Abstract: Disclosed is a machine tool including: a cover that encloses a processing space in which a workpiece is processed and has a window portion for visual inspection of the processing space from outside; a machining processing unit provided in the processing space; an operation panel for inputting instructions to the machining processing unit, the operation panel being provided outside of the cover; and a cooling system for cooling the machining processing unit, wherein the cooling system includes: a coolant supply unit for supplying a coolant into the processing space; a coolant protection unit that operates to limit adhesion of the coolant to the window portion; and a control unit that switches a state of the coolant protection unit based on a result of detection performed by a sensor for detecting an operator present around the cover. With this machine tool, waste of energy can be suppressed.

Abstract: A fan motor control device configured to control driving of a fan motor for cooling a CPU includes: a rotational speed sensor configured to detect a rotational speed of the fan motor; and an abnormality decision control unit configured to execute an abnormality decision mode of repeatedly switching between on and off of power supply to the fan motor during an operation of the CPU, and determine abnormality of the fan motor based on the rotational speed of the fan motor during the execution of the abnormality decision mode.

Abstract: An external device includes: an arrangement unit for arranging an operation terminal in which at least a part of a display area of the operation terminal is covered; an arrangement detector for detecting that an operation terminal is arranged on the arrangement unit; an external communicator for transmitting, to the operation terminal, a pairing request signal for wireless communication; and a pairing command input unit provided in an area covering a display area of a touch panel and for receiving input of a command that instructs execution of pairing with the operation terminal, wherein the external communicator is configured to transmit the pairing request signal when the arrangement detector detects that an operation terminal is arranged on the arrangement unit, and pairing with the operation terminal is executed when the command is input and an input operation to a predetermined area of a touch panel is detected.

Abstract: A synthetic resin molded article includes an electric element part extending in a distal direction and a primary molded part. The primary molded part has an element covering portion and a body portion. The element covering portion has a distal end surface exposed in the distal direction and a first side surface extending in a proximal direction opposite to the distal direction. The element covering portion covers a proximal portion of the electric element portion, and a distal end portion of the electric element portion projects from the distal end surface in the distal direction. The body portion has an intermediate surface exposed in the distal direction and a second side surface extending in the proximal direction. The body portion is disposed on a side of the element covering portion in the distal direction and is integrally connected to the element covering portion.

Abstract: A resin molded article includes an insert component and a synthetic resin member sealing the insert component. The insert component is provided by a primary molded product of a thermosetting resin, or a metal component, and has a functional group. The synthetic resin member is provided by a synthetic resin including a base polymer of a thermoplastic resin and a bonding component bonding with the functional group included in the insert component. The synthetic resin member has a sea structure formed of a continuous phase including the base polymer, and at least a part of the bonding component is present as a dispersed component in the sea structure. The dispersed component bonds with the functional group included in the insert component.

Abstract: A semiconductor device includes: a primary molded body includes a semiconductor chip that has a detector for detecting a physical quantity, and a primary molded resin having a resin material; a housing component includes an insertion hole for inserting the primary molded body; and a secondary molded resin, which is made of a resin material, that integrally covers a region exposed from the insertion hole, the region being a part of a surface of the primary molded body, and a part of a region of a surface of the housing component including a region surrounding the insertion hole. A part of the primary molded body including the semiconductor chip is in the insertion hole.

Abstract: A part of the sealed surface of the thermosetting resin member is a non-roughened surface that is not subjected to a roughening treatment. The other part of the sealed surface is a roughened surface recessed from the non-roughened surface to form a step and more roughened than the non-roughened surface. The thermoplastic resin member includes an additive added thereto, and the additive contains a functional group. A functional group existing in the roughened surface and the functional group existing in the additive are chemically bonded together. The roughened surface has a closed-circular shape that is formed over an entire circumference of the sealed surface around an axis parallel to the first direction. The three or more roughened surfaces each having a closed-circular shape on the sealed surface are arranged along the first direction with the non-roughened surface interposed as a distance between each adjacent two of the roughened surfaces.

Abstract: A surface boundary is formed between a sealed surface of a thermosetting resin member and a thermoplastic resin member to seal the sealed surface. A newly formed surface is formed at the surface boundary by removing a surface layer in the sealed surface. A functional group in the newly formed surface is chemically bound to a functional group in a functional group-containing additive added to a constituent material of the thermoplastic resin member.

Abstract: A plurality of micro-recess portions, which are recess portions each having a depth in a micron order, are provided on a metal surface. In addition, a plurality of nano-asperities, each of which is a recess and a protrusion having a height or a depth in a submicron order or a nano order, are formed on the metal surface. The micro-recess portions have a lower number of the nano-asperities than in a flat portion, which is a section of the metal surface that is different from the section where the micro-recess portions are provided.

Abstract: A synthetic resin molded article includes an electric element part extending in a distal direction and a primary molded part. The primary molded part has an element covering portion and a body portion. The element covering portion has a distal end surface exposed in the distal direction and a first side surface extending in a proximal direction opposite to the distal direction. The element covering portion covers a proximal portion of the electric element portion, and a distal end portion of the electric element portion projects from the distal end surface in the distal direction. The body portion has an intermediate surface exposed in the distal direction and a second side surface extending in the proximal direction. The body portion is disposed on a side of the element covering portion in the distal direction and is integrally connected to the element covering portion.

Abstract: An external device includes: an arrangement unit for arranging an operation terminal in which at least a part of a display area of the operation terminal is covered; an arrangement detector for detecting that an operation terminal is arranged on the arrangement unit; an external communicator for transmitting, to the operation terminal, a pairing request signal for wireless communication; and a pairing command input unit provided in an area covering a display area of a touch panel and for receiving input of a command that instructs execution of pairing with the operation terminal, wherein the external communicator is configured to transmit the pairing request signal when the arrangement detector detects that an operation terminal is arranged on the arrangement unit, and pairing with the operation terminal is executed when the command is input and an input operation to a predetermined area of a touch panel is detected.

Abstract: In a method for producing a resin molded body, a thermosetting resin member is formed by heating a thermosetting resin material that is a raw material of the thermosetting resin member to complete a curing. A nascent surface having a functional group is formed on at least a part of a sealed surface of the thermosetting resin member by removing a surface layer that is an outermost layer of the sealed surface via irradiation of laser light to the sealed surface. The sealed surface of the thermosetting resin member is sealed with the thermoplastic resin member by injecting a thermoplastic resin material to the thermosetting resin member having the nascent surface, the functional group of the nascent surface being chemically bonded to the functional group of the additive. The thermosetting resin member has an absorption of the laser light at or above 10% per 1 ?m.

Abstract: A machine operation panel according to an embodiment is a machine operation panel connected to a control device of a machine and configured to operate the control device. The machine operation panel includes: an operation terminal that includes a touch panel for display and input of information and is configured to be portable; and an external device that includes an emergency stop button, an enable switch, and an input device configured to input data to the operation terminal, and is connected to the operation terminal. The operation terminal is attached to the external device such that at least a part of a display region of the touch panel is covered, and at least a part of the input device is provided in a region overlapping the display region.

Abstract: A part of the sealed surface of the thermosetting resin member is a non-roughened surface that is not subjected to a roughening treatment. The other part of the sealed surface is a roughened surface recessed from the non-roughened surface to form a step and more roughened than the non-roughened surface. The thermoplastic resin member includes an additive added thereto, and the additive contains a functional group. A functional group existing in the roughened surface and the functional group existing in the additive are chemically bonded together. The roughened surface has a closed-circular shape that is formed over an entire circumference of the sealed surface around an axis parallel to the first direction. The three or more roughened surfaces each having a closed-circular shape on the sealed surface are arranged along the first direction with the non-roughened surface interposed as a distance between each adjacent two of the roughened surfaces.

Abstract: A resin molded article includes a thermosetting resin member and a thermoplastic resin member sealing a sealed surface of the thermosetting resin member. An exposed surface of the thermosetting resin member is exposed to an outside of the thermoplastic resin member. An additive having a functional group is added to the thermoplastic resin member. The thermosetting resin member has a surface layer on at least a part of the sealed surface, and the surface layer is made of a thermosetting resin higher in concentration of a carboxyl group or concentration of a phenol group than the underlying thermosetting resin. The carboxyl group or the phenol group present in the surface layer is chemically bonded to the functional group present in the additive.

Abstract: A fan motor control device configured to control driving of a fan motor for cooling a CPU includes: a rotational speed sensor configured to detect a rotational speed of the fan motor; and an abnormality decision control unit configured to execute an abnormality decision mode of repeatedly switching between on and off of power supply to the fan motor during an operation of the CPU, and determine abnormality of the fan motor based on the rotational speed of the fan motor during the execution of the abnormality decision mode.

Abstract: An electronic device includes a first molded product integrated with an electronic component, and a second molded product secondarily molded outside of the first molded product. The first molded product includes a thermosetting resin, and a first additive contained in the thermosetting resin, and the second molded product includes a thermoplastic resin, and a second additive contained in the thermoplastic resin and having a reactive group that chemically bonds with the first additive. At an interface between the first molded product and the second molded product, the first additive and the second additive are joined to each other by one or more joint actions selected from covalent bonding, ionic bonding, hydrogen bonding, intermolecular forces, dispersion force, and diffusion. As a result, the adhesion between both the molded products can be firmly secured through the molding technique such as the transfer molding method or the compression molding method.

Abstract: A resin molded article includes an insert component and a synthetic resin member sealing the insert component. The insert component is provided by a primary molded product of a thermosetting resin, or a metal component, and has a functional group. The synthetic resin member is provided by a synthetic resin including a base polymer of a thermoplastic resin and a bonding component bonding with the functional group included in the insert component. The synthetic resin member has a sea structure formed of a continuous phase including the base polymer, and at least a part of the bonding component is present as a dispersed component in the sea structure. The dispersed component bonds with the functional group included in the insert component.

Abstract: A surface boundary is formed between a sealed surface of a thermosetting resin member and a thermoplastic resin member to seal the sealed surface. A newly formed surface is formed at the surface boundary by removing a surface layer in the sealed surface. A functional group in the newly formed surface is chemically bound to a functional group in a functional group-containing additive added to a constituent material of the thermoplastic resin member.

Abstract: An electronic device includes a first molded product integrated with an electronic component, and a second molded product secondarily molded outside of the first molded product. The first molded product includes a thermosetting resin, and a first additive contained in the thermosetting resin, and the second molded product includes a thermoplastic resin, and a second additive contained in the thermoplastic resin and having a reactive group that chemically bonds with the first additive. At an interface between the first molded product and the second molded product, the first additive and the second additive are joined to each other by one or more joint actions selected from covalent bonding, ionic bonding, hydrogen bonding, intermolecular forces, dispersion force, and diffusion. As a result, the adhesion between both the molded products can be firmly secured through the molding technique such as the transfer molding method or the compression molding method.