Abstract: An electronic control device includes a substrate, a plurality of component-mounted wires disposed on the substrate, a plurality of electronic components mounted on the respective component-mounted wires, a common wire disposed on the substrate and coupled with each of the electronic components, an interrupt wire coupled between one of the component-mounted wires and the common wire, a connection wire via which the interrupt wire is coupled with one of the common wire and the one of the component-mounted wires, and a solder disposed between each of the electronic components and a corresponding one of the component-mounted wires and having a lower melting point than the interrupt wire. The interrupt wire is configured to melt in accordance with heat generated by an overcurrent so as to interrupt a coupling between the one of the component-mounted wires and the common wire.

Abstract: An electronic control device includes a substrate, component-mounted wires disposed on the substrate, electronic components mounted on the respective component-mounted wires, a common wire disposed on the substrate and coupled with each of the electronic components, and an interrupt wire coupled between one of the component-mounted wires and the common wire. The interrupt wire melts in accordance with heat generated by an overcurrent. The interrupt wire includes a first wire section and a second wire section shorter than the first wire section. The first wire section and the second wire section is coupled with each other at a predetermined angle that is determined so that one of the wire sections is coupled with the common wire and the other is coupled with the one of the component-mounted wires.

Abstract: An electronic control device includes a substrate, a plurality of component-mounted wires, a plurality of electronic components, a common wire, an interrupt wire and a protective layer. The component-mounted wires and the common wire are disposed on the substrate. The electronic components are mounted on the respective component-mounted wires and are coupled with the common wire. The interrupt wire is coupled between one component-mounted wire and the common wire, and is configured to melt in accordance with heat generated by an overcurrent to interrupt a coupling between the component-mounted wire and the common wire. The protective layer covers a surface of the substrate including the interrupt wire and defines an opening portion so that at least a portion of the interrupt wire is exposed.

Abstract: When the support member and cooling member of the thermal head are made of aluminum, and the head substrate is made of ceramic, the difference in the coefficient of thermal expansion of the two is very large, and the aluminum is expanded in use, and the gap to the adjacent head substrate is increased to cause white stripes. In the invention, the materials are properly selected so that the coefficient of thermal expansion of the support member and cooling member and the coefficient of thermal expansion of the head substrate may be close to each other, and the head substrate is adhered to the cooling plate with a soft adhesive. Therefore, if a difference is caused in the amount of expansion between the head substrate and the cooling plate during use, it is suppressed to such an extent as to be absorbed by the elastic deformation of the soft adhesive.

Abstract: The face pressure distribution shape of the graze portion of the thermal head is made to be consistent with the temperature distribution shape of the graze portion of the thermal head. The temperature distribution shape of the graze portion of the thermal head is made to be consistent with the face pressure distribution shape of the graze portion of the thermal head. The graze portion of the thermal head is formed projectingly in two steps, and the heating resistor element of the thermal head is provided on the top portion of the graze portion of the thermal head. A thermal transfer printer having no ink void and no ink transfer unevenness can be obtained.

Abstract: A thin film type thermal head includes a head substrate member, a partial projected glaze portion mounted on the head substrate member, a plurality of heating resistor elements provided on the partial projected glaze portion with each of the heating resistor elements having a uniform thin thickness and two electrode end portions. A common electrode is provided on the partial projected glaze portion and an individual control electrode is also provided on the partial projected glaze portion.

Abstract: Disclosed is a thermal head in which a plurality of heat-generating elements are arranged on a substrate on a line oblique to the scanning direction of the thermal head so that the projecting scanning region of each heat-generating element overlaps the projection scanning region of the adjacent heat-generating element over a minute space without any blank clearance between the projecting scanning regions. In this thermal head, mutual thermal influences in the heat-generating elements can be completely eliminated, and the printing quality can be improved.

Abstract: In a thermal head comprising a plurality of heat-generating elements formed on a glaze layer on a substrate, grooves extending to the midway of the glaze layer in the thickness direction of the glaze layer and having a depth of 0.3 to 30 .mu.m are formed in the surface portion of the glaze layer between every two adjacent heat-generating elements. This thermal head is improved in both the rising and falling response characteristics of the heat-generating temperature by the presence of these grooves, and sharp images having a high resolving power can be obtained.