Patents by Inventor Ryosuke IEKI

Ryosuke IEKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240124314
    Abstract: Provided is a particle-immobilized substrate that can be easily produced and has inorganic nanoparticles present in a nanometer-scale region. Also provided is a method for easily producing a substrate in which nanoparticles are arranged in a nanometer-scale region on a solid surface. A particle-immobilized substrate 1 includes a substrate 2 and a plurality of inorganic nanoparticles 3 disposed on the substrate 2, in which the plurality of inorganic nanoparticles 3 is disposed in contact with each other in a region having a width (D1) of 1 ?m or less on the substrate 2.
    Type: Application
    Filed: February 14, 2022
    Publication date: April 18, 2024
    Applicant: DAICEL CORPORATION
    Inventors: Taro YOSHIKAWA, Ming LIU, Ryouta KOJIMA, Ryosuke IEKI, Hiroto MIYAKE
  • Publication number: 20230129711
    Abstract: The present disclosure provides a laminate having low air permeability and excellent moisture permeability, a partition member for total heat exchange element composed of the laminate, a total heat exchange element provided with a plurality of the partition members for total heat exchange element, and a ventilation device provided with the total heat exchange element. The laminate of the present disclosure is provided with a porous substrate and a moisture-permeable membrane disposed on one side of the porous substrate, the moisture-permeable membrane being provided with a porous substrate and a moisture-permeable membrane disposed on at least one side of the porous substrate, and the moisture-permeable membrane being formed of a thermoplastic copolymer having a side chain containing a hydrophilic group which is a functional group.
    Type: Application
    Filed: March 23, 2021
    Publication date: April 27, 2023
    Applicants: DAICEL CORPORATION, DAIKIN INDUSTRIES, LTD.
    Inventors: Naotaka NISHIO, Shinji MAETANI, Takahiro SAKAKIBARA, Ryosuke IEKI, Takema NAKAZAWA, Masaya KASAI, Takahisa SUEOKA
  • Patent number: 11479637
    Abstract: Provided is a sheet-like prepreg that has both a low coefficient of linear thermal expansion and high flexibility and offers excellent anti-warpage performance and cracking resistance. The sheet-like prepreg according to the present invention includes a curable composition and a sheet-like porous support impregnated with the curable composition. The sheet-like porous support is made from a material having a coefficient of linear thermal expansion of 10 ppm/K or less. The sheet-like prepreg gives a cured product having a glass transition temperature of ?60° C. to 100° C. The curable composition includes one or more curable compounds (A) and at least one of a curing agent (B) and a curing catalyst (C). The curable compounds (A) include an epoxide having a weight per epoxy equivalent of 140 to 3000 g/eq in an amount of 50 weight percent or more of the totality of the curable compounds (A).
    Type: Grant
    Filed: October 3, 2017
    Date of Patent: October 25, 2022
    Assignee: DAICEL CORPORATION
    Inventors: Hiroto Miyake, Kiyoharu Tsutsumi, Ryosuke Ieki
  • Publication number: 20200055979
    Abstract: Provided is a sheet-like prepreg that has both a low coefficient of linear thermal expansion and high flexibility and offers excellent anti-warpage performance and cracking resistance. The sheet-like prepreg according to the present invention includes a curable composition and a sheet-like porous support impregnated with the curable composition. The sheet-like porous support is made from a material having a coefficient of linear thermal expansion of 10 ppm/K or less. The sheet-like prepreg gives a cured product having a glass transition temperature of ?60° C. to 100° C. The curable composition includes one or more curable compounds (A) and at least one of a curing agent (B) and a curing catalyst (C). The curable compounds (A) include an epoxide having a weight per epoxy equivalent of 140 to 3000 g/eq in an amount of 50 weight percent or more of the totality of the curable compounds (A).
    Type: Application
    Filed: October 3, 2017
    Publication date: February 20, 2020
    Applicant: DAICEL CORPORATION
    Inventors: Hiroto MIYAKE, Kiyoharu TSUTSUMI, Ryosuke IEKI