Patents by Inventor Ryoji Shimokawa

Ryoji Shimokawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9317080
    Abstract: The local cooling unit according to an aspect of the present invention includes a housing having a cavity formed in the housing, an air inlet port which is provided in a bottom surface of the housing and which takes in exhaust heat air from the electronic device, an evaporator which is provided in the housing and which evaporates a refrigerant by heat exchange with air sucked in from the air inlet port to cool the air, the refrigerant passing through an inside of the evaporator, an air outlet port which is provided in a side surface of the housing and which exhausts the air cooled by the evaporator, and a fan which is provided on a side of the air inlet port or a side of the air outlet port of the housing and which moves the air from the air inlet port to the air outlet port.
    Type: Grant
    Filed: May 5, 2011
    Date of Patent: April 19, 2016
    Assignee: Hitachi, Ltd.
    Inventors: Teruo Mikami, Tomohiro Yoshida, Masakatsu Senda, Ryoji Shimokawa, Yasuhiro Kashirajima
  • Publication number: 20130317654
    Abstract: An air-conditioning control system is equipped with: a first client server containing a job management program that manages jobs for multiple electronic devices; a second client server that determines the required amount of cooling on the basis of the power information for the multiple electronic devices that is output from this first client server, and outputs information that controls the operation of multiple air-conditioners; an integrated management server that inputs information from the first and second client servers; and a control board that controls the operation of the air-conditioners on the basis of commands from the integrated management server. An environment optimization control program, which calculates the temperature distribution and airflow in an electronic device facility when the operation of the air-conditioners is controlled on the basis of the input power information for the electronic devices and the required amount of cooling, is installed in the integrated management server.
    Type: Application
    Filed: January 18, 2012
    Publication date: November 28, 2013
    Applicant: Hitachi, Ltd.
    Inventors: Yasuhiro Kashirajima, Junichi Ito, Ryoji Shimokawa, Masakatsu Senda
  • Publication number: 20110279976
    Abstract: The local cooling unit according to an aspect of the present invention includes a housing having a cavity formed in the housing, an air inlet port which is provided in a bottom surface of the housing and which takes in exhaust heat air from the electronic device, an evaporator which is provided in the housing and which evaporates a refrigerant by heat exchange with air sucked in from the air inlet port to cool the air, the refrigerant passing through an inside of the evaporator, an air outlet port which is provided in a side surface of the housing and which exhausts the air cooled by the evaporator, and a fan which is provided on a side of the air inlet port or a side of the air outlet port of the housing and which moves the air from the air inlet port to the air outlet port.
    Type: Application
    Filed: May 5, 2011
    Publication date: November 17, 2011
    Inventors: Teruo Mikami, Tomohiro Yoshida, Masakatsu Senda, Ryoji Shimokawa, Yasuhiro Kashirajima
  • Publication number: 20110271695
    Abstract: A cooling method for an electronic device, comprising: naturally circulating a refrigerant between: an evaporator which vaporizes the refrigerant by heat exchange with exhaust hot air from the electronic device, and cools the exhaust hot air; and one of a cooling tower and a condenser which is placed at a position higher than the evaporator, and liquefies the vaporized refrigerant; and valve-controlling a flow rate of a refrigerant liquid to be supplied to the evaporator so that an air temperature after heat has been exchanged for cooling by the evaporator becomes a temperature suited to an operating environment of the electronic device, wherein one of a condensation temperature and a condensation pressure of a refrigerant gas in one of the cooling tower and the condenser do not fluctuate even when the flow rate of the refrigerant liquid to be supplied to the evaporator is valve-controlled.
    Type: Application
    Filed: May 3, 2011
    Publication date: November 10, 2011
    Inventors: Yasuhiro KASHIRAJIMA, Junichi Ito, Yasuhiko Inadomi, Masakatsu Senda, Ryoji Shimokawa, Noboru Oshima, Takumi Sugiura
  • Publication number: 20110185758
    Abstract: A cooling system for an electronic apparatus, includes: a casing in which the electronic apparatus is housed; an evaporator which is disposed at a rear surface side of the casing, and cools heat released from the electronic apparatus by a refrigerant; a slide mechanism which connects the casing and the evaporator to be movable in a longitudinal direction with respect to the casing; at least any one of a cooling tower which is provided at a higher place than the evaporator and condenses the refrigerant by cooling of external air and sprinkled water, and a heat exchanger which cools the refrigerant by using chilled water; a circulation line which moves the refrigerant between the evaporator and at least one of the cooling tower and the heat exchanger; and a piping which connects the circulation line and the evaporator, and is extendable and contractible in response to movement of the evaporator.
    Type: Application
    Filed: February 3, 2011
    Publication date: August 4, 2011
    Inventors: Ryoji SHIMOKAWA, Masakatsu SENDA, Yasuhiro KASHIRAJIMA, Junichi ITO, A sahi NAGATAKIYA
  • Publication number: 20110127027
    Abstract: A cooling method of an electronic device, the cooling method naturally circulating a cooling medium between an evaporator, which gasifies the cooling medium and cools heat-discharging air from the electronic device by heat exchange with the heat-discharging air, and a cooling tower or a condenser, which is disposed at a higher position than the evaporator and liquefies the gasified cooling medium, and subjecting a flow rate of the cooling-medium liquid supplied to the evaporator to valve control so that a temperature of the air obtained after the heat exchange and the cooling by the evaporator becomes a temperature suitable for an operating environment of the electronic device, wherein the improvement comprises that a condensation temperature or a condensation pressure of the cooling-medium gas in the cooling tower or the condenser is configured to be not varied even when the flow rate of the cooling-medium liquid supplied to the evaporator is subjected to the valve control.
    Type: Application
    Filed: December 1, 2010
    Publication date: June 2, 2011
    Inventors: Yasuhiro KASHIRAJIMA, Junichi Ito, Yasuhiko Inadomi, Takumi Sugiura, Ryoji Shimokawa, Masakatsu Senda, Noboru Oshima