Abstract: A cured resin formation method including an applying step of applying an ultraviolet curable resin on a base; and a curing step of curing the ultraviolet curable resin by irradiating the ultraviolet curable resin applied in the applying step with ultraviolet rays, in which in the curing step, the ultraviolet curable resin is irradiated with ultraviolet rays while cooling the ultraviolet curable resin, so that a difference between an ordinary temperature of the ultraviolet curable resin and a temperature of the ultraviolet curable resin when irradiated with ultraviolet rays is within a set temperature difference set in advance.

Abstract: A circuit forming method including a first wiring forming step of forming a first metal wiring on a resin layer, and a second wiring forming step of forming a second metal wiring on the first metal wiring, in which a Young's modulus of the first metal wiring and a Young's modulus of the second metal wiring are different from each other.

Abstract: To provide a production method and a production device for a three-dimensionally fabricated object that can alleviate a limitation on a curable resin to be used, in a case where the three-dimensionally fabricated object having an electronic device is produced using an additive manufacturing method. A production method for a three-dimensionally fabricated object of the present disclosure includes a first fabricating step of fabricating the attached object including an attachment section, to which the electronic device is attachable, with a first curable resin, using an additive manufacturing method, a second fabricating step of fabricating a resin layer with a second curable resin, fabricating a conductor with a fluid containing a metal particle, and fabricating the electronic device having the conductor in the resin layer, using the additive manufacturing method, and an attaching step of attaching the electronic device to the attachment section of the attached object.

Abstract: A circuit formation method includes: a protruding portion formation step of forming a protruding portion by applying a curable viscous fluid onto a base and curing the curable viscous fluid; a wiring formation step of forming a wiring extending toward the protruding portion by applying a metal-containing liquid containing nanometer-sized metal fine particles onto a base and making the metal-containing liquid conductive; a paste application step of applying a resin paste containing micrometer-sized metal particles different from the metal-containing liquid on the protruding portion and the wiring, such that the protruding portion and the wiring are connected to each other; and a component placement step of placing a component having an electrode on the base, such that the electrode is in contact with the resin paste applied on the protruding portion.

Abstract: To provide a wiring formation method that can increase the wiring density in a case where wiring is formed on an inclined surface by three-dimensional additive manufacturing. The wiring formation method of the present disclosure includes a metal member forming step of forming multiple metal members with a first fluid containing metal particles, a resin layer forming step of forming a resin layer including an upper surface and an inclined surface inclined downward from the upper surface, and a connection wiring forming step of forming multiple connection wirings on the inclined surface and the upper surface of the resin layer with a second fluid containing metal particles, and the connection wirings being formed to individually connect the multiple connection wirings to the multiple metal members on a lower surface of the inclined surface.

Abstract: A printed substrate forming method includes: a resin layer forming step of forming a resin layer with curable resin in a specific region that is a region other than a predetermined region of a base which is composed of an insulating layer and a conductor layer, the predetermined region of which being a region on which a solder resist is formed; and a wiring forming step of forming a wiring by discharging metal-containing liquid which contains metal fine particles onto a top surface of the resin layer, and firing the metal-containing liquid.

Abstract: An image processing device that processes an image in which a wiring pattern is drawn and outputs the image as raster data in which formation content of wiring print dots is defined for each pixel, includes an input section that receives the image, a scan section that sequentially performs scanning in a scan direction at intervals of the pixel width, a calculation section that calculates an intersection-to-intersection distance in the scan direction based on positions of the intersection points, and a determination section that determines a line width of the wire in the scan direction and determine formation of dots for the determined line width for each pixel based on the intersection-to-intersection distance, the prescribed width, and a line width of an inclination wire which is the line width, in the scan direction, of a wire inclined according to the prescribed angle.

Abstract: Disclosed is a method of manufacturing a three-dimensional multi-layer electronic device, the method including: a unit forming process of forming a multi-layer unit including an electronic component and a circuit wiring by three-dimensional lay-out forming; and a unit lay-out process of manufacturing a three-dimensional multi-layer electronic device by laying out and integrating the multi-layer unit in a vertical direction.

Abstract: A cured resin formation method including an applying step of applying an ultraviolet curable resin on a base; and a curing step of curing the ultraviolet curable resin by irradiating the ultraviolet curable resin applied in the applying step with ultraviolet rays, in which in the curing step, the ultraviolet curable resin is irradiated with ultraviolet rays while cooling the ultraviolet curable resin, so that a difference between an ordinary temperature of the ultraviolet curable resin and a temperature of the ultraviolet curable resin when irradiated with ultraviolet rays is within a set temperature difference set in advance.

Abstract: In a case where a circuit wiring is formed on a resin member by three-dimensional additive manufacturing, a method for manufacturing the circuit wiring by three-dimensional additive manufacturing capable of suppressing swelling or cracking of the circuit wiring is provided. A method for manufacturing a circuit wiring by three-dimensional additive manufacturing includes a discharging step of discharging a fluid containing a metal particle onto a resin member formed of a resin material; and a circuit wiring forming step of forming a circuit wiring by heating the fluid containing the metal particle discharged onto the resin member at a heating temperature to be cured, and the heating being performed at the heating temperature based on a glass transition point of the resin material, a linear expansion coefficient of the resin material, and a room temperature.

Abstract: To provide an electronic circuit production method using 3D layer shaping capable of producing an electronic circuit having improved electrical properties and mechanical properties by utilizing characteristics of a fluid containing a metal particle by selectively using the fluid containing the metal particle. The electronic circuit production method using 3D layer shaping, the method including a wiring forming step of forming a wiring by applying a fluid containing a nano-sized metal nanoparticle on an insulating member and curing the applied fluid containing the metal nanoparticle; and a connection terminal forming step of forming a connection terminal electrically connected to the wiring by applying a fluid containing a micro-sized metal microparticle and curing the applied fluid containing the metal microparticle.

Abstract: In a method for manufacturing a stack component in which an interposer is interposed to form a space for inserting an interlayer connection pin between circuit layers to be stacked, the method includes a printing step of simultaneously printing and forming the circuit layer and the interposer side by side in a planar manner by a 3D printer, a step of mounting a circuit element on the circuit layer, a step of mounting the interposer on the circuit layer, a step of inserting the interlayer connection pin into the interposer mounted on the circuit layer, and a step of electrically connecting the circuit layer and another circuit layer by the interlayer connection pin by stacking the other circuit layer on the circuit layer via the interposer.

Abstract: A three-dimensional molding machine for manufacturing a three-dimensional molded object comprising an electronic circuit includes multiple modules disposed adjacent to each other, a work unit provided in each of the multiple modules and configured to share a manufacturing operation for manufacturing the three-dimensional molded object on a pallet, and a pallet conveyance section provided in each of the multiple modules and configured to convey the pallet into and out of a module and to transfer the pallet between the module and another adjacent module of the multiple modules.

Abstract: In multilayer circuit substrate wiring patterns and reference marks are formed on an upper surface of each insulating layer in a predetermined positional relationship, and the reference marks on the insulating layers are formed at overlapping positions when viewed from above. Furthermore, the reference mark on each layer is formed by changing a size or a shape such that from a specific edge portion recognized when center coordinates of the reference mark is detected by image processing a specific edge portion of the reference mark on a lower layer of the specific edge portion does not protrude considering a positional deviation at the time of manufacturing. The multiple insulating layers are formed of an insulating material having light transparency or an insulating material designed to be extremely thin so that a lower layer can be seen through even if the light transparency is poor.

Abstract: A shaping method includes a first ejection step of ejecting a first curable viscous fluid, a planarization step of planarizing the first curable viscous fluid, a first curing step of curing the first curable viscous fluid, a cured layer forming step of repeatedly executing the first ejection step, the planarization step, and the first curing step to form a cured layer, a second ejection step of ejecting a second curable viscous fluid onto a surface of the cured layer, a second curing step of forming a smooth surface on the surface of the cured layer by curing the second curable viscous fluid, a third ejection step of ejecting a fluid containing metal particles onto the smooth surface, and a third curing step of curing the fluid containing the metal particles ejected in the third ejection step to form a metallic conductor on the smooth surface.

Abstract: A circuit formation method includes: a protruding portion formation step of forming a protruding portion by applying a curable viscous fluid onto a base and curing the curable viscous fluid; a wiring formation step of forming a wiring extending toward the protruding portion by applying a metal-containing liquid containing nanometer-sized metal fine particles onto a base and making the metal-containing liquid conductive; a paste application step of applying a resin paste containing micrometer-sized metal particles different from the metal-containing liquid on the protruding portion and the wiring, such that the protruding portion and the wiring are connected to each other; and a component placement step of placing a component having an electrode on the base, such that the electrode is in contact with the resin paste applied on the protruding portion.

Abstract: A circuit formation method includes a wiring formation step of forming a wiring by applying a metal-containing liquid containing nanometer-sized metal fine particles onto a base and firing the metal-containing liquid, a paste application step of applying a resin paste containing micrometer-sized metal particles to be connected to the wiring formed in the wiring formation step, and a component placement step of placing a component having an electrode on the base, such that the electrode is in contact with the resin paste applied in the paste application step.

Abstract: A printed substrate forming method includes: a resin layer forming step of forming a resin layer with curable resin in a specific region that is a region other than a predetermined region of a base which is composed of an insulating layer and a conductor layer, the predetermined region of which being a region on which a solder resist is formed; and a wiring forming step of forming a wiring by discharging metal-containing liquid which contains metal fine particles onto a top surface of the resin layer, and firing the metal-containing liquid.

Abstract: Disclosed is a method of manufacturing a three-dimensional multi-layer electronic device, the method including: a unit forming process of forming a multi-layer unit including an electronic component and a circuit wiring by three-dimensional lay-out forming; and a unit lay-out process of manufacturing a three-dimensional multi-layer electronic device by laying out and integrating the multi-layer unit in a vertical direction.

Abstract: A wiring board with a cavity for a built-in electronic component includes a conductor layer including a conductor circuit layer and a plane layer, and an insulating layer laminated on the conductor layer and having a cavity such that the cavity is forming an exposed portion of the plane layer and formed to mount a built-in electronic component on the exposed portion of the plane layer. The plane layer has a recess structure formed in an outer peripheral portion in the exposed portion of the plane layer.