 2010Date of Patent: April 19, 2016Assignee: MEIKO ELECTRONICS CO., LTD.Inventors: Yoshio Imamura, Tohru Matsumoto, Ryoichi Shimizu
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Publication number: 20150237734Abstract: In a mark forming step in a manufacturing method for a component incorporated substrate in which an electronic component is positioned with reference to a mark formed in a copper layer, when an imaginary line extending from a search center of a search range of a sensor, to an edge side of the search range is represented as a search reference line and an imaginary line extending, in a state in which a mark center, is matched with the search center, from the mark center in the same direction as the search reference line to an outer ridgeline of the mark is represented as a mark reference line, the mark formed in a shape in which the outer ridgeline of the mark is present in a position where a length of the mark reference line is in a range of 30% or more of the search reference line.Type: ApplicationFiled: September 26, 2012Publication date: August 20, 2015Applicant: MEIKO ELECTRONICS CO., LTD.Inventors: Ryoichi Shimizu, Mitsuo Iwamoto, Mitsuaki Toda
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Publication number: 20140347835Abstract: The method includes positioning an electronic component using main marks formed on a metal layer and mounting the electronic component on a second surface of the metal layer with an adhesive layer interposed between the metal layer and both of the electronic component and terminals; then burying the electronic component and the main marks in an insulating substrate; then removing part of the metal layer and forming a first window for exposing the main marks therefrom and a second window for exposing the adhesive layer including a position corresponding to the terminal therefrom; then using the exposed main marks as references and forming a laser via hole LVH reaching the terminal in the adhesive layer exposed from the second window; and thereby forming a wiring pattern from the metal layer electrically connected to the terminal through a first conductive via formed by plating the LVH with copper.Type: ApplicationFiled: October 31, 2011Publication date: November 27, 2014Applicant: C/O Meiko Electronics Co., Ltd.Inventors: Ryoichi Shimizu, Tohru Matsumoto, Takuya Hasegawa, Yoshio Imamura
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Patent number: 8881438Abstract: A luggage tag which can be easily operated for attachment of the luggage tag to a luggage is provided. A luggage tag includes a surface sheet and a peel-off sheet, and a customer's copy is provided on one end portion of the surface sheet via a separation slit. A peel-off region is provided on one end portion of the peel-off sheet via a peel-off slit. When winding the luggage tag on a handle of a luggage in a loop fashion, an attaching portion to be adhered to the peel-off sheet is covered with the peel-off region, and the customer's copy is adhered to the peel-off region. A folding line is provided on the peel-off region, and when the peel-off region is folded along the folding line, an adhesive layer of the customer's copy is exposed outside.Type: GrantFiled: December 21, 2012Date of Patent: November 11, 2014Assignee: Hitachi Systems, Ltd.Inventors: Ryoichi Shimizu, Yukie Sahara
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Publication number: 20140173951Abstract: A luggage tag which can be easily operated for attachment of the luggage tag to a luggage is provided. A luggage tag includes a surface sheet and a peel-off sheet, and a customer's copy is provided on one end portion of the surface sheet via a separation slit. A peel-off region is provided on one end portion of the peel-off sheet via a peel-off slit. When winding the luggage tag on a handle of a luggage in a loop fashion, an attaching portion to be adhered to the peel-off sheet is covered with the peel-off region, and the customer's copy is adhered to the peel-off region. A folding line is provided on the peel-off region, and when the peel-off region is folded along the folding line, an adhesive layer of the customer's copy is exposed outside.Type: ApplicationFiled: December 21, 2012Publication date: June 26, 2014Applicant: Hitachi Systems, Ltd.Inventors: Ryoichi Shimizu, Yukie Sahara
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Patent number: 8558744Abstract: A mechanism of an antenna for positioning, which is mounted on a measuring vehicle to measure locations of geographic features on and the side of roads and to collect road map information, and which is capable of highly-reliable measurement even when the vehicle is travelling, is realized. The antenna for positioning according to the present invention includes a positioning antenna to receive radio waves from a positioning satellite, a column, to the upper end of which the antenna is attached, and a cylindrical plate to cover the longitudinal direction of the column, wherein by use of the plate, a problem with the strength of the column to hold the positioning antenna is solved by reducing a lift force acting on the positioning antenna while the vehicle is travelling, and further, wind noise is reduced, and a cable is prevented from being damaged.Type: GrantFiled: May 13, 2009Date of Patent: October 15, 2013Assignee: Mitsubishi Electric CorporationInventors: Naotoshi Tezuka, Ryoichi Shimizu
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Publication number: 20130242516Abstract: A thin conductive layer which is to form a conductor pattern (18) is prepared, a mask layer (3) is formed on the conductive layer except a plurality of actual connection spots and at least one dummy connection spot on the conductive layer, actual solder pads (6) and a dummy solder pad (7) are formed, with use of solder, on the actual connection spots and the dummy connection spot, respectively, where the conductive layer is exposed, connection terminals (9) of an electric or electronic component (8) are connected to the actual solder pads (6), an insulating base (16) of resin is formed which is laminated directly on or indirectly via the mask layer (3) on the conductive layer and in which the component (8) is embedded, and part of the conductive layer is removed by using the dummy solder pad (7) as a reference, to form the conductor pattern (18).Type: ApplicationFiled: October 1, 2010Publication date: September 19, 2013Applicant: MEIKO ELECTRONICS CO., LTD.Inventors: Yoshio Imamura, Tohru Matsumoto, Ryoichi Shimizu
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Patent number: 8437278Abstract: A service providing apparatus that provides a digital processing service and performs wireless communication with a service use apparatus that uses the service includes: a wireless communication unit that performs wireless communication; an interface unit that enables the attachment of a portable wireless communication device that performs wireless communication for the apparatus to which the wireless communication device is attached when the wireless communication device is attached; a generation unit that generates configuration information for wireless communication; and a configuration unit that executes, on the wireless communication device attached to the interface unit, based on the configuration information generated by the generation unit, a configuration process that enables wireless communication between the service use apparatus to which the wireless communication device has been attached and the wireless communication unit.Type: GrantFiled: July 1, 2010Date of Patent: May 7, 2013Assignee: Seiko Epson CorporationInventors: Hideaki Ogata, Ryoichi Shimizu
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Publication number: 20110068986Abstract: A mechanism of an antenna for positioning, which is mounted on a measuring vehicle to measure locations of geographic features on and the side of roads and to collect road map information, and which is capable of highly-reliable measurement even when the vehicle is travelling, is realized. The antenna for positioning according to the present invention includes a positioning antenna to receive radio waves from a positioning satellite, a column, to the upper end of which the antenna is attached, and a cylindrical plate to cover the longitudinal direction of the column, wherein by use of the plate, a problem with the strength of the column to hold the positioning antenna is solved by reducing a lift force acting on the positioning antenna while the vehicle is travelling, and further, wind noise is reduced, and a cable is prevented from being damaged.Type: ApplicationFiled: May 13, 2009Publication date: March 24, 2011Applicant: Mitsubishi Electric CorporationInventors: Naotoshi Tezuka, Ryoichi Shimizu
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Publication number: 20110002271Abstract: A service providing apparatus that provides a digital processing service and performs wireless communication with a service use apparatus that uses the service includes: a wireless communication unit that performs wireless communication; an interface unit that enables the attachment of a portable wireless communication device that performs wireless communication for the apparatus to which the wireless communication device is attached when the wireless communication device is attached; a generation unit that generates configuration information for wireless communication; and a configuration unit that executes, on the wireless communication device attached to the interface unit, based on the configuration information generated by the generation unit, a configuration process that enables wireless communication between the service use apparatus to which the wireless communication device has been attached and the wireless communication unit.Type: ApplicationFiled: July 1, 2010Publication date: January 6, 2011Applicant: SEIKO EPSON CORPORATIONInventors: Hideaki Ogata, Ryoichi Shimizu
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Publication number: 20080162955Abstract: A USB host includes a first connection unit capable of being connected to and disconnected from one end of a USB cable including two power lines and two signal lines, the other end of the USB cable being connected to a USB device; a first output unit that outputs information through the first connection unit; and a first control unit that causes the first output unit to transmit an instruction to request power supply to the USB device through at least one of the two power lines and the two signal lines in the USB cable and, then, causes the first output unit to transmit information to the USB device with power received from the USB device through the USB cable.Type: ApplicationFiled: December 28, 2007Publication date: July 3, 2008Applicant: Seiko Epson CorporationInventor: Ryoichi SHIMIZU
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Patent number: 7120352Abstract: A video tape recorder is provided which is capable of recording information at different frame rates while maintaining accurate time codes. Data about a recording frame rate set at recording time and time code data about DF/NDF settings are recorded in an AUX area of a helical track as auxiliary data. Further, time code data set at recording time is recorded on a time code track. When a magnetic tape is played back, time code data not selected at recording time is also displayed on a display unit of a control panel and the screen of a monitor together with the time code data and the data about the recording frame rate selected at recording time. A user is able to perform step-by-step settings of frame rates and time codes on a playback tape while confirming the displayed data, regardless of the settings used when the original recording was made.Type: GrantFiled: June 26, 1997Date of Patent: October 10, 2006Assignee: Sony CorporationInventor: Ryoichi Shimizu
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Patent number: 6633402Abstract: The present invention is a printer controller furnished with a processor for exclusively executing a first task (printing task) for controlling a print engine, a second task (communication task) for controlling communication with host computers, and a third task (language task) for generating image data. These tasks are assigned priorities of execution in the order of the printing task, the communication task, and the language task. When there is a request for the execution of a task with a higher priority during the execution of a task with a lower priority, the processor executes the higher priority task whose execution has been requested instead of the lower priority task currently being executed. Therefore, the processor is able to execute the communication task, language task, and printing task with no conflict.Type: GrantFiled: August 10, 1999Date of Patent: October 14, 2003Assignee: Seiko Epson CorporationInventors: Toshihiro Shima, Kazuhiko Iida, Susumu Shiohara, Tadashi Kobayashi, Norishige Kakuno, Ryoichi Shimizu
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Patent number: 6065701Abstract: A cassette label comprising, an integrated circuit comprising a memory unit and a signal processing unit, an antenna members for carrying out at least a transfer of signals with respect to the integrated circuit, and a label body accommodating the integrated circuit and the antenna members and mounted on a back surface of a video cassette tape, and a video cassette tape comprising, a video tape for recording video signals, a cassette case for accommodating the video tape, and the cassette label mounted on the back surface of the cassette case.Type: GrantFiled: November 10, 1997Date of Patent: May 23, 2000Assignee: Sony CorporationInventors: Kazunari Tanimura, Takashi Sasaya, Ryoichi Shimizu, Hiromi Hoshino, Toru Suzuki
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Patent number: 5354804Abstract: A thermoplastic resin is emulsified by feeding a thermoplastic resin composition obtained by melting and mixing 80 to 98 wt. % of the resin with 2 to 20 wt. % of poly(vinyl alcohol) in a biaxial extruder, supplying water from at least one supply port downstream from the melting zone and kneading the molten composition with water in the biaxial extruder.Type: GrantFiled: September 7, 1993Date of Patent: October 11, 1994Assignee: Tosoh CorporationInventors: Jun Inada, Fumio Koshiro, Ryoichi Shimizu, Shinichi Sato
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Patent number: 5114765Abstract: A large size container made of laminate including a layer (A) of modified polyolefin modified with 0.005 to 1.0 wt. % unsaturated carboxylic acid and a layer (B) of a mixture of (i) 50 to 95 wt. % polyamide and (ii) 5 to 50 wt. % polyolefin modified with 0.01 to 1.0 wt. % unsaturated carboxylic acid.Type: GrantFiled: September 18, 1990Date of Patent: May 19, 1992Assignees: Tosoh Corporation, Ube Industries, Ltd., Sumitomo CorporationInventors: Jun Inada, Shinichi Sato, Ryoichi Shimizu, Akinobu Kitani, Kunio Nakano